Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1999
12/14/1999US6002951 Multi-layer ceramic substrate having high TC superconductor circuitry
12/14/1999US6002609 Semiconductor device having a security circuit for preventing illegal access
12/14/1999US6002592 Electronic device and method for manufacturing electronic device
12/14/1999US6002591 Printed circuit board mounting assembly and a method for mounting an integrated circuit device
12/14/1999US6002589 Integrated circuit package for coupling to a printed circuit board
12/14/1999US6002578 Ceramic substrate, circuit substrate and electronic circuit substrate by use thereof and method for preparing ceramic substrate
12/14/1999US6002183 Power semiconductor packaging
12/14/1999US6002182 Laser alignment target
12/14/1999US6002181 Structure of resin molded type semiconductor device with embedded thermal dissipator
12/14/1999US6002180 Multi chip module with conductive adhesive layer
12/14/1999US6002179 Bonding pad structure for integrated circuit (I)
12/14/1999US6002178 Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)
12/14/1999US6002177 High density integrated circuit packaging with chip stacking and via interconnections
12/14/1999US6002176 Differential copper deposition on integrated circuit surfaces
12/14/1999US6002175 Semiconductor device with improved connection hole for embedding an electrically conductive layer portion
12/14/1999US6002174 Barrier materials for semiconductor devices
12/14/1999US6002173 Semiconductor device package with metal-polymer joint of controlled roughness
12/14/1999US6002172 Substrate structure and method for improving attachment reliability of semiconductor chips and modules
12/14/1999US6002171 Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
12/14/1999US6002170 Chip carrier with embedded leads and chip package using same
12/14/1999US6002169 Thermally enhanced tape ball grid array package
12/14/1999US6002168 Microelectronic component with rigid interposer
12/14/1999US6002167 Semiconductor device having lead on chip structure
12/14/1999US6002166 Semiconductor device
12/14/1999US6002165 Multilayered lead frame for semiconductor packages
12/14/1999US6002164 Semiconductor lead frame
12/14/1999US6002163 Electronic device pad relocation, precision placement, and packaging in arrays
12/14/1999US6002161 Semiconductor device having inductor element made of first conductive layer of spiral configuration electrically connected to second conductive layer of insular configuration
12/14/1999US6002147 Hybrid microwave-frequency integrated circuit
12/14/1999US6001943 Catalytic hydrosilylation of gels to form sealing compounds
12/14/1999US6001918 Polysiloxanes with two alkenyl groups and silicon hydrogen bonds and silica powder with diamines
12/14/1999US6001747 Process to improve adhesion of cap layers in integrated circuits
12/14/1999US6001745 Method for forming a VIA in an inter metal dielectric (IMD) containing spin on glass (SOG)
12/14/1999US6001740 Planarization of a non-conformal device layer in semiconductor fabrication
12/14/1999US6001733 Method of forming a dual damascene with dummy metal lines
12/14/1999US6001732 Method of fabricating a metal wiring line
12/14/1999US6001729 Contact structure has conductive zones of high melting point metal
12/14/1999US6001727 Method of making a semiconductor device
12/14/1999US6001725 Laser wire bonding for wire embedded dielectrics to integrated circuits
12/14/1999US6001723 Application of wire bond loop as integrated circuit package component interconnect
12/14/1999US6001718 Semiconductor device having a ternary compound low resistive electrode
12/14/1999US6001703 Method of forming a fiducial for aligning an integrated circuit die
12/14/1999US6001698 MOS transistor and fabrication process for the same
12/14/1999US6001693 Method of making a metal to metal antifuse
12/14/1999US6001673 Methods for packaging integrated circuit devices including cavities adjacent active regions
12/14/1999US6001672 Method for transfer molding encapsulation of a semiconductor die with attached heat sink
12/14/1999US6001671 Methods for manufacturing a semiconductor package having a sacrificial layer
12/14/1999US6001663 Apparatus for detecting defect sizes in polysilicon and source-drain semiconductor devices and method for making the same
12/14/1999US6001661 Integrated circuit interconnect method and apparatus
12/14/1999US6001493 First and second pattern of bumps (solder balls) arranged so during a transfer process, only the first pattern bumps are transferred to pad extensions of device; second bumps can be transferred to another device; use in making electronics
12/14/1999US6001483 Epoxy resin comprising: an epoxy resin; a hardener; and an alkylene-ethylene glycol copolymer of given formula; superior mold releasability and transparency
12/14/1999US6001461 Electronic parts and manufacturing method thereof
12/14/1999US6001415 Via with barrier layer for impeding diffusion of conductive material from via into insulator
12/14/1999US6001196 Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
12/14/1999US6000599 Bondhead lead clamp apparatus and method
12/14/1999US6000462 Cooling device for electrical or electronic components
12/14/1999US6000132 Method of forming heat dissipating fins
12/14/1999US6000130 Process for making planar redistribution structure
12/14/1999US6000126 Method and apparatus for connecting area grid arrays to printed wire board
12/14/1999US6000125 Method of heat dissipation from two surfaces of a microprocessor
12/14/1999CA2154409C Connecting member and a connecting method using the same
12/10/1999WO2000036555A1 Semiconductor device and production method thereof
12/10/1999CA2270303A1 Palladium surface coatings suitable for wirebonding and process for forming palladium surface coatings
12/09/1999WO1999063798A1 System, method and apparatus for purging fluid
12/09/1999WO1999063596A1 Diamond component with rear side contact and a method for the production thereof
12/09/1999WO1999063595A1 Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices
12/09/1999WO1999063594A1 Semiconductor device
12/09/1999WO1999063592A1 Method of severing electrically conductive links with ultraviolet laser output
12/09/1999WO1999063591A1 Dual-damascene interconnect structures employing low-k dielectric materials
12/09/1999WO1999063590A1 A method for treating a deposited film for resistivity reduction
12/09/1999WO1999063589A1 Pad grid array and a method for producing such a pad grid array
12/09/1999WO1999063587A1 Porous insulating compounds and method for making same
12/09/1999WO1999051069A3 Fiber heat sink and fiber heat exchanger
12/09/1999WO1999046965A3 Integrated circuit connection using an electrically conductive adhesive
12/09/1999WO1999029761A3 Poly(arylene ether) compositions and methods of manufacture thereof
12/09/1999DE19920381A1 Semiconductor device with increased power capacity for given size
12/09/1999DE19842080A1 Carrier disk manufacture for semiconductor chip
12/09/1999CA2334026A1 Porous insulating compounds and method for making same
12/09/1999CA2330653A1 Method of severing electrically conductive links with ultraviolet laser output
12/08/1999EP0963001A2 Millimeter wave module and radio apparatus
12/08/1999EP0962980A1 Microelectronic hyperfrequency module having two different substrate materials and method of making such module
12/08/1999EP0962979A2 Programmable electronic circuit with an identification number and external connections for control, actuation and display
12/08/1999EP0962978A1 Semiconductor device and method of manufacturing same
12/08/1999EP0962977A2 Electrically conductive paste and ceramic multi-layered substrate
12/08/1999EP0962976A2 Intergrated circuit having unique lead configuration
12/08/1999EP0962975A2 IC chip package with directly connected leads
12/08/1999EP0962974A2 Semiconductor device
12/08/1999EP0962973A1 Multichip press-contact power semiconductor device
12/08/1999EP0962123A1 Heat sink mounting assembly for surface mount electronic device packages
12/08/1999EP0961809A1 Low temperature method and compositions for producing electrical conductors
12/08/1999EP0647722B1 Gold alloy wire for use in a semiconductor device
12/08/1999CN2353052Y Mechanism for driving mould holder for IC sealing mould
12/08/1999CN1237797A Semiconductor device and method for manufacturing the same
12/08/1999CN1237791A 半导体器件 Semiconductor devices
12/08/1999CN1237787A Semiconductor device and manufacturing method of same
12/08/1999CN1237785A Semiconductor device, and method of producing semiconductor device
12/08/1999CN1237782A Method for fabricating contact of semiconductor device
12/08/1999CN1047278C Electronic circuit assembly with improved heatsinking performance
12/08/1999CN1047261C Method for repairing defect-generated cell using laser
12/08/1999CA2273687A1 Semiconductor clamping device
1 ... 1928 1929 1930 1931 1932 1933 1934 1935 1936 1937 1938 1939 1940 1941 1942 1943 1944 1945 1946 1947 1948 ... 2262