Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1999
11/23/1999US5990567 System for in-line monitoring of photo processing tilt in VLSI fabrication
11/23/1999US5990566 High density semiconductor package
11/23/1999US5990565 Flip chip package
11/23/1999US5990564 Flip chip packaging of memory chips
11/23/1999US5990563 Semiconductor package having a connection member
11/23/1999US5990562 Semiconductor devices having backside probing capability
11/23/1999US5990561 Tungsten plugs for integrated circuits and methods for making same
11/23/1999US5990559 Circuitry comprising roughened platinum layers, platinum-containing materials, capacitors comprising roughened platinum layers, methods forming roughened layers of platinum, and methods of forming capacitors
11/23/1999US5990558 Reduced cracking in gap filling dielectrics
11/23/1999US5990557 Bias plasma deposition for selective low dielectric insulation
11/23/1999US5990556 Stacked thin film assembly
11/23/1999US5990555 Electronic circuit device with multi-layer wiring
11/23/1999US5990554 Semiconductor package having isolated heatsink bonding pads
11/23/1999US5990553 Multilayer; polyimide dielectric
11/23/1999US5990552 Apparatus for attaching a heat sink to the back side of a flip chip package
11/23/1999US5990550 Integrated circuit device cooling structure
11/23/1999US5990549 Thermal bus bar design for an electronic cartridge
11/23/1999US5990548 Plate type member for semiconductor device package and package
11/23/1999US5990547 Semiconductor device having plated contacts and method thereof
11/23/1999US5990546 Chip scale package type of semiconductor device
11/23/1999US5990545 Chip scale ball grid array for integrated circuit package
11/23/1999US5990544 Lead frame and a semiconductor device having the same
11/23/1999US5990543 Reframed chip-on-tape die
11/23/1999US5990541 Semiconductor device and method of fabricating the same
11/23/1999US5990540 Semiconductor device and method for manufacturing the same
11/23/1999US5990537 Semiconductor device with fuse
11/23/1999US5990529 Semiconductor memory device with impurity areas around trench structure
11/23/1999US5990519 Electrostatic discharge structure
11/23/1999US5990513 Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion
11/23/1999US5990502 High density gate array cell architecture with metallization routing tracks having a variable pitch
11/23/1999US5990501 Multichip press-contact type semiconductor device
11/23/1999US5990488 Useable drop-in strategy for correct electrical analysis of semiconductor devices
11/23/1999US5990418 Hermetic CBGA/CCGA structure with thermal paste cooling
11/23/1999US5990415 Multilayer solar cells with bypass diode protection
11/23/1999US5990022 Method of evaluating a silicon wafer
11/23/1999US5990011 Titanium aluminum alloy wetting layer for improved aluminum filling of damescene trenches
11/23/1999US5990009 Maximization of low dielectric constant material between interconnect traces of a semiconductor circuit
11/23/1999US5990001 Method of forming a semiconductor device having a critical path wiring
11/23/1999US5989994 Method for producing contact structures
11/23/1999US5989992 Method of making a semiconductor device
11/23/1999US5989991 Methods for fabricating a bonding pad having improved adhesion to an underlying structure
11/23/1999US5989989 Die and cube reroute process
11/23/1999US5989982 Semiconductor device and method of manufacturing the same
11/23/1999US5989943 Method for fabrication of programmable interconnect structure
11/23/1999US5989942 Coating the surface of a semiconductor element with a curable silicone polymer and filler of given particle size and specific gravity; curing after filler migrates to silicone remote from the element; solvent and static resistance
11/23/1999US5989941 Wire bonding a die secured to a mounting, coating with metal on one side of a film; applying adhesive to other side, forming a central aperture in film to form a dam, securing dam to die; encapsulating; dam controls spread of encapsulant
11/23/1999US5989940 Cramping outer leads between mold halves which form a first cavity; injecting a first mold resin into cavity to seal semiconductor element; sealing first mold resin portion by a second mold resin to expose first part of mold portion
11/23/1999US5989939 Process of manufacturing compliant wirebond packages
11/23/1999US5989938 Thin oxynitride layer which defines a recess in a patterned metal layer, spin-on-glass(sog) fills recess and surface of oxynitride layer, removing sog from surface; adding second oxynitride layer and nitride layer; crack resistance
11/23/1999US5989936 Microelectronic assembly fabrication with terminal formation from a conductive layer
11/23/1999US5989935 Column grid array for semiconductor packaging and method
11/23/1999US5989934 Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits
11/23/1999US5989784 Forming a fuse opening using an etch stop layer by using a two stage etch process where the second stage etches the etch stop layer while simultaneously forming a passivation layer over a metal pad
11/23/1999US5989783 Method of customizing integrated circuits by depositing two resist layers to selectively pattern layer interconnect material
11/23/1999US5989623 Dual damascene metallization
11/23/1999US5989484 Multilayer glass ceramic substrate and process for producing the same
11/23/1999US5989474 Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar
11/23/1999US5989364 Gold-alloy bonding wire
11/23/1999US5989039 Socket apparatus for testing package
11/23/1999US5988707 Semiconductor device of lead-on-chip structure
11/23/1999US5988522 Synthetic jet actuators for modifiying the direction of fluid flows
11/23/1999US5988368 Resist pattern forming method using anti-reflective layer resist pattern formed and method of etching using resist pattern and product formed
11/23/1999US5988266 Bonded cast, pin-finned heat sink and method of manufacture
11/23/1999US5987893 Heat exchanger arrangement and cooling system with at least one such heat exchanger arrangement
11/23/1999US5987890 Electronic component cooling using a heat transfer buffering capability
11/23/1999US5987744 Method for supporting one or more electronic components
11/23/1999US5987742 Technique for attaching a stiffener to a flexible substrate
11/23/1999US5987740 Laser machining of molded assemblies
11/23/1999US5987739 Method of making a polymer based circuit
11/23/1999US5987732 Method of making compact integrated microwave assembly system
11/18/1999WO1999059387A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element
11/18/1999WO1999059206A2 Semiconductor device and method for making the device
11/18/1999WO1999059205A1 Semiconductor plastic package and method for producing printed wiring board
11/18/1999WO1999059204A1 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
11/18/1999WO1999041782A3 Module tape with modules for dual-mode data carriers
11/18/1999DE19920445A1 High density bottom leaded package stack of integrated circuits
11/18/1999DE19920444A1 Thin small outline package for semiconductor device
11/18/1999DE19836379A1 Herstellungsverfahren durch Verwenden des Doppel-Damaszierungs-Verfahrens Manufacturing process by using the double-Damaszierungs method
11/17/1999EP0957664A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
11/17/1999EP0957663A2 Electronic part and a method of manufacturing the same
11/17/1999EP0957520A2 Semiconductor package and mount board, and mounting method
11/17/1999EP0957519A2 Compatible IC packages and methods for ensuring migration path
11/17/1999EP0957518A1 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them
11/17/1999EP0957517A2 Power semiconductor device
11/17/1999EP0957513A1 Electronic parts device
11/17/1999EP0957449A1 Non-contact memory card , and method of manufacturing of such card
11/17/1999EP0957403A1 Fuse in integrated circuit with localized blowing point
11/17/1999EP0956749A1 Methods and compositions for ionizing radiation shielding
11/17/1999EP0956746A1 Means and method for mounting electronics
11/17/1999EP0956745A1 Microelectronic lead structures with dielectric layers
11/17/1999EP0956591A1 Laser antifuse using gate capacitor
11/17/1999EP0956590A1 Conformal thermal interface material for electronic components
11/17/1999EP0956587A2 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
11/17/1999EP0807369A4 Stackable modules and multimodular assemblies
11/17/1999EP0689571B1 Three-layer polyimidesiloxane adhesive tape
11/17/1999CN2349672Y Chip cooling circulation system device
11/17/1999CN2349671Y Radiation structure for integrated block
11/17/1999CN1235700A Chip supporting substrate for semiconductor package, semiconductor device and manufacture thereof
11/17/1999CN1235699A Electronic part device
11/17/1999CN1235376A Thin wire of gold alloy and manufacture and use thereof
1 ... 1931 1932 1933 1934 1935 1936 1937 1938 1939 1940 1941 1942 1943 1944 1945 1946 1947 1948 1949 1950 1951 ... 2262