Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1999
11/10/1999EP0955675A2 Epoxy resin compositions and semiconductor devices encapsulated therewith
11/10/1999EP0955672A2 Interconnect structures for integrated circuits
11/10/1999EP0955279A1 Aluminum-nitride sintered body, method for fabricating the same, and semiconductor substrate comprising the same
11/10/1999EP0954879A1 Electronic component
11/10/1999EP0954878A1 Improved leadframe structure and process for packaging integrated circuits
11/10/1999EP0954733A1 Apparatus and method for spray-cooling an electronic module
11/10/1999EP0954425A1 Method for transfer molding standard electronic packages and apparatus formed thereby
11/10/1999CN2348491Y Heat-sinking block for axial diode
11/10/1999CN1234909A Semiconductor device and process for manufacturing same
11/10/1999CN1234908A Process for mfg. of semiconductor wafer, semiconductor chip and IC card
11/10/1999CN1234612A Substrate-triggering type electrostatic discharge protective semiconductor and method thereof
11/10/1999CN1234610A Multiple device integrated circuit package having feed-through connections
11/10/1999CN1234606A High-productivity Al, Cu thin-film spattering technology for producing small contact through-hole for BEOL wiring
11/09/1999US5983089 Slotline-mounted flip chip
11/09/1999US5982632 Short power signal path integrated circuit package
11/09/1999US5982631 X-ray detectable encapsulation material and method for its use
11/09/1999US5982629 Silicon semiconductor device,electrode structure therefor, and circuit board mounted therewith
11/09/1999US5982628 Circuit configuration having a smart card module and a coil connected thereto
11/09/1999US5982623 Module for packaged IC
11/09/1999US5982622 CPU cooling arrangement
11/09/1999US5982621 Electronic device cooling arrangement
11/09/1999US5982620 CPU casing structure with improved heat dissipator anchoring configuration
11/09/1999US5982476 Process of forming pattern and exposure apparatus
11/09/1999US5982256 Wiring board equipped with a line for transmitting a high frequency signal
11/09/1999US5982250 Millimeter-wave LTCC package
11/09/1999US5982221 Switched current temperature sensor circuit with compounded ΔVBE
11/09/1999US5982076 Electronic component involving 2-terminal type piezo-electric device
11/09/1999US5982044 Alignment pattern and algorithm for photolithographic alignment marks on semiconductor substrates
11/09/1999US5982043 Semiconductor device having two or more bonding option pads
11/09/1999US5982042 Semiconductor wafer including semiconductor device
11/09/1999US5982040 Semiconductor device and method for manufacturing the same
11/09/1999US5982039 Completely buried contact holes
11/09/1999US5982038 Cast metal seal for semiconductor substrates
11/09/1999US5982037 Al/Ti layered interconnection and method of forming same
11/09/1999US5982035 High integrity borderless vias with protective sidewall spacer
11/09/1999US5982033 Semiconductor chip package
11/09/1999US5982030 Rigid package with low stress mounting of semiconductor die
11/09/1999US5982029 Semiconductor component having upper and lower mounting plates
11/09/1999US5982028 Semiconductor device with good thermal behavior
11/09/1999US5982027 Integrated circuit interposer with power and ground planes
11/09/1999US5982026 Inexpensive resin molded semiconductor device
11/09/1999US5982025 Wire fixation structure
11/09/1999US5982018 Thin film capacitor coupons for memory modules and multi-chip modules
11/09/1999US5982000 Resistive interconnect of transistor cells
11/09/1999US5981971 Semiconductor ROM wafer test structure, and IC card
11/09/1999US5981880 Electronic device packages having glass free non conductive layers
11/09/1999US5981873 Printed circuit board for ball grid array semiconductor package
11/09/1999US5981641 Heat conductive silicone composition, heat conductive material and heat conductive silicone grease
11/09/1999US5981397 Integrated circuitry having a pair of adjacent conductive lines and method of forming
11/09/1999US5981389 Sputter depositing chromium layers in presence of neon gas and the working gas pressure during sputtering is less than 1 pa.
11/09/1999US5981384 Method of intermetal dielectric planarization by metal features layout modification
11/09/1999US5981380 Method of forming a local interconnect including selectively etched conductive layers and recess formation
11/09/1999US5981378 Reliable interconnect via structures and methods for making the same
11/09/1999US5981377 Semiconductor device with improved trench interconnected to connection plug mating and method of making same
11/09/1999US5981376 Method of forming viahole
11/09/1999US5981374 Sub-half-micron multi-level interconnection structure and process thereof
11/09/1999US5981372 Method for manufacturing a semiconductor device
11/09/1999US5981370 Method for maximizing interconnection integrity and reliability between integrated circuits and external connections
11/09/1999US5981369 Semiconductor integrated circuit device and process for manufacturing the same
11/09/1999US5981362 Manufacturing method of wiring
11/09/1999US5981352 Providing a semiconductor wafer having trench in a surface layer, depositing a bulk layer of tungsten in the trench layer, depositing a protective layer of equaxed grain tungsten over bulk layer
11/09/1999US5981315 Transfer molding
11/09/1999US5981314 Near chip size integrated circuit package
11/09/1999US5981313 Structure and method for packaging a semiconductor device
11/09/1999US5981312 Curing encapsulant to form a bond between the substrate and integrated circuit chip
11/09/1999US5981310 Multi-chip heat-sink cap assembly
11/09/1999US5981302 Integrated multi-layer test pads and methods therefor
11/09/1999US5981301 Regeneration method and apparatus of wafer and substrate
11/09/1999US5981114 Photoresist check patterns in highly integrated circuits having multi-level interconnect layers
11/09/1999US5981085 Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same
11/09/1999US5981036 For electrical or electronic power circuits or modules and which allows improved heat dissipation independent of temperature with simple for problem-free mounting in housing
11/09/1999US5980683 Production of a support element module for embedding into smart cards or other data carrier cards
11/09/1999US5980657 Alloy for enhanced filling of high aspect ratio dual damascene structures
11/09/1999US5980636 Electrical connection device for forming metal bump electrical connection
11/09/1999US5980602 Metal matrix composite
11/09/1999US5980270 Soldering with resilient contacts
11/09/1999US5979739 Semiconductor die bonding apparatus having multiple bonding system
11/09/1999US5979541 Cooling fan and cooling fan assembly
11/09/1999US5979025 Engagement devices with disengaging means for heat dissipating devices
11/09/1999CA2157994C Electronic device assembly
11/09/1999CA2018930C Liquid metal matrix thermal paste
11/04/1999WO1999056516A1 Reverse cantilever spring clip
11/04/1999WO1999056515A1 Integrated circuit intercoupling component with heat sink
11/04/1999WO1999056390A1 Electronic component
11/04/1999WO1999056315A1 Method for metallizing an electric component and electric component
11/04/1999WO1999056313A1 Semiconductor device and process for manufacturing the same
11/04/1999WO1999056312A1 Flip chip with integrated flux, mask and underfill
11/04/1999WO1999055526A1 LOW λ DIELECTRIC INORGANIC/ORGANIC HYBRID FILMS AND METHOD OF MAKING
11/04/1999WO1999044241A3 Semiconductor device comprising a mos transistor
11/04/1999WO1999041957A8 Method of making microwave, multifunction modules using fluoropolymer composite substrates
11/04/1999DE19919743A1 Semiconducting component, e.g. for sensors, has reduced stresses in semiconducting chip
11/04/1999DE19918554A1 Semiconductor rectifier for AC voltage to DC voltage output of AC voltage generator
11/04/1999DE19835393A1 Component used in high performance DRAMs
11/04/1999DE19832970A1 Integrated electronic circuit for mounting on printed circuit board
11/04/1999DE19818824A1 Elektronisches Bauelement Electronic component
11/04/1999DE19806818C1 Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements A method of manufacturing an electronic component, in particular an operating with acoustic Oberflächenwllen SAW component
11/04/1999CA2330296A1 Reverse cantilever spring clip
11/04/1999CA2330040A1 Low kappa dielectric inorganic/organic hybrid films and method of making
11/04/1999CA2330039A1 Electronic component
11/03/1999EP0954208A1 Method and device for mounting electronic component on circuit board
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