Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1999
10/23/1999CA2269016A1 Heat exchanger, especially for high gain electronic component, and manufacturing method of same
10/21/1999WO1999053545A1 Film used as a substrate for integrated circuits
10/21/1999WO1999053543A1 Semiconductor component
10/21/1999WO1999053542A1 Method for forming a multi-layered aluminum-comprising structure on a substrate
10/21/1999WO1999053256A1 Plate type heat pipe and its installation structure
10/21/1999WO1999053254A1 Plate type heat pipe and its mounting structure
10/21/1999WO1999034657A3 Hybrid circuit with a heat dissipation system
10/21/1999DE19915050A1 Smart card manufacturing method
10/21/1999DE19818839A1 Cooler for electric components in form of heat pipe
10/21/1999DE19817359A1 Ceramic multi-layer circuit manufacturing method
10/21/1999DE19816245A1 Contacting electric component at its rear side
10/20/1999EP0951070A1 Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
10/20/1999EP0951068A1 Method of fabrication of a microstructure having an inside cavity
10/20/1999EP0951067A1 Integrated circuit with etch stop layer and method of fabrication
10/20/1999EP0951066A1 Method of manufacturing semiconductor device
10/20/1999EP0951064A1 Manufacture of semiconductor device
10/20/1999EP0951062A2 Electronic part and manufacturing method therefor
10/20/1999EP0950263A1 A high power prematched mmic transistor with improved ground potential continuity
10/20/1999EP0950262A1 A via structure
10/20/1999EP0950261A1 Semiconductor with metal coating on its rear surface
10/20/1999EP0950260A1 Standardized bonding location process and apparatus
10/20/1999EP0950259A1 Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
10/20/1999EP0805727A4 Improved metal matrix composite
10/20/1999EP0785557B1 Composite magnetic material and product for eliminating electromagnetic interference
10/20/1999CN2344875Y Heat pipe radiator for power semiconductor device
10/20/1999CN1232293A Structure and method for mounting electronic part
10/20/1999CN1232292A Miniaturized contact in semiconductor substrate and method for forming the same
10/20/1999CN1232291A Copper interconnect structure and method of formation
10/20/1999CN1045865C Fastening base board
10/19/1999US5970372 Method of forming multilayer amorphous silicon antifuse
10/19/1999US5970346 Moisture barrier
10/19/1999US5970334 Method of manufacturing contacts to diverse doped regions using intermediate layer of arsenic or phosphorus
10/19/1999US5970322 Ultrahigh-frequency electronic component and method of manufacturing the same
10/19/1999US5970321 Method of fabricating a microelectronic package having polymer ESD protection
10/19/1999US5970320 Process of resin sealing a semiconductor device and lead frame
10/19/1999US5970319 Method for assembling an integrated circuit chip package having at least one semiconductor device
10/19/1999US5970313 Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer
10/19/1999US5970311 Method and structure for optimizing the performance of a semiconductor device having dense transistors
10/19/1999US5970238 Method and apparatus for generating planarizing pattern and semiconductor integrated circuit device
10/19/1999US5969950 Enhanced heat sink attachment
10/19/1999US5969949 Interfitting heat sink and heat spreader slug
10/19/1999US5969947 Integral design features for heatsink attach for electronic packages
10/19/1999US5969945 Electronic package assembly
10/19/1999US5969927 Integrated overload protective device
10/19/1999US5969782 Active matrix liquid crystal display having interdigitated pixel and first counter electrodes in the same plane and a second counter connected to the first counter electrode via a contact hole in a insulating layer
10/19/1999US5969538 Semiconductor wafer with interconnect between dies for testing and a process of testing
10/19/1999US5969461 Surface acoustic wave device package and method
10/19/1999US5969428 Alignment mark, manufacturing method thereof, exposing method using the alignment mark, semiconductor device manufactured using the exposing method
10/19/1999US5969427 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
10/19/1999US5969426 Substrateless resin encapsulated semiconductor device
10/19/1999US5969425 Borderless vias with CVD barrier layer
10/19/1999US5969424 Semiconductor device with pad structure
10/19/1999US5969422 Plated copper interconnect structure
10/19/1999US5969421 Integrated circuit conductors that avoid current crowding
10/19/1999US5969420 Semiconductor device comprising a plurality of interconnection patterns
10/19/1999US5969419 Structure comprising platinum layer bound to a surface of a silicon oxide layer
10/19/1999US5969418 Method of attaching a chip to a flexible substrate
10/19/1999US5969417 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners
10/19/1999US5969416 Ball grid array semiconductor package
10/19/1999US5969414 Semiconductor package with molded plastic body
10/19/1999US5969413 Aluminum nitride
10/19/1999US5969412 Prevents ion migration of metal contained in leads with a simple configuration.
10/19/1999US5969411 Lead frame with increased strength and manufacture of semiconductor device
10/19/1999US5969410 Semiconductor IC device having chip support element and electrodes on the same surface
10/19/1999US5969409 Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein
10/19/1999US5969408 Process for forming a morphological edge structure to seal integrated electronic devices, and corresponding device
10/19/1999US5969404 Silicide agglomeration device
10/19/1999US5969390 Layout solution for electromagnetic interference reduction
10/19/1999US5969381 Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof
10/19/1999US5969293 Method and apparatus for doubling back single gauge lead frame
10/19/1999US5968858 Potassium boron silicate glass in organic vehicle wherein glass follows specific stoichiometry according to ternary compositional diagram
10/19/1999US5968840 Dynamic random access memory using silicon-on-insulator techniques
10/19/1999US5968687 Mask pattern and recovering alignment marks
10/19/1999US5968670 Enhanced ceramic ball grid array using in-situ solder stretch with spring
10/19/1999US5968606 Screen printable UV curable conductive material composition
10/19/1999US5968441 Ablating a transparent material, laser beam absorption layer
10/19/1999US5968389 Method and machine for hybridization by refusion
10/19/1999US5967848 Apparatus for providing controlled impedance in an electrical contact
10/19/1999US5967804 Circuit member and electric circuit device with the connecting member
10/19/1999US5966957 Cooling system for electronics
10/19/1999US5966941 Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms
10/19/1999US5966940 Semiconductor thermal conditioning apparatus and method
10/19/1999US5966803 Ball grid array having no through holes or via interconnections
10/14/1999WO1999052339A1 Cooling device of multispindle servo-amplifier
10/14/1999WO1999052209A1 Surface acoustic wave device package and method
10/14/1999WO1999052149A1 Use of the constructional characteristics of an electronic component as a reference for positioning the component
10/14/1999WO1999052148A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/14/1999WO1999052147A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999WO1999052129A2 Resistive interconnect of transistor cells
10/14/1999DE19915745A1 Assembly structure of electronic parts prevents the formation of cracks in adhesive substrate
10/14/1999DE19816066A1 Folie als Träger von integrierten Schaltungen Film as a substrate of integrated circuits
10/14/1999DE19815906A1 Encapsulated power semiconductor device
10/14/1999DE19811578A1 Multiple layer circuit board especially for chip card
10/14/1999CA2327331A1 Wire bond attachment of a integrated circuit package to a heat sink
10/14/1999CA2327330A1 Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
10/13/1999EP0949678A1 Method for manufacturing an electric circuit for a contactless radiofrequency label, and electric circuit for such label
10/13/1999EP0949677A1 Semiconductor device and method of manufacturing the same
10/13/1999EP0949676A1 Semiconductor device and method of manufacturing the same
10/13/1999EP0949675A2 Heat-resistant solid-state pickup device and manufacturing method thereof
10/13/1999EP0949673A2 Damascene structure comprising surrounding liner
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