Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1999
12/29/1999WO1999067088A1 Transferrable compliant fibrous thermal interface
12/29/1999WO1999067087A1 Method of making an adhesive preform lid for electronic devices
12/29/1999EP0967650A2 Circuit board for mounting bare chip
12/29/1999EP0967649A2 Palladium surface coatings suitable for wirebonding and process for forming palladium surface coatings
12/29/1999EP0967648A2 Semiconductor clamping device
12/29/1999EP0967647A2 Method of sealing a surface mount package type semiconductor device
12/29/1999EP0967639A1 CVD/PVD method of filling structures using discontinuous CVD Al liner
12/29/1999EP0967638A2 Semiconductor fuse
12/29/1999EP0967635A2 Method of manufacturing a bonded, aluminum containing device
12/29/1999EP0966765A1 Weather and corrosion-resistant layer structure
12/29/1999EP0966759A2 Thin-film component comprising a substrate with an elastic coating
12/29/1999EP0966758A2 A method of providing a vertical interconnect between thin film microelectronic devices
12/29/1999EP0966643A1 Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same
12/29/1999EP0932941A4 Slotline-mounted flip chip structures
12/29/1999CN2356423Y Semiautomatic assembling machine for radiation fin
12/29/1999CN2356422Y 集成电路散热器 IC radiator
12/29/1999CN1239863A Low-expansion circuit board and multilayer circuit board
12/29/1999CN1239835A 电子电路 Electronic circuit
12/29/1999CN1239831A Semiconductor device and method for fabricating the same
12/29/1999CN1239830A Semiconductor device provided with base barrier film for solder bump and method for manufacturing the same
12/29/1999CN1239829A Method and apparatus for retention of fragile conductive trace with protective clamp
12/29/1999CN1239820A Method for forming integrated circuit
12/29/1999CA2298695A1 Plastic integrated circuit package and method and leadframe for making the package
12/28/1999USRE36469 Packaging for semiconductor logic devices
12/28/1999US6009327 Hand-off method in a personal communication service system
12/28/1999US6008996 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
12/28/1999US6008991 Electronic system including packaged integrated circuits with heat spreading standoff support members
12/28/1999US6008990 Cartridge type CPU module cooling structure
12/28/1999US6008989 Heat sink assembly
12/28/1999US6008988 Integrated circuit package with a heat spreader coupled to a pair of electrical devices
12/28/1999US6008716 Fuse structure connecting first level and second level interconnections in inter-layer insulator
12/28/1999US6008713 Monolithic inductor
12/28/1999US6008543 Conductive bumps on pads for flip chip application
12/28/1999US6008542 Semiconductor device having long pads and short pads alternated for fine pitch without sacrifice of probing
12/28/1999US6008541 Packaged integrated circuit device
12/28/1999US6008540 Integrated circuit dielectric and method
12/28/1999US6008538 Method and apparatus providing redundancy for fabricating highly reliable memory modules
12/28/1999US6008537 Semiconductor device with heat dissipation metal layer and metal projections
12/28/1999US6008536 Grid array device package including advanced heat transfer mechanisms
12/28/1999US6008535 Method of making a semiconductor diode from laminated ceramic tape
12/28/1999US6008534 Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines
12/28/1999US6008533 Controlling impedances of an integrated circuit
12/28/1999US6008532 Integrated circuit package having bond fingers with alternate bonding areas
12/28/1999US6008531 Hybrid frame with lead-lock tape
12/28/1999US6008530 Polyhedral IC package for making three dimensionally expandable assemblies
12/28/1999US6008528 Semiconductor lead frame with channel beam tie bar
12/28/1999US6008523 Electrical fuses with tight pitches and method of fabrication in semiconductors
12/28/1999US6008512 Semiconductor device with increased maximum terminal voltage
12/28/1999US6008503 Oxide film thickness standards
12/28/1999US6008266 Includes an epoxy monomer of given formula which is curable using actinic radiation and incorporates a cleavable acetal linkage which renders the cured epoxy formulations soluble in dilute acid, to allow recovery following cure
12/28/1999US6008141 Semiconductor device and fabrication method thereof
12/28/1999US6008129 Process for forming a semiconductor device
12/28/1999US6008127 Semiconductor device having etching stopper layer formed by oxidation and method of fabricating the same
12/28/1999US6008126 Membrane dielectric isolation IC fabrication
12/28/1999US6008124 Semiconductor device having improved lamination-structure reliability for buried layers, silicide films and metal films, and a method for forming the same
12/28/1999US6008120 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication
12/28/1999US6008111 Method of manufacturing semiconductor device
12/28/1999US6008102 Method of forming a three-dimensional integrated inductor
12/28/1999US6008075 Method for simultaneous formation of contacts between metal layers and fuse windows in semiconductor manufacturing
12/28/1999US6008074 Method of forming a synchronous-link dynamic random access memory edge-mounted device
12/28/1999US6008073 Method of manufacturing a bus bar structure on lead frame of semiconductor device package
12/28/1999US6008072 Tape automated bonding method
12/28/1999US6008070 Wafer level fabrication and assembly of chip scale packages
12/28/1999US6008068 Process for etching a semiconductor lead frame
12/28/1999US6008065 Method for manufacturing a liquid crystal display
12/28/1999US6008061 Method of manufacturing semiconductor device having a test pad
12/28/1999US6007953 Method of avoiding peeling on wafer edge and mark number
12/28/1999US6007920 Facilitates expansion to be conducted after the wafer dicing
12/28/1999US6007733 Hard masking method for forming oxygen containing plasma etchable layer
12/28/1999US6007730 Method of manufacturing diamond heat sink
12/28/1999US6007729 Carrier tape and manufacturing method of said carrier tape
12/28/1999US6007669 Layer to layer interconnect
12/28/1999US6007668 Tape automated bonding (tab) formed by bonding a conductor metal foil onto an adhesive layer on a metal plate; coating the metal plate with a protective plating inert to the etchant and etching the foil; hermetic sealing
12/28/1999US6007357 Chip socket assembly and chip file assembly for semiconductor chips
12/28/1999US6007349 Flexible contact post and post socket and associated methods therefor
12/28/1999US6006981 Wirefilm bonding for electronic component interconnection
12/28/1999US6006979 Method of bonding a diamond substrate to at least one metal substrate
12/28/1999US6006827 Cooling device for computer component
12/28/1999US6006543 Absorbent pair refrigerant system
12/28/1999US6006428 Polytetrafluoroethylene thin film chip carrier
12/28/1999US6006427 Chip-on-board printed circuit manufacturing process using aluminum wire bonded to copper pads
12/28/1999US6006424 Method for fabricating inner leads of a fine pitch leadframe
12/28/1999CA2176270C Hybrid microcircuit glass-to-metal seal repair process
12/28/1999CA2029970C Radiation curable organosiloxane gel composition
12/28/1999CA2000626C Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same
12/23/1999WO1999066774A1 Cooling system for a power electronic unit for operating at least one electrical group of a motor vehicle
12/23/1999WO1999066559A1 Integrated silicon-on-insulator integrated circuit with decoupling capacity and method for making such a circuit
12/23/1999WO1999066557A1 Semiconductor device
12/23/1999WO1999066556A1 Vertically integrated microelectronic system and method for producing the same
12/23/1999WO1999066555A1 Method for determining the desired decoupling components for power distribution systems
12/23/1999WO1999066553A1 Member for lead
12/23/1999WO1999066552A1 A multichip module
12/23/1999WO1999066445A1 Method for producing an integrated circuit card and card produced according to said method
12/23/1999WO1999065388A1 Substrate sensor
12/23/1999DE19927873A1 Testing of chip-scale-housings for ICs with which plate is provided on which several chip-scale-housings are applied
12/23/1999DE19926128A1 Housing for semiconducting component
12/23/1999DE19826733A1 Kühlsystem für eine Leistungselektronik zum Betreiben wenigstens eines elektrischen Aggregats eines Kraftfahrzeugs A cooling system for a power electronics for operating at least one electrical unit of a motor vehicle
12/23/1999DE19813239C1 Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur A wiring method for producing a vertical integrated circuit structure and vertical integrated circuit structure
12/23/1999CA2333790A1 Method for producing an integrated circuit card and card produced according to said method
12/22/1999EP0966185A1 Printed wiring board and method of manufacturing the same
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