Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1999
11/17/1999CN1235375A Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment
11/17/1999CN1235370A Method for packaging arrays with open ball grids
11/16/1999USRE36396 Electrical substrate material comprising amorphous fused silica powder
11/16/1999US5986894 Microelectronic component carrier and method of its manufacture
11/16/1999US5986890 Semifinished product with an electronic module
11/16/1999US5986888 Heat sink for auxiliary circuit board
11/16/1999US5986887 Stacked circuit board assembly adapted for heat dissipation
11/16/1999US5986886 Three-dimensional flexible electronic module
11/16/1999US5986885 Semiconductor package with internal heatsink and assembly method
11/16/1999US5986863 Electrostatic discharge protection circuits including circumferential guard rings
11/16/1999US5986477 Method and system for providing an interconnect layout to reduce delays in logic circuits
11/16/1999US5986460 BGA package semiconductor device and inspection method therefor
11/16/1999US5986348 Magnetic alignment system for bumps on an integrated circuit device
11/16/1999US5986346 Semiconductor device with improved pad connection
11/16/1999US5986345 Semiconductor device having two ground pads connected to a ground connection lead and method for testing the same
11/16/1999US5986343 Bond pad design for integrated circuits
11/16/1999US5986342 Liquid crystal display apparatus structure for mounting semiconductor device
11/16/1999US5986341 Semiconductor device
11/16/1999US5986340 Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
11/16/1999US5986338 Assembly of semiconductor device
11/16/1999US5986337 Semiconductor element module and semiconductor device which prevents short circuiting
11/16/1999US5986336 Semiconductor device including a heat radiation plate
11/16/1999US5986335 Semiconductor device having a tapeless mounting
11/16/1999US5986334 Semiconductor package having light, thin, simple and compact structure
11/16/1999US5986333 Semiconductor apparatus and method for fabricating the same
11/16/1999US5986332 Integrated circuit leadframe incorporating overhanging leads
11/16/1999US5986331 Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate
11/16/1999US5986330 Enhanced planarization technique for an integrated circuit
11/16/1999US5986325 Microwave integrated circuit device
11/16/1999US5986322 Reduced leakage antifuse structure
11/16/1999US5986321 Double density fuse bank for the laser break-link programming of an integrated circuit
11/16/1999US5986320 Semiconductor integrated circuit device
11/16/1999US5986319 Laser fuse and antifuse structures formed over the active circuitry of an integrated circuit
11/16/1999US5986317 Optical semiconductor device having plural encapsulating layers
11/16/1999US5986315 Guard wall to reduce delamination effects within a semiconductor die
11/16/1999US5986308 MOS transistor with a protection diode
11/16/1999US5986306 Thin film transistor having a heat sink that exhibits a high degree of heat dissipation effect
11/16/1999US5986299 Semiconductor integrated circuit device having multi-level wiring capacitor structures
11/16/1999US5986294 Semiconductor integrated circuit
11/16/1999US5986284 Semiconductor device
11/16/1999US5986235 Method of efficiently laser marking singulated semiconductor devices
11/16/1999US5986218 Circuit board with conductor layer for increased breakdown voltage
11/16/1999US5986209 Package stack via bottom leaded plastic (BLP) packaging
11/16/1999US5986045 Reaction of haloarylene compound with diphenol compound to form polyarylene ether
11/16/1999US5985954 Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition
11/16/1999US5985769 Semiconductor substrate is prepared which has an interconnection pattern formed thereon
11/16/1999US5985767 Facet etch for improved step coverage of integrated circuit contacts
11/16/1999US5985765 Method for reducing bonding pad loss using a capping layer when etching bonding pad passivation openings
11/16/1999US5985763 Construction of metal-to-metal connections between non-adjacent layers in structure, such as semiconductor device
11/16/1999US5985762 Preventing copper poisoning while fabricating an integrated circuit structure
11/16/1999US5985760 Method for manufacturing a high density electronic circuit assembly
11/16/1999US5985756 Method of forming an interconnection in a contact hole in an insulation layer over a silicon substrate
11/16/1999US5985754 Method of forming a void-free contact plug
11/16/1999US5985752 Self-aligned via structure and method of manufacture
11/16/1999US5985751 Process for fabricating interconnection of semiconductor device
11/16/1999US5985750 Selectively etching aluminum wires, reforming surface of oxide film beneath wires, forming an organic ingterlayer film
11/16/1999US5985747 High pressure reflow for plugging wiring material into contact holes and grooves of inner layer insulation
11/16/1999US5985745 Method of forming a via hole filled with a conducting material, and separater from a gate structure by an insulating material
11/16/1999US5985719 Method of forming a programmable non-volatile memory cell
11/16/1999US5985711 Method of fabricating semiconductor device
11/16/1999US5985697 Method and apparatus for mounting an integrated circuit to a printed circuit board
11/16/1999US5985695 Method of making a molded flex circuit ball grid array
11/16/1999US5985693 High density three-dimensional IC interconnection
11/16/1999US5985692 Process for flip-chip bonding a semiconductor die having gold bump electrodes
11/16/1999US5985677 Method of repairing semiconductor memory, electron-beam memory repairing apparatus and redundancy memory circuit to which the method of repairing semiconductor memory is applicable
11/16/1999US5985464 Joining metallic and nonmetallic materials by casting and permeation of adhesive; bonding strength; thermoconductivity
11/16/1999US5985461 Electroconductive paste, and method for producing ceramic substrate using it
11/16/1999US5985456 Heat curable; nonhydrolzying; corrosion resistance
11/16/1999US5985455 Semiconductor element sealed with an epoxy resin compound
11/16/1999US5985377 Laser marking techniques
11/16/1999US5985125 Forming barrier metal patterns on wafer, depositing copper only on barrier metal patterns by electrochemistry
11/16/1999US5985043 Thermally curable adhesive comprising acid having two or more double bonds as fluxing agent, double bond containing diluent capable of crosslinking fluxing agent, optionally free radical initiator, resin
11/16/1999US5984699 Method of fabricating a semiconductor device
11/16/1999US5984692 Board stacking connector chip and tape cartridge containing the chip
11/16/1999US5984190 Method and apparatus for identifying integrated circuits
11/16/1999US5983997 Cold plate having uniform pressure drop and uniform flow rate
11/16/1999US5983995 Radiator
11/16/1999US5983974 Method of making a lid for a chip/package system
11/16/1999US5983493 Method of temporarily, then permanently, connecting to a semiconductor device
11/16/1999US5983492 Low profile socket for microelectronic components and method for making the same
11/16/1999US5983490 Conductive ball mounting apparatus
11/16/1999CA2112860C Integrated circuit package and assembly thereof for thermal and emi management
11/11/1999WO1999057951A1 A printed circuit board and a method of processing printed circuit boards
11/11/1999WO1999057765A1 Chip stack and method of making same
11/11/1999WO1999057764A1 Laminated integrated circuit package
11/11/1999WO1999057763A1 Leadframe having a paddle with an isolated area and a single paddle having a semiconductor device and a passive electronic component
11/11/1999WO1999057762A1 Flip chip assembly with via interconnection
11/11/1999WO1999057761A1 Method for fabricating a lateral rf mos device with a non-diffusion source-backside connection
11/11/1999WO1999057760A1 Semiconductor device
11/11/1999WO1999057330A1 Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition
11/11/1999WO1999056613A1 Analyte monitoring device and methods of use
11/11/1999WO1999045591A9 An integrated circuit package having interchip bonding and method therefor
11/11/1999WO1999045582A9 A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
11/11/1999DE19920401A1 Temperature measurement arrangement for electronic device mounted on rigid element
11/11/1999DE19919962A1 Insulating trench isolation for MOS-transistors in the manufacture of DRAM
11/11/1999DE19820816A1 Bond pad structure used for micromechanical sensors
11/11/1999DE19820216A1 A cast resin formulation useful for Glop, Top-flip, and/or adhesive applications in electrotechnical and electronic product manufacture
11/11/1999CA2329441A1 Laminated integrated circuit package
11/10/1999EP0955677A1 Fuse with focus current for integrated circuit
11/10/1999EP0955676A2 Wafer-scale assembly of chip-size packages
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