| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/2000 | WO2000003829A1 Solder ball placement apparatus |
| 01/27/2000 | WO1998047968A9 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 01/27/2000 | DE19932540A1 Microstrip line waveguide converter structure, for an IC package for millimeter waveband signal transmission, comprises a dielectric support bearing a microstrip line with widened sections enclosed by a waveguide section |
| 01/27/2000 | DE19932399A1 Encapsulation of semiconductor device using an encapsulation material containing quartz ware filler |
| 01/27/2000 | DE19928075A1 Dynamic random access memory module |
| 01/27/2000 | DE19901897A1 Resin-encapsulated semiconductor component with enclosed lead frame to suppress crack propagation due to stresses, for protecting enclosed semiconductor element |
| 01/27/2000 | DE19846456A1 Electronic component with semiconductor component and lead frame |
| 01/27/2000 | DE19832706A1 Chip format semiconductor device has external connection metal balls placed on conductive adhesive or solder paste fillings in via holes to prevent stress transfer to connections between the soldered device and a printed circuit board |
| 01/27/2000 | DE19831634A1 Chip carrier device production for an encased chip arrangement with an electrical test simplifies chip contact mechanism on substrates by a strip conductor structure and through-plating |
| 01/27/2000 | CA2341899A1 Solder ball placement apparatus |
| 01/27/2000 | CA2303224A1 Optical device/electronic circuit housing device and getter assembly |
| 01/26/2000 | EP0975019A2 Chip mounting board and method of measuring it |
| 01/26/2000 | EP0975017A2 Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication |
| 01/26/2000 | EP0974817A1 Circuit board and detector, and method for manufacturing the same |
| 01/26/2000 | EP0974565A1 Aluminum nitride sintered body and method of preparing the same |
| 01/26/2000 | EP0974163A2 Module tape with modules for dual-mode data carriers |
| 01/26/2000 | EP0974162A1 A low-stress and low-resistivity metal film |
| 01/26/2000 | CN2361002Y Plugging slot connector module device |
| 01/26/2000 | CN1242873A Laser based method and system for integrated circuit repair or reconfigration |
| 01/26/2000 | CN1242604A 半导体保护器件和功率转换器件 Semiconductor protection devices and power conversion devices |
| 01/26/2000 | CN1242603A Wiring board for bump bonding, semiconductor device assembled from wiring board and mfg. method of wiring board for bump bonding |
| 01/26/2000 | CN1242602A Wafer-scale package structure and circuit board used therein |
| 01/26/2000 | CN1242595A Silicon oxynitride cap for fluorinated silicate glass film in intermetal dielectric semiconductor fabrication |
| 01/26/2000 | CN1242404A Epoxy resin composition for bonding semiconductor chips |
| 01/26/2000 | CN1242349A Aluminum nitride sintered body and method of preparing the same |
| 01/26/2000 | CN1048824C Chip carrier and method for producing same,and use thereof |
| 01/25/2000 | US6018686 Electrically imprinting a semiconductor die with identifying information |
| 01/25/2000 | US6018465 Apparatus for mounting a chip package to a chassis of a computer |
| 01/25/2000 | US6018463 Large non-hermetic multichip module package |
| 01/25/2000 | US6018462 Multi-tip module |
| 01/25/2000 | US6018460 Flexible thermal conductor with electromagnetic interference shielding capability for electronic components |
| 01/25/2000 | US6018459 Porous metal heat sink |
| 01/25/2000 | US6018448 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2000 | US6018249 Test system with mechanical alignment for semiconductor chip scale packages and dice |
| 01/25/2000 | US6018197 Wired board with improved bonding pads |
| 01/25/2000 | US6018195 MOS gate structure semiconductor device |
| 01/25/2000 | US6018193 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| 01/25/2000 | US6018192 Electronic device with a thermal control capability |
| 01/25/2000 | US6018191 Semiconductor device |
| 01/25/2000 | US6018189 Lead frame for face-down bonding |
| 01/25/2000 | US6018188 Semiconductor device |
| 01/25/2000 | US6018185 Semiconductor device with element isolation film |
| 01/25/2000 | US6018183 Structure of manufacturing an electrostatic discharge protective circuit for SRAM |
| 01/25/2000 | US6018167 Light-emitting device |
| 01/25/2000 | US6017829 Forming dielectric layer upon semiconductor substrate; doping metal into dielectric layer to form electrically conductive structure within dielectric layer that extends to top surface of dielectric layer |
| 01/25/2000 | US6017824 Forming silicon oxide layer on fuse structures on integrated circuits; forming polysilicon shape on top surface of silicon oxide; forming via holes in dielectric layers; exposing portion of top surface of polysilicon shape; forming spacers |
| 01/25/2000 | US6017814 Structure and fabrication method for stackable, air-gap-containing low epsilon dielectric layers |
| 01/25/2000 | US6017813 Method for fabricating a damascene landing pad |
| 01/25/2000 | US6017812 Bump bonding method and bump bonding apparatus |
| 01/25/2000 | US6017778 Method for making power integrated circuit |
| 01/25/2000 | US6017777 Method of forming a plating layer of a lead frame |
| 01/25/2000 | US6017776 Method of attaching a leadframe to singulated semiconductor dice |
| 01/25/2000 | US6017662 Method of reducing laser mark peeling |
| 01/25/2000 | US6017642 Low dielectric loss glasses |
| 01/25/2000 | US6017634 Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
| 01/25/2000 | US6017614 Plasma-enhanced chemical vapor deposited SIO2 /SI3 N4 multilayer passivation layer for semiconductor applications |
| 01/25/2000 | US6017485 Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck |
| 01/25/2000 | US6017185 Fan fixing structure of a radiator |
| 01/25/2000 | CA2161569C Circuit element mounting structure |
| 01/20/2000 | WO2000003576A2 Process and apparatus for manufacturing semiconductor devices |
| 01/20/2000 | WO2000003574A2 Heat sink with transverse ribs |
| 01/20/2000 | WO2000003573A1 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module |
| 01/20/2000 | WO2000003572A1 Printed wiring board and method for producing the same |
| 01/20/2000 | WO2000003571A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 01/20/2000 | WO2000003567A1 A thermal management device and method of making such a device |
| 01/20/2000 | WO2000003439A1 Noise and temperature shield for an integrated circuit |
| 01/20/2000 | WO2000003438A1 Interconnection for integrated high voltage electronic devices |
| 01/20/2000 | WO2000003437A1 Circuit and a method for the production thereof |
| 01/20/2000 | WO2000003435A2 A capsule for semiconductor components |
| 01/20/2000 | WO2000003433A1 Misalignment tolerant techniques for dual damascene fabrication |
| 01/20/2000 | WO2000003429A1 Thin-layered semiconductor structure comprising a heat distribution layer |
| 01/20/2000 | DE19932953A1 Power semiconductor e.g. MOSFET or IGBT heat sink sandwich structure |
| 01/20/2000 | DE19921015A1 Adjustment mark for detecting location of coupling layer on insulation layer of semiconductor component |
| 01/20/2000 | DE19912490A1 Semiconductor memory with cut fuse layer for controlling redundant circuit |
| 01/20/2000 | DE19903208A1 Fused semiconductor device e.g. semiconductor memory with redundant memory cells has silicon oxide layer on either side of metal fuse for preventing fuse corrosion |
| 01/20/2000 | DE19857256A1 IC (integrated circuit) socket for IC with multiple parallel pins |
| 01/20/2000 | DE19832450A1 Heat sink for surface mounted power semiconductor device |
| 01/20/2000 | DE19831570A1 Biometrical sensor for fingerprint identification for mobile phone |
| 01/20/2000 | DE19831282A1 Semiconductor cooler system for rectifiers of electric rail cars |
| 01/20/2000 | DE19830159A1 Chip-module with high density interconnect wiring substrate carrier |
| 01/20/2000 | DE19829716A1 Arrangement for measuring temperature distribution in areas and spaces inside integrated circuits: comprises sensors close to heat sources and closely linked temperature signal evaluation circuit |
| 01/20/2000 | CA2336936A1 A capsule for semiconductor components |
| 01/19/2000 | EP0973199A2 Semiconductor device comprising a composite layer structure |
| 01/19/2000 | EP0973198A2 System and method for bonding over active integrated curcuits |
| 01/19/2000 | EP0973197A2 Wafer-scale package structure and circuit board used therein |
| 01/19/2000 | EP0973196A2 Barium titanate powder, semiconductor ceramic, and semiconducting ceramic electronic element |
| 01/19/2000 | EP0973195A1 Silver metallization by damascene method |
| 01/19/2000 | EP0973194A1 Semiconductor device and manufacturing method thereof |
| 01/19/2000 | EP0973193A2 Method of preparing an electronic package by co-curing adhesive and encapsulant |
| 01/19/2000 | EP0973108A2 Field programmable printed circuit board |
| 01/19/2000 | EP0972632A1 A data card comprising a laser recording medium and a thin glass layer |
| 01/19/2000 | EP0972308A1 Interconnect design with controlled inductance |
| 01/19/2000 | EP0972307A4 Multi-chip device and method of fabrication employing leads over and under processes |
| 01/19/2000 | EP0972307A1 Multi-chip device and method of fabrication employing leads over and under processes |
| 01/19/2000 | EP0972306A1 Folded fin heat sink and fan attachment |
| 01/19/2000 | EP0972303A1 Low dielectric constant material with improved dielectric strength |
| 01/19/2000 | EP0972295A2 Unit for switching electrical energy |
| 01/19/2000 | EP0972268A1 Method for making a contactless card with antenna connected with soldered wires |
| 01/19/2000 | EP0972166A1 Apparatus and method for cooling an electronic heat source |
| 01/19/2000 | EP0912335A4 Conductive elastomers and methods for fabricating the same |