Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1999
12/07/1999US5999415 BGA package using PCB and tape in a die-down configuration
12/07/1999US5999413 Resin sealing type semiconductor device
12/07/1999US5999408 Enhanced heat transfer in printed circuit boards
12/07/1999US5999407 Electronic module with conductively heat-sunk components
12/07/1999US5999404 Spray cooled module with removable spray cooled sub-module
12/07/1999US5999402 Heat sink fastener retention apparatus and method for computer systems
12/07/1999US5999386 Cross-referenced electrostatic discharge protection systems and methods for power supplies
12/07/1999US5998877 Semiconductor device packaged in plastic and mold employable for production thereof
12/07/1999US5998876 Reworkable thermoplastic hyper-branched encapsulant
12/07/1999US5998875 Flip-chip type connection with elastic contacts
12/07/1999US5998873 Low contact resistance and low junction leakage metal interconnect contact structure
12/07/1999US5998872 Semiconductor device for avoiding cracks in insulating spaces between metal wiring patterns
12/07/1999US5998871 Metal plug electrode in semiconductor device and method for forming the same
12/07/1999US5998870 Wiring structure of semiconductor device and method for manufacturing the same
12/07/1999US5998869 High storage capacity, wide data input/output channel, static random access memory device
12/07/1999US5998868 Very dense chip package
12/07/1999US5998867 Radiation enhanced chip encapsulant
12/07/1999US5998866 Semiconductor device having a lead clamping arrangement
12/07/1999US5998865 Loc simm
12/07/1999US5998864 Stacking semiconductor devices, particularly memory chips
12/07/1999US5998863 Cooling apparatus boiling and condensing refrigerant
12/07/1999US5998862 Air-packed CCD images package and a mold for manufacturing thereof
12/07/1999US5998861 Semiconductor device having ball grid array
12/07/1999US5998860 Double sided single inline memory module
12/07/1999US5998859 Packaging and interconnect system for integrated circuits
12/07/1999US5998858 Microcircuit with memory that is protected by both hardware and software
12/07/1999US5998857 Semiconductor packaging structure with the bar on chip
12/07/1999US5998856 Semiconductor device
12/07/1999US5998853 Methods and apparatus for electrical marking of integrated circuits to record manufacturing test results
12/07/1999US5998847 Low voltage active body semiconductor device
12/07/1999US5998824 Capacitor structure having a lower electrode with a rough surface, a plurality of metal layers and a nitridation treated film
12/07/1999US5998823 Complex dielectric film and semiconductor device
12/07/1999US5998817 High power prematched MMIC transistor with improved ground potential continuity
12/07/1999US5998814 Semiconductor device and fabrication method thereof
12/07/1999US5998804 Polyesters
12/07/1999US5998733 Graphite aluminum metal matrix composite microelectronic package
12/07/1999US5998522 Coating solution containing polysiloxane and solvent
12/07/1999US5998509 Resin composition and semiconductor device employing the same
12/07/1999US5998302 Method of manufacturing semiconductor device
12/07/1999US5998295 Method of forming a rough region on a substrate
12/07/1999US5998293 Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect
12/07/1999US5998292 Method for making three dimensional circuit integration
12/07/1999US5998291 Attachment method for assembly of high density multiple interconnect structures
12/07/1999US5998241 Semiconductor device and method of manufacturing the same
12/07/1999US5998240 Method of extracting heat from a semiconductor body and forming microchannels therein
12/07/1999US5998239 Method of manufacturing a semiconductor device with a brazing mount
12/07/1999US5998238 Method of fabricating semiconductor device
12/07/1999US5998228 Method of testing semiconductor
12/07/1999US5998227 IGBT and free-wheeling diode combination
12/07/1999US5998226 Method and system for alignment of openings in semiconductor fabrication
12/07/1999US5998043 High melting point metallizing layer, intervening metal layer, which has a melting point of not greater than 1,000.degree. c. and consists mainly of at least one selected from among ni, cu and fe
12/07/1999US5998020 Composite film and lead frame with composite film attached
12/07/1999US5998000 Silicon nitride circuit board
12/07/1999US5997999 Sintered body for manufacturing ceramic substrate
12/07/1999US5997757 Method of forming connection hole
12/07/1999US5997754 Method of fabricating multi-layered wiring
12/07/1999US5996458 Lead cutting apparatus of electronic component
12/07/1999US5996219 Method for embedding electric or optical components in high-temperature metals
12/07/1999US5996212 Method of manufacturing a body having a structure of layers
12/07/1999CA2159242C Process for manufacturing semiconductor device and semiconductor wafer
12/04/1999CA2273589A1 Method for producing an electronic circuit assembly
12/02/1999WO1999062135A1 Wideband rf port structure using coplanar waveguide and bga i/o
12/02/1999WO1999062119A1 Rf shielded electronic device
12/02/1999WO1999062118A1 Method for making a micromodule and a storage medium comprising such a micromodule
12/02/1999WO1999062117A1 Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
12/02/1999WO1999044229A9 A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
12/02/1999WO1999022571A3 Three-dimensional flexible electronic module
12/02/1999DE19845316A1 Stackable ball grid array (BGA) semiconductor casing
12/02/1999DE19824400A1 Circuit track contacting device for connecting tracks via contact hole
12/02/1999DE19823285A1 Coupling unit to fix a heat sink against a CPU
12/02/1999CA2333403A1 Wideband rf port structure using coplanar waveguide and bga i/o
12/02/1999CA2332939A1 Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
12/01/1999EP0961322A2 Microwave integrated circuit multi-chip-module and mounting structure therefor
12/01/1999EP0961321A2 High-frequency module
12/01/1999EP0961320A2 Semiconductor wafer comprising an epitaxial layer and an alignment mark
12/01/1999EP0961319A2 Integrated flexible interconnection
12/01/1999EP0961318A1 Integrated circuit with etch stop layer
12/01/1999EP0961317A2 A method of encapsulating an electronic component
12/01/1999EP0960554A1 A spring clip for mounting a heat sink to an electronic component
12/01/1999EP0960439A1 Antifuse based on silicided polysilicon bipolar transistor
12/01/1999EP0960438A1 High density integrated circuits and the method of packaging the same
12/01/1999EP0861479B1 Method for determining an encryption key associated with an integrated circuit
12/01/1999EP0788659B1 High voltage lateral dmos device with enhanced drift region
12/01/1999CN1237325A Assembly consisting of substrate for power components and cooling element and method for production thereof
12/01/1999CN1237274A Semiconductor, semiconductor chip mounting substrate, methods of manufacturing device and substrate, adhesive and adhesive double coated film
12/01/1999CN1237186A Thermosetting resin compositions useful as underfill sealants
12/01/1999CN1237056A Electronic device
12/01/1999CN1236982A Press contact type semiconductor device, and converter using same
12/01/1999CN1236975A 互联系统及其生产方法 Interconnected system and production method
12/01/1999CN1236760A Barium titanate powder, semiconducting ceramic, and semiconducting ceramic electronic element
12/01/1999CN1047026C Arrangement for avoiding stripping of welding backing metal
11/1999
11/30/1999US5995525 Semiconductor laser module
11/30/1999US5995379 Stacked module and substrate therefore
11/30/1999US5995374 Resin-coated mount substrate and method of producing the same
11/30/1999US5995371 Integrated dielectric substrate
11/30/1999US5995370 Heat-sinking arrangement for circuit elements
11/30/1999US5995369 Cooling plate connecting clip for power semiconductors
11/30/1999US5995367 Heat exchanger having an extruded, tiered heat sink
11/30/1999US5995088 Display device having intergrated circuit chips thereon
11/30/1999US5994983 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
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