Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1999
12/22/1999EP0966045A1 Method of fabricating a semiconductor device having a structured metallisation
12/22/1999EP0966044A2 Semiconductor memory and manufacturing method therefor
12/22/1999EP0966039A2 Insulating film for semiconductor device and semiconductor device
12/22/1999EP0966038A2 Bonding of semiconductor power devices
12/22/1999EP0966037A2 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
12/22/1999EP0966035A1 Semiconductor metallization system and method
12/22/1999EP0966033A2 Semiconductor device and method for producing the same
12/22/1999EP0966031A2 Substrate for mounting a semiconductor chip
12/22/1999EP0966030A1 Feedthrough interconnection assembly
12/22/1999EP0965846A2 Integrated circuit test socket
12/22/1999EP0965143A1 Method and arrangement for attaching a component
12/22/1999EP0965101A2 Authenticity attribute
12/22/1999EP0885468A4 Slotline-to-coplanar waveguide transition
12/22/1999CN2355511Y Radiation structure for power transistors for electronic ballast
12/22/1999CN2355467Y 电连接器 The electrical connector
12/22/1999CN2355428Y Improvement of radiator for CPU
12/22/1999CN1239589A Chip scale ball grid array for intergrated circuit package
12/22/1999CN1239588A Tab tape ball grid array package with vias laterally offset from solder ball bond sites
12/22/1999CN1239398A Socket for integrated circuit chip
12/22/1999CN1239327A Heat sink and memory module with heat sink
12/22/1999CN1239319A Insulating film for semiconductor device and semiconductor device
12/22/1999CN1239238A Fixing fixture
12/22/1999CN1047717C Packaging structure for microwave circuit
12/21/1999US6005772 Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
12/21/1999US6005771 Electronics cooling technique for spacecraft modules
12/21/1999US6005410 Interconnect structure between heterogeneous core regions in a programmable array
12/21/1999US6005295 Semiconductor device and manufacturing method therefor
12/21/1999US6005294 Method of arranging alignment marks
12/21/1999US6005293 Wire-bonded semiconductor device
12/21/1999US6005292 Lead-free interconnection for electronic devices
12/21/1999US6005291 Semiconductor device and process for production thereof
12/21/1999US6005290 Multi chip module having self limiting contact members
12/21/1999US6005289 Package for semiconductor device laminated printed circuit boards
12/21/1999US6005287 Semiconductor device, and lead frame used therefor
12/21/1999US6005286 Increasing the gap between a lead frame and a semiconductor die
12/21/1999US6005277 ARC layer enhancement for reducing metal loss during via etch
12/21/1999US6005265 Semiconductor integrated circuit device having wiring layout for small amplitude signals
12/21/1999US6005197 Embedded thin film passive components
12/21/1999US6005185 Coolant sealing structure for a solar cell
12/21/1999US6004887 Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film
12/21/1999US6004876 Low resistance interconnect for a semiconductor device and method of fabricating the same
12/21/1999US6004874 Method for forming an interconnect
12/21/1999US6004867 Chip-size packages assembled using mass production techniques at the wafer-level
12/21/1999US6004835 Method of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to anode location and an electrical interconnection with a transistor source/drain region
12/21/1999US6004834 Method of manufacturing semiconductor device having a fuse
12/21/1999US6004833 Method for constructing a leadless array package
12/21/1999US6004829 Method of increasing end point detection capability of reactive ion etching by adding pad area
12/21/1999US6004827 Integrated circuit processing
12/21/1999US6004705 Photosensitive ceramics green sheet
12/21/1999US6004657 Laminated electronic part
12/21/1999US6004624 Densified ceramic body which is relatively free of surface defects. paste comprising a refractory metal powder, a binder and tricalcium aluminate in an amount sufficient to reduce formation of particles in surface and subsurface
12/21/1999US6004405 Wafers with crystal orientation
12/21/1999US6004141 Socket for electronic part
12/21/1999US6003753 Air-blow solder ball loading system for micro ball grid arrays
12/21/1999US6003595 Constant-temperature liquid-circulating apparatus
12/21/1999US6003586 Heat-sinking structures and electrical sockets for use therewith
12/16/1999WO1999065078A2 Semiconductor device
12/16/1999WO1999065077A1 Low resistance package for semiconductor devices
12/16/1999WO1999065076A1 Semiconductor device and method for manufacturing the same
12/16/1999WO1999065075A1 Semiconductor device and method for manufacturing the same
12/16/1999WO1999065074A2 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
12/16/1999WO1999065062A2 Ic stack utilizing secondary leadframes
12/16/1999WO1999064513A1 Semiconductor sealing epoxy resin composition and semiconductor device using the same
12/16/1999WO1999064198A1 Method for producing a lead-free substrate
12/16/1999WO1999064195A2 Curved ceramic moulded part
12/16/1999DE19926756A1 Electronic circuit housing with improved heat dissipation for e.g. rectifiers in automobile circuits
12/16/1999DE19924651A1 Contact fabrication for semiconductor memory device
12/16/1999DE19904258A1 Ball grid array semiconductor device e.g. for mobile telephone or personal computer
12/16/1999DE19860768A1 Semiconductor component with casing enclosing semiconductor chip
12/16/1999DE19852355A1 Circuit, e.g. for controller, especially motor vehicle engine controller
12/16/1999DE19825612A1 Semiconductor device, especially as a CMOS circuit such as a chip card processor, with a polysilicon wiring
12/16/1999DE19825607A1 Integrierte Halbleiterschaltung mit Füllstrukturen A semiconductor integrated circuit with dummy
12/16/1999CA2301083A1 Semiconductor device and method for manufacturing the same
12/16/1999CA2293628A1 Method for the manufacture of a leadless substrate
12/15/1999EP0964605A2 Low-thermal expansion circuit board and multilayer circuit board
12/15/1999EP0964450A1 Integrated semiconductor circuit with pad
12/15/1999EP0964449A2 Integrated semiconductor circuit with dummy features
12/15/1999EP0964446A2 An electronic circuit assembly
12/15/1999EP0964445A2 Stress reduction for flip chip package
12/15/1999EP0963611A1 Thermoelectric module unit
12/15/1999EP0963607A1 An integrated circuit having a planar inductor
12/15/1999EP0963606A1 An integrated circuit which uses a recessed local conductor for producing staggered interconnect lines
12/15/1999EP0963605A2 Improved leadframe structure with locked inner leads and process for manufacturing same
12/15/1999EP0963603A1 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
12/15/1999EP0963602A1 Heterolithic microwave integrated circuits and process of making hmic circuits
12/15/1999EP0963600A1 Thin titanium film as self-regulating filter for silicon migration into aluminum metal lines
12/15/1999EP0963459A2 Wafer support system
12/15/1999EP0963413A1 Process for coating mouldings with polyester resin compounds or solutions
12/15/1999EP0719976B1 Heat insulating board and heat insulating method using same
12/15/1999CN2354242Y Microspan spherical-grating array storage model group
12/15/1999CN2354241Y Integrated circuit for dynamic direct access storage device
12/15/1999CN2354240Y Base plate for packaging chip of integrated circuit
12/15/1999CN2354239Y CMOS picture sensing detector capable of reducing leakage current
12/15/1999CN1238856A Chip module and manufacturing process thereof
12/15/1999CN1238721A Super conducting heat transfer medium
12/15/1999CN1238560A 半导体装置 Semiconductor device
12/15/1999CN1238559A Reworkable thermoplastic encapsulant
12/15/1999CN1238394A Process of controlling grain growth in metal films
12/15/1999CN1047470C 半导体器件 Semiconductor devices
12/15/1999CA2274404A1 Bonding of semiconductor power devices
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