| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2000 | US6013583 Low temperature BPSG deposition process |
| 01/11/2000 | US6013578 Method for forming a metal wiring structure of a semiconductor device |
| 01/11/2000 | US6013572 Masking, plating silver on exposed layer, plating tin on silver and reflowing solder bumps |
| 01/11/2000 | US6013571 Microelectronic assembly including columnar interconnections and method for forming same |
| 01/11/2000 | US6013536 Apparatus for automated pillar layout and method for implementing same |
| 01/11/2000 | US6013535 Method for applying adhesives to a lead frame |
| 01/11/2000 | US6013357 Sintering aluminium nitride stack in presence of boron nitride release agent |
| 01/11/2000 | US6013356 Circuit board with high strength and high reliability and process for preparing the same |
| 01/11/2000 | US6013130 Process and device for the production of epitaxial layers |
| 01/11/2000 | US6013129 Production of heavily-doped silicon |
| 01/11/2000 | US6013109 Crack-resistance semiconductor package and fabrication method thereof and fabrication apparatus thereof |
| 01/11/2000 | US6012510 Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components |
| 01/11/2000 | US6012502 Apparatus for attaching adhesive tape to lead-on-chip leadframes |
| 01/11/2000 | US6012224 Method of forming compliant microelectronic mounting device |
| 01/10/2000 | CA2276951A1 Ceramic base material |
| 01/06/2000 | WO2000001208A1 Assembly of an electronic component with spring packaging |
| 01/06/2000 | WO2000001060A1 Electronic package assembly |
| 01/06/2000 | WO2000001013A1 Integrated electronic micromodule and method for making same |
| 01/06/2000 | WO2000001012A1 Hydrogenated oxidized silicon carbon material |
| 01/06/2000 | WO2000001006A1 Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication |
| 01/06/2000 | WO2000000929A2 Chip module for installation in a chip card carrier and method for the production thereof |
| 01/05/2000 | EP0969511A2 Power module board and power module using the board |
| 01/05/2000 | EP0969510A2 Chip arrangement |
| 01/05/2000 | EP0969509A1 Monolithic integrated circuit comprising a plane inductance or a plane transformer, and method of making such circuit |
| 01/05/2000 | EP0969508A2 Radiant-energy configurable fuse structure |
| 01/05/2000 | EP0969504A1 Semiconductor device |
| 01/05/2000 | EP0969502A2 Resin encapsulated electronic parts and method of manufacturing the same |
| 01/05/2000 | EP0969288A2 Test arrangement for bond pad |
| 01/05/2000 | EP0969066A2 Package encapsulants prepared from allyated amide compounds |
| 01/05/2000 | EP0969064A2 Method of making an electronic component using reworkable underfill encapsulants |
| 01/05/2000 | EP0969063A2 Package encapsulant compositions for use in electronic devices |
| 01/05/2000 | EP0969061A2 Underfill encapsulants prepared from allylated amide compounds |
| 01/05/2000 | EP0969060A2 Underfill encapsulant compositions for use in electronic devices |
| 01/05/2000 | EP0969058A2 Method of making encapsulated electronic component with reworkable package encapsulants |
| 01/05/2000 | EP0968632A2 Device for dissipating heat from a heat source located in a housing |
| 01/05/2000 | EP0968531A2 Device for low-inductive coupling of a gate turn-off thyristor to its control device |
| 01/05/2000 | EP0968529A2 Semiconductor device and method of manufacturing such a device |
| 01/05/2000 | EP0968526A2 Method of forming etched structures comprising implantation steps |
| 01/05/2000 | EP0968523A1 Method for forming a structured metallization on a semiconductor wafer |
| 01/05/2000 | EP0968522A1 Method of checking for the presence of connection balls |
| 01/05/2000 | EP0968394A1 Sorption refrigeration appliance |
| 01/05/2000 | EP0818132A4 A method to prevent intrusions into electronic circuitry |
| 01/05/2000 | EP0765179B1 Fire prevention device for electronics |
| 01/05/2000 | EP0761015B1 Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminium bonding layer |
| 01/05/2000 | DE19828653A1 Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung Chip module for incorporation into a chip card substrate, and methods for its preparation |
| 01/05/2000 | DE19826971A1 Mechanical and electric coupling integrated circuits |
| 01/05/2000 | CN2357414Y Improved semiconductor element lead wire frame |
| 01/05/2000 | CN1240537A Patterns of electrically conducting polymers and their application as electrodes or electrical contacts |
| 01/05/2000 | CN1240535A Chip module and manufacture of same |
| 01/05/2000 | CN1240470A Die attach adhesive compositions |
| 01/05/2000 | CN1240465A Thermally reworkable binders for flip-chip devices |
| 01/05/2000 | CN1240464A Thermosetting encapsulants for electronics packaging |
| 01/05/2000 | CN1048093C Package fora skmiconductor device |
| 01/05/2000 | CN1048072C Stirling cycle heat engine energy transducer |
| 01/04/2000 | US6011697 Constraining ring for use in electronic packaging |
| 01/04/2000 | US6011696 Cartridge and an enclosure for a semiconductor package |
| 01/04/2000 | US6011695 External bus interface printed circuit board routing for a ball grid array integrated circuit package |
| 01/04/2000 | US6011694 Ball grid array semiconductor package with solder ball openings in an insulative base |
| 01/04/2000 | US6011692 Chip supporting element |
| 01/04/2000 | US6011691 Electronic component assembly and method for low cost EMI and capacitive coupling elimination |
| 01/04/2000 | US6011684 Monolithic integrated multiple electronic components internally interconnected and externally connected by conductive side castellations to the monolith that are of varying width particularly monolithic multiple capacitors |
| 01/04/2000 | US6011330 Miniature power supply |
| 01/04/2000 | US6011315 Semiconductor device and film carrier tape and respective manufacturing methods thereof |
| 01/04/2000 | US6011314 Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps |
| 01/04/2000 | US6011313 Flip chip interconnections on electronic modules |
| 01/04/2000 | US6011312 Flip-chip semiconductor package |
| 01/04/2000 | US6011311 Multilevel interconnect structure for integrated circuits |
| 01/04/2000 | US6011310 Film carrier and semiconductor device using the same |
| 01/04/2000 | US6011309 Wiring structure of thin film transistor array and method of manufacturing the same |
| 01/04/2000 | US6011308 Semiconductor device having a barrier film formed to prevent the entry of moisture and method of manufacturing the same |
| 01/04/2000 | US6011307 Anisotropic conductive interconnect material for electronic devices, method of use and resulting product |
| 01/04/2000 | US6011306 Semiconductor device and method for fabricating same |
| 01/04/2000 | US6011305 Semiconductor device having metal alloy for electrodes |
| 01/04/2000 | US6011304 Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid |
| 01/04/2000 | US6011303 Electronic component |
| 01/04/2000 | US6011302 Semiconductor device with reduced amount of sealing resin |
| 01/04/2000 | US6011300 Semiconductor integrated circuit device |
| 01/04/2000 | US6011299 Apparatus to minimize integrated circuit heatsink E.M.I. radiation |
| 01/04/2000 | US6011220 Semiconductor packaged device and lead frame used therein |
| 01/04/2000 | US6011216 Heat-generating element cooling device |
| 01/04/2000 | US6010965 Method of forming high integrity vias |
| 01/04/2000 | US6010959 Method of improving photoresist adhesion on a dielectric layer |
| 01/04/2000 | US6010957 Semiconductor device having tapered conductive lines and fabrication thereof |
| 01/04/2000 | US6010955 Electrical connection forming process for semiconductor devices |
| 01/04/2000 | US6010953 Method for forming a semiconductor buried contact with a removable spacer |
| 01/04/2000 | US6010952 Process for forming metal silicide contacts using amorphization of exposed silicon while minimizing device degradation |
| 01/04/2000 | US6010945 Method for preventing alignment marks from disappearing after chemical mechanical polishing |
| 01/04/2000 | US6010915 High performance debug I/O |
| 01/04/2000 | US6010914 Method for manufacturing a semiconductor device |
| 01/04/2000 | US6010769 Multilayer wiring board and method for forming the same |
| 01/04/2000 | US6009938 Extruded, tiered high fin density heat sinks and method of manufacture |
| 01/04/2000 | US6009937 Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same |
| 01/04/2000 | US6009712 Temperature controller of optical module package |
| 12/30/1999 | DE19928570A1 Semiconductor device, especially a multilayer circuit structure, production process |
| 12/30/1999 | DE19928291A1 Sensor structure with physically isolated, electrically connected structures, e.g. acceleration sensor |
| 12/29/1999 | WO1999067823A1 Integrated circuit having a level of metallization of variable thickness |
| 12/29/1999 | WO1999067822A1 Integrated circuit module with one surface comprising an electrically insulated peripheral zone of the integrated circuit, and mixed connection card comprising such a module |
| 12/29/1999 | WO1999067821A1 Plastic integrated circuit package and method and leadframe for making the package |
| 12/29/1999 | WO1999067818A1 Device and method for forming a device having a cavity with controlled atmosphere |
| 12/29/1999 | WO1999067811A2 Electronic device having fibrous interface |