Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1999
11/30/1999US5994946 Alternating inverters for capacitive coupling reduction in transmission lines
11/30/1999US5994915 Reduced terminal testing system
11/30/1999US5994911 Method and apparatus testing IC chips for damage during fabrication
11/30/1999US5994785 Epoxy resin compositions and semiconductor devices encapsulated therewith
11/30/1999US5994784 Die positioning in integrated circuit packaging
11/30/1999US5994783 Semiconductor chip package and fabrication method thereof
11/30/1999US5994781 Semiconductor chip package with dual layer terminal and lead structure
11/30/1999US5994780 Semiconductor device with multiple contact sizes
11/30/1999US5994779 Semiconductor fabrication employing a spacer metallization technique
11/30/1999US5994778 Surface treatment of low-k SiOF to prevent metal interaction
11/30/1999US5994777 Method and support structure for air bridge wiring of an integrated circuit
11/30/1999US5994776 Interlevel dielectric with multiple air gaps between conductive lines of an integrated circuit
11/30/1999US5994775 Metal-filled via/contact opening with thin barrier layers in integrated circuit structure for fast response, and process for making same
11/30/1999US5994774 Surface mountable integrated circuit package with detachable module and interposer
11/30/1999US5994773 Ball grid array semiconductor package
11/30/1999US5994772 Semiconductor package
11/30/1999US5994771 Semiconductor package with multilayer circuit, and semiconductor device
11/30/1999US5994768 Multi-layer lead frame
11/30/1999US5994767 Leadframe for integrated circuit package and method of manufacturing the same
11/30/1999US5994766 Flip chip circuit arrangement with redistribution layer that minimizes crosstalk
11/30/1999US5994765 Clock distribution network with efficient shielding
11/30/1999US5994764 Semiconductor device
11/30/1999US5994763 Wiring structure for semiconductor element and method for forming the same
11/30/1999US5994762 Semiconductor integrated circuit device including boron-doped phospho silicate glass layer and manufacturing method thereof
11/30/1999US5994760 Device having a low threshold voltage for protection against electrostatic discharges
11/30/1999US5994758 Semiconductor integrated circuit device having resistance element
11/30/1999US5994757 High-resistance member being of a material which changes from a high resistivity state to a low resistivity state in accordance with a voltage applied between said conductors
11/30/1999US5994752 Field-effect-controllable semiconductor component with a plurality of temperature sensors
11/30/1999US5994749 Semiconductor device having a gate electrode film containing nitrogen
11/30/1999US5994742 Plasma emission triggered protection device for protecting against charge-induced damage
11/30/1999US5994739 Integrated circuit device
11/30/1999US5994738 Silicon oxide insulator (SOI) semiconductor having selectively linked body
11/30/1999US5994716 Integrated circuit and fabricating method and evaluating method of integrated circuit
11/30/1999US5994241 Method of forming conductive lines on a semiconductor wafer
11/30/1999US5994228 Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes
11/30/1999US5994222 Method of making chip mountings and assemblies
11/30/1999US5994221 Controlling temperature; melting and reflowing
11/30/1999US5994220 Method for forming a semiconductor connection with a top surface having an enlarged recess
11/30/1999US5994218 Forming wiring trench in dielectric; filling with silicon; overcoating with aluminum; heating; forming silicide
11/30/1999US5994215 Method for suppression pattern distortion associated with BPSG reflow
11/30/1999US5994214 Fabrication process for a semiconductor device
11/30/1999US5994212 Semiconductor device and method of manufacturing the same
11/30/1999US5994170 Silicon segment programming method
11/30/1999US5994169 Lead frame for integrated circuits and process of packaging
11/30/1999US5994168 Method of manufacturing semiconductor device
11/30/1999US5994167 Semiconductor diodes
11/30/1999US5993946 Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
11/30/1999US5993945 Does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer.
11/30/1999US5993908 Depositing polycrystalline aluminum film containing copper, heating to a target temperature, controlled cooling to a final temperature
11/30/1999US5993735 Gold-based alloy for bonding wire of semiconductor device
11/30/1999US5993699 Aluminum nitride based composite body electronic functional material, electrostatic chuck and method of producing aluminum nitride based composite body
11/30/1999US5993574 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
11/30/1999US5993546 Apparatus for forming a solid thin film from a layer of liquid material without void
11/30/1999US5993292 Production of notchless wafer
11/30/1999US5992511 Cooling apparatus for electronic element
11/30/1999US5992168 Circuit board having an integral sorber
11/30/1999CA2099049C Permanent metallic bonding method
11/25/1999WO1999060830A1 Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel
11/25/1999WO1999060829A2 Method and apparatus for making electrical traces, circuits and devices
11/25/1999WO1999060628A1 Power mos transistor with overtemperature protection circuit
11/25/1999WO1999060627A1 Electronic module
11/25/1999WO1999060626A1 Semiconductor device
11/25/1999WO1999060622A1 Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
11/25/1999WO1999045571A3 Doping frit appropriate for the production of conductor ceramic enamels
11/25/1999WO1999043032A3 sEMICONDUCTOR COMPONENT WITH A STRUCTURED LEADFRAME AND METHOD FOR PRODUCING THE SAME
11/25/1999DE4390783C1 Vorrichtung zum Verbinden eines Kühlkörpers mit einem elektronischen Schaltkreis Device for connecting a heat sink to an electronic circuit
11/25/1999DE19825009C1 Semiconductor chip bond pad testing device
11/25/1999DE19823170A1 Bipolar transistor with insulated gate electrode
11/25/1999DE19822345A1 Circuit board connection with hybrid device
11/25/1999DE19821834A1 Power MOS transistor (PMT) with integral overheat protection
11/25/1999DE19821395A1 Ultra-fine gold alloy wire for wire bonding or flip-chip bonding of semiconductor devices
11/25/1999CA2332891A1 Multiple blank for electronic components, in particular surface acoustic wave components, and method of building up bumps, solder frames, spacers and the like on the multiple blank
11/24/1999EP0959648A1 Printed wiring board and manufacturing method therefor
11/24/1999EP0959499A1 Method for manufacturing bump leaded film carrier type semiconductor device
11/24/1999EP0959498A1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
11/24/1999EP0959494A1 Semiconductor and method for manufacturing the same
11/24/1999EP0958656A1 Arrangement and method for measuring a temperature
11/24/1999EP0958608A2 A fiducial for aligning an integrated circuit die
11/24/1999EP0958607A1 Transferred flexible integrated circuit
11/24/1999EP0958605A2 Molded flex circuit ball grid array and method of making
11/24/1999EP0958603A1 Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package
11/24/1999EP0809862B1 Organic chip carriers for wire bond-type chips
11/24/1999EP0784342B1 Pressure contact type semiconductor device and assembly method therefor
11/24/1999EP0737362B1 Layered low dielectric constant technology
11/24/1999CN2350872Y Integrated circuit heat sink fastening device
11/24/1999CN2350871Y Plastic package of quartz-crystal resonator
11/24/1999CN1236378A Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices
11/24/1999CN1236203A Electronic part and method of manufacturing the same
11/24/1999CN1236188A 半导体装置 Semiconductor device
11/24/1999CN1236185A Integrated circuit test socket
11/23/1999US5991185 Semiconductor memory
11/23/1999US5991162 High-frequency integrated circuit device and manufacture method thereof
11/23/1999US5991161 Multi-chip land grid array carrier
11/23/1999US5991156 Ball grid array integrated circuit package with high thermal conductivity
11/23/1999US5991155 Heat sink assembly including flexible heat spreader sheet
11/23/1999US5991154 Attachment of electronic device packages to heat sinks
11/23/1999US5991152 CPU heat sink fastener
11/23/1999US5991151 Heat sink, in particular for electronic components
11/23/1999US5991135 System including ESD protection
11/23/1999US5990757 Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices
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