Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1999
11/02/1999US5976912 Fabrication process of semiconductor package and semiconductor package
11/02/1999US5976911 Controlling impedances of an integrated circuit
11/02/1999US5976910 Heating solder and resin simultaneously; solder melting to connect pad and connecting structure; resin setting to couple first and second substrate
11/02/1999US5976909 Method of forming diamond heat sink comprising synthetic diamond film
11/02/1999US5976899 Reduced terminal testing system
11/02/1999US5976710 High density semiconductors; low thermal coefficient of expansion
11/02/1999US5976703 Material and method for planarization of substrate
11/02/1999US5976641 Intermetallic target
11/02/1999US5976628 Copper powder in binder
11/02/1999US5976626 Semiconductor device and method of manufacturing thereof
11/02/1999US5975922 Device containing directionally conductive composite medium
11/02/1999US5975915 Socket for inspection of semiconductor device
11/02/1999US5975402 Stacking and soldering apparatus for three dimensional stack package devices
11/02/1999US5975201 Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
11/02/1999US5975194 Fan assisted heat sink device
11/02/1999US5975114 System, method and apparatus for purging fluid
11/02/1999US5974662 Method of planarizing tips of probe elements of a probe card assembly
11/02/1999CA2097097C Heat sink mounting system for semiconductor devices
10/1999
10/28/1999WO1999054935A1 Portable communication equipment
10/28/1999WO1999054934A1 Ultra high-speed chip interconnect using free-space dielectrics
10/28/1999WO1999054933A1 Semiconductor non-laminate package and method
10/28/1999WO1999054932A1 Leadless array package
10/28/1999WO1999054372A1 Adhesive and encapsulating material with fluxing properties
10/28/1999DE19918580A1 Epoxy resin composition, useful for encapsulation of semiconductor devices
10/28/1999DE19834800C1 Heavy duty semiconductor switch
10/28/1999DE19758569A1 Kunststoffmassen zur Umhüllung eines Metall- oder Halbleiterkörpers Plastic materials for packaging of a metal or semiconductor body
10/27/1999EP0952613A1 A multiple device integrated circuit package having feed-through connections
10/27/1999EP0952612A1 Heat exchanger, in particular for cooling an electronic power component, and its method for fabrication
10/27/1999EP0952611A2 Semiconductor device
10/27/1999EP0952610A2 Microelectronic device package containing a liquid and method
10/27/1999EP0952545A1 Ic card
10/27/1999EP0952156A2 Aluminium complex derivatives for chemical vacuum evaporation and the method of producing the same
10/27/1999EP0951808A1 A combined electrical and optical edge contact for compact connection of a part to another part, a use thereof and a method of manufacturing such an interconnection
10/27/1999EP0951739A1 High density electrical connectors
10/27/1999EP0951692A1 Carrier element for a semiconductor chip for installing in chip cards
10/27/1999EP0951640A1 Housing for semiconductor sensor arrangement and process for producing the same
10/27/1999EP0644914B1 Inorganic fillers and organic matrix materials whose refractive index is adapted
10/27/1999CN1233243A Crystalline form of 4-[5-methyl-3-phenylisoxazol)-4-yl] benzenesulfonamide
10/27/1999CN1233076A Interconnection in integrated circuit devices
10/27/1999CN1233073A Semiconductor device and manufacturing method of same
10/26/1999USRE36356 Electronic component support for memory card and product obtained thereby
10/26/1999US5973953 Semiconductor memory device having improved bit line structure
10/26/1999US5973952 Embedded DRAM with noise protecting shielding conductor
10/26/1999US5973935 Interdigitated leads-over-chip lead frame for supporting an integrated circuit die
10/26/1999US5973931 Printed wiring board and electronic device using same
10/26/1999US5973930 Mounting structure for one or more semiconductor devices
10/26/1999US5973928 Multi-layer ceramic substrate decoupling
10/26/1999US5973927 Mounting structure for an integrated circuit
10/26/1999US5973921 Fixation structure for the fan of the CPU heat dissipating device
10/26/1999US5973910 Decoupling capacitor in an integrated circuit
10/26/1999US5973908 Interconnect metallization as the lower capacitor plate, less brittle soft portion between hard portions of amorphous hydrogenated carbon as the capacitor dielectric material, and electrical conductors as upper capacitor plate; good adhesion
10/26/1999US5973567 Tunable impedance matching network for a mic power amplifier module
10/26/1999US5973554 Semiconductor device structured to be less susceptible to power supply noise
10/26/1999US5973528 Control circuit and method for a temperature sensitive device
10/26/1999US5973408 Electrode structure for a semiconductor device
10/26/1999US5973407 Integral heat spreader for semiconductor package
10/26/1999US5973403 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/26/1999US5973401 Semiconductor device enabling temperature control in the chip thereof
10/26/1999US5973400 Used for micorprocessing and have high capability
10/26/1999US5973398 Improved heat transfer characteristics and long term operational reliability
10/26/1999US5973397 Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density
10/26/1999US5973396 Surface mount IC using silicon vias in an area array format or same size as die array
10/26/1999US5973395 IC package having a single wiring sheet with a lead pattern disposed thereon
10/26/1999US5973394 Small contactor for test probes, chip packaging and the like
10/26/1999US5973393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
10/26/1999US5973391 Interposer with embedded circuitry and method for using the same to package microelectronic units
10/26/1999US5973390 Chip electronic part
10/26/1999US5973389 Semiconductor chip carrier assembly
10/26/1999US5973388 Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe
10/26/1999US5973385 Annealing of wafer coated with silicon dioxide and borophosphosilicate glass layers before patterning, suppreses the pattern distortion by densification of undoped silicon dioxide
10/26/1999US5973376 Architecture having diamond shaped or parallelogram shaped cells
10/26/1999US5973371 Semiconductor device with marginless contact hole
10/26/1999US5973348 Semiconductor device and method for manufacturing the same
10/26/1999US5973342 Semiconductor device having an iridium electrode
10/26/1999US5973340 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
10/26/1999US5973337 Ball grid device with optically transmissive coating
10/26/1999US5973263 Encapsulated electronic component and method for encapsulating an electronic component
10/26/1999US5973261 Heat exchanger for electronic components and electrotechnical equipment
10/26/1999US5973052 Process for attaching semiconductor device to substrate
10/26/1999US5972803 Depositing liner on semiconductor layer of substrate; depositing dielectric material over liner; rapidly curing dielectric layer using rapid thermal processing equipment comprising heating lamp
10/26/1999US5972800 Method for fabricating a semiconductor device with multi-level structured insulator
10/26/1999US5972798 Prevention of die loss to chemical mechanical polishing
10/26/1999US5972793 Photolithography alignment mark manufacturing process in tungsten CMP metallization
10/26/1999US5972788 Method of making flexible interconnections with dual-metal-dual-stud structure
10/26/1999US5972787 CMP process using indicator areas to determine endpoint
10/26/1999US5972786 Coating contact hole with titanium in dielectric layer to resist electron migration of aluminum atoms, coating with titanium nitride layer; heating; depositing aluminum alloy in contact hole; etching aluminum alloy; forming circuit
10/26/1999US5972774 Process for fabricating a semiconductor device having contact hole open to impurity region coplanar with buried isolating region
10/26/1999US5972759 Method of making an integrated butt contact having a protective spacer
10/26/1999US5972756 Method of fabricating semiconductor device with a fuse portion
10/26/1999US5972740 Layout algorithm for generating power supply interconnections for an LSI circuit
10/26/1999US5972739 Method of manufacturing a tab semiconductor device
10/26/1999US5972738 PBGA stiffener package
10/26/1999US5972737 Heat-dissipating package for microcircuit devices and process for manufacture
10/26/1999US5972736 Integrated circuit package and method
10/26/1999US5972735 Semiconductor package having integrated circuit chip connected to substrate using wire-bonding is prepared by curing die attach adhesive and encapsulating wire bonds in one heating step
10/26/1999US5972734 Interposer for ball grid array (BGA) package
10/26/1999US5972724 Process for reducing the surface recombination speed in silicon
10/26/1999US5972723 Enhanced thin film wiring net repair process
10/26/1999US5972145 Removable passivating polyimide coating and methods of use
10/26/1999US5971253 Microelectronic component mounting with deformable shell terminals
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