Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/24/2013US20130277721 Methods for designing semiconductor device structures and related semiconductor structures including damascene structures
10/24/2013US20130277414 Methods of adjusting ultrasonic bonding energy on wire bonding machines
10/24/2013US20130277034 Heat dissipation device and method for manufacturing the same
10/24/2013DE112011103767T5 Halbleitereinheit Semiconductor unit
10/24/2013DE112007000235B4 Schaltplatte und Wärmeabstrahlsystem für eine Schaltplatte Circuit board and Wärmeabstrahlsystem for a circuit board
10/24/2013DE102013207326A1 Hoch-Dichte-3D-Paket High-density 3D package
10/24/2013DE102013206995A1 Electronic device i.e. power module, for use as part of electronic system utilized for controlling speed and torque of motor in automobile industry, has electrical insulation layer directly bonded and/or contacted to cooling body
10/24/2013DE102013206899A1 Verfahren zur Herstellung einer Leiterbahn A method of fabricating a wiring
10/24/2013DE102013206452A1 ESD-Schutzvorrichtung mit abstimmbarer Haltespannung für ein Hochspannungsprogrammier-Pad ESD protection device with tunable withstand voltage for a high voltage programming pad
10/24/2013DE102013202807A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
10/24/2013DE102013103920A1 Herstellungsverfahren für Halbleiterbauelement und Halbleiterbauelement A method for manufacturing semiconductor device and semiconductor device
10/24/2013DE102013103860A1 Chipgehäuse und Verfahren zum Bilden desselben The same chip package and method of forming
10/24/2013DE102013003989A1 Elektronische Vorrichtung mit reduziertem nichtvorrichtungs-Kantenbereich Electronic device with reduced not device edge area
10/24/2013DE102012206647A1 Measuring device i.e. thermal flow rate measuring device, for measuring flow rate of fluid in automation technology, has solder uniformly distributed in recess so that defined distance between housing and thermistor component is adjusted
10/24/2013DE102012206447A1 Led-modul Led module
10/24/2013DE102012206407A1 Druckkontaktanordnung und verfahren zur herstellung einer druckkontaktanordnung Pressure contact arrangement and method for manufacturing a pressure-contact arrangement
10/24/2013DE102012206362A1 Schaltungsanordnung zur thermisch leitfähigen Chipmontage und Herstellungsverfahren Circuit arrangement for thermally conductive die attach and manufacturing processes
10/24/2013DE102012107760A1 Verfahren und Bauelement für Lötverbindungen Method and device for solder
10/24/2013DE102012007727A1 Solid-state LED lamp assembly used in street lighting, has crossbar that is projected beyond side face of respective solid state LED and is partially connected with side face of solid state LED
10/24/2013DE102011015097B4 Kühleinheit mit hydrophiler Verbindungsschicht Cooling unit with a hydrophilic compound layer
10/23/2013EP2654389A1 Joining sheet, electronic component, and producing method thereof
10/23/2013EP2654079A2 Heat dissipation device and method for manufacturing the same
10/23/2013EP2654078A2 Composite semiconductor construction element structure with heat-dissipating structure and method of manufacturing the same
10/23/2013EP2654077A1 Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
10/23/2013EP2654075A2 Method for permanently connecting two metal surfaces
10/23/2013EP2654074A2 Method for permanently connecting two metal surfaces
10/23/2013EP2653729A1 Radial fan with an auxiliary electromagnetically protected casing for the control electronics
10/23/2013EP2652785A1 Support for an optoelectronic semiconductor chip, and semiconductor chip
10/23/2013EP2652784A2 Electronic assembly comprising an improved sintered connection
10/23/2013EP2652783A1 Enhanced stacked microelectronic assemblies with central contacts
10/23/2013EP2652249A1 Downhole tool thermal device
10/23/2013DE202013007444U1 Elektronikmodul und modulares Elektroniksystem Electronic module and modular electronic system
10/23/2013CN203250743U Semiconductor transistor with mounting plate
10/23/2013CN203250740U Low-voltage chip
10/23/2013CN203250736U A power module electrode resistant to force interference
10/23/2013CN203250735U Novel circuit packaging body
10/23/2013CN203250734U Chip queue radiator and chip array radiator which can replace chips
10/23/2013CN203250733U A pre-bended heat-dissipating base plate of a power semiconductor module
10/23/2013CN203250732U Rib-wire type heat-dissipating device
10/23/2013CN203250731U A thyristor module housing
10/23/2013CN203250730U Plastic housing of thyristor module
10/23/2013CN203250729U Novel waterproof diode
10/23/2013CN203249702U A power semiconductor module convenient for measuring the temperature of a chip
10/23/2013CN103370792A Insulated gate semiconductor device
10/23/2013CN103370787A Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus
10/23/2013CN103370786A 功率半导体模块 Power semiconductor module
10/23/2013CN103370785A Enhanced stacked microelectronic assemblies with central contacts
10/23/2013CN103370783A Void-free wafer bonding using channels
10/23/2013CN103370779A Carrier substrate and method for producing semiconductor chips
10/23/2013CN103370360A Siloxane compositions suitable for forming encapsulants
10/23/2013CN103370354A Epoxy resin composition, method for producing same, and semiconductor device using same
10/23/2013CN103370352A 可固化环氧树脂组合物 The curable epoxy resin composition
10/23/2013CN103369874A Method for manufacturing wiring substrate and wiring substrate
10/23/2013CN103369873A Packaging structure and redistribution layer substrate and formation method thereof
10/23/2013CN103367459A Semiconductor device and electronic apparatus
10/23/2013CN103367454A Thin film transistor, manufacturing method thereof, and active matrix display panel
10/23/2013CN103367415A Transistor
10/23/2013CN103367385A Semiconductor light emitting device, light emitting module and illumination apparatus
10/23/2013CN103367366A Semiconductor packaging member
10/23/2013CN103367359A Integrated circuit including power transistor cells and a connecting line
10/23/2013CN103367349A Stacked module
10/23/2013CN103367348A Method and apparatus providing integrated circuit system with interconnected stacked device wafers
10/23/2013CN103367341A IGBT (Insulated Gate Bipolar Translator) lining plate structure
10/23/2013CN103367340A 窗式球栅阵列封装结构 Window ball grid array package
10/23/2013CN103367339A Chip-packaging method and chip-packaging structure
10/23/2013CN103367338A Chip arrangement, a method for forming a chip arrangement, a chip package and a method for forming a chip package
10/23/2013CN103367337A Semiconductor device and manufacturing method for same
10/23/2013CN103367336A Power line filter for multidimensional integrated circuit
10/23/2013CN103367335A Chip protective ring with power decoupling function
10/23/2013CN103367334A Semiconductor package with through silicon via interconnect and method for fabricating the same
10/23/2013CN103367333A 半导体器件及半导体模块 A semiconductor device and a semiconductor module
10/23/2013CN103367332A 封装结构 Package structure
10/23/2013CN103367331A 封装结构 Package structure
10/23/2013CN103367330A Testing structure of power semiconductor device and manufacture method of testing structure
10/23/2013CN103367329A Semiconductor structure for testing an MIM (Metal-Insulating medium-Metal) capacitor
10/23/2013CN103367328A Method and apparatus for visually detecting electrostatic discharge events
10/23/2013CN103367327A Test circuit and semiconductor apparatus including the same
10/23/2013CN103367326A On-chip test switch matrix
10/23/2013CN103367325A Electronic element with haptic effects
10/23/2013CN103367324A Cutting channel for semiconductor chip
10/23/2013CN103367323A Detection layout structure and detection method
10/23/2013CN103367322A Micro heating device and forming method
10/23/2013CN103367321A Chip arrangement and a method for forming a chip arrangement
10/23/2013CN103367320A Interconnect structure having smaller transition layer via
10/23/2013CN103367319A Through silicon via structure and method for fabricating the same
10/23/2013CN103367318A 半导体元件 Semiconductor components
10/23/2013CN103367317A Semiconductor device, method for fabricating the same and system comprising the same
10/23/2013CN103367316A Reduction of OCD measurement noise by way of metal via slots
10/23/2013CN103367315A Wafer level packaging structure
10/23/2013CN103367314A 半导体变压器 Semiconductors Transformers
10/23/2013CN103367313A Electronic device and method for manufacturing the same
10/23/2013CN103367312A Semiconductor device having capacitor integrated therein
10/23/2013CN103367311A Interconnect structure and formation method thereof.
10/23/2013CN103367310A Interconnect structure and method for forming the same
10/23/2013CN103367309A Silicon-penetrating through hole with control electrode and manufacturing method thereof
10/23/2013CN103367308A Metal-oxide-metal capacitor
10/23/2013CN103367307A Through-silicon via and forming method thereof
10/23/2013CN103367306A Output/input interface of chip packaging structure and configuration method thereof
10/23/2013CN103367305A Electric connection structure of IGBT (Insulated Gate Bipolar Transistor) device
10/23/2013CN103367304A Package substrate, flip-chip type package and manufacturing method thereof
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