| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/19/2000 | EP0799497B1 Semiconductor device with first and second level interconnects separated by low dielectric constant material and method of making the same |
| 01/19/2000 | CN1242108A Surface connectable semiconductor bridge elements, devices and methods |
| 01/19/2000 | CN1242107A Electroplated interconnection structures on integrated circuit chips |
| 01/19/2000 | CN1242105A Resin-encapsulated semiconductor device and method for manufacturing the same |
| 01/19/2000 | CN1241817A Semiconductor memory and manufacturing method thereof |
| 01/19/2000 | CN1241815A Chip size package and method of fabricating the same |
| 01/19/2000 | CN1241814A IC socket for holding IC having multiple parallet pins |
| 01/19/2000 | CN1241810A Semiconductor fuse |
| 01/19/2000 | CN1241808A Device and method for connecting two electronic components |
| 01/18/2000 | USRE36518 Method for making electrical contact with an active area through sub-micron contact openings and a semiconductor device |
| 01/18/2000 | US6016256 Multi-chip module having interconnect dies |
| 01/18/2000 | US6016250 Self-balancing thermal control device for integrated circuits |
| 01/18/2000 | US6016087 Coupled microstrip lines |
| 01/18/2000 | US6016062 Process related damage monitor (predator)--systematic variation of antenna parameters to determine charge damage |
| 01/18/2000 | US6016012 In channel between a dielectric material and conductive material deposited on surface of a dielectric material |
| 01/18/2000 | US6016011 Method and apparatus for a dual-inlaid damascene contact to sensor |
| 01/18/2000 | US6016008 Integrated circuit interconnection employing tungsten/aluminum layers |
| 01/18/2000 | US6016007 Power electronics cooling apparatus |
| 01/18/2000 | US6016006 Thermal grease insertion and retention |
| 01/18/2000 | US6016005 Multilayer, high density micro circuit module and method of manufacturing same |
| 01/18/2000 | US6016004 Method and apparatus for epoxy loc die attachment |
| 01/18/2000 | US6016003 Chip-lead interconnection structure in a semiconductor device |
| 01/18/2000 | US6016002 Stacked silicon-controlled rectifier having a low voltage trigger and adjustable holding voltage for ESD protection |
| 01/18/2000 | US6016001 Metal to amorphous silicon to metal anti-fuse structure |
| 01/18/2000 | US6016000 Ultra high-speed chip semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectrics |
| 01/18/2000 | US6015955 Reworkability solution for wirebound chips using high performance capacitor |
| 01/18/2000 | US6015751 Self-aligned connection to underlayer metal lines through unlanded via holes |
| 01/18/2000 | US6015750 Method for improving visibility of alignment target in semiconductor processing |
| 01/18/2000 | US6015749 Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure |
| 01/18/2000 | US6015744 Method of manufacturing a shallow trench isolation alignment mark |
| 01/18/2000 | US6015727 Damascene formation of borderless contact MOS transistors |
| 01/18/2000 | US6015723 Lead frame bonding distribution methods |
| 01/18/2000 | US6015722 Minimizing mechanical stresses between chip and chip package or interconnection circuit device |
| 01/18/2000 | US6015718 Indentification of the composition of particles in a process chamber |
| 01/18/2000 | US6015717 Method for monitoring rapid thermal process integrity |
| 01/18/2000 | US6015301 Surface mount socket |
| 01/18/2000 | US6015152 Seal retainer having an indicator |
| 01/18/2000 | US6015083 Direct solder bumping of hard to solder substrate |
| 01/18/2000 | US6015081 Electrical connections using deforming compression |
| 01/18/2000 | US6015008 Heat radiating plate |
| 01/18/2000 | US6014999 Apparatus for making thermally conductive film |
| 01/18/2000 | CA2186488C Thermal management system |
| 01/13/2000 | WO2000002430A1 Molded housing with integral heatsink |
| 01/13/2000 | WO2000002246A1 Double-sided electronic device |
| 01/13/2000 | WO2000002245A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002244A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 01/13/2000 | WO2000002243A1 Semiconductor device, method of manufacture, circuit board, and electronic device |
| 01/13/2000 | DE19907070A1 Semiconductor device with contact vias extending through an interlayer insulation layer |
| 01/13/2000 | DE19905719A1 Integrated semiconductor circuit with test connections |
| 01/13/2000 | DE19844966A1 Semiconductor element for chip card module |
| 01/13/2000 | DE19830424A1 Formteil zur Halterung von Kühlkörpern in einem Spannstapel Molding for mounting heat sinks in a chip stack |
| 01/12/2000 | EP0971420A1 Packaged electronic part having mounting leg |
| 01/12/2000 | EP0971418A2 Semiconductor device having reduced effective substrate resistivity and associated methods |
| 01/12/2000 | EP0971411A2 Semiconductor device |
| 01/12/2000 | EP0971410A2 Integrated circuit carrier package with battery coin cell |
| 01/12/2000 | EP0971409A1 Method for forming copper-containing metal studs |
| 01/12/2000 | EP0971408A2 Molded Part Holding a Heatsink in a Press Stack |
| 01/12/2000 | EP0971407A1 Thermal conductive unit and thermal connection structure using same |
| 01/12/2000 | EP0971406A2 Chip-sized semiconductor device |
| 01/12/2000 | EP0971405A2 Method for manufacturing a substrate for a polymer stud grid array |
| 01/12/2000 | EP0971403A1 Method for forming copper-containing metal studs |
| 01/12/2000 | EP0971402A2 Wafer for heavy metal monitoring and method for manufacturing same |
| 01/12/2000 | EP0971009A2 Adhesive composition for bonding semiconductor chips |
| 01/12/2000 | EP0970932A1 Ceramic base material |
| 01/12/2000 | EP0970522A1 Bga connector with heat activated connection and disconnection means |
| 01/12/2000 | EP0970521A1 Improved solder joint reliability |
| 01/12/2000 | EP0970520A2 Mounting structure and mounting process from semiconductor devices |
| 01/12/2000 | EP0970494A1 Subassembly for switching electric energy |
| 01/12/2000 | EP0970480A1 Vertically interconnected electronic assemblies and compositions useful therefor |
| 01/12/2000 | EP0970437A1 Electronic module for chip card |
| 01/12/2000 | EP0970334A1 Coaxial waveguide applicator for an electromagnetic wave-activated sorption system |
| 01/12/2000 | EP0970333A1 Electromagnetic wave-activated sorption refrigeration system |
| 01/12/2000 | EP0970332A1 Method and apparatus for cooling electrical components |
| 01/12/2000 | EP0969964A1 A thermal storage and transfer device |
| 01/12/2000 | EP0835600A4 Perimeter matrix ball grid array circuit package with a populated center |
| 01/12/2000 | CN2358558Y Flexible heat-conducting pad |
| 01/12/2000 | CN1241353A System and method for packaging integrated circuits |
| 01/12/2000 | CN1241297A High density electrical connectors |
| 01/12/2000 | CN1241032A Highly integrated chip-on-chip packaging |
| 01/12/2000 | CN1241028A Method for manufacturing semiconductor device capable of effectively carrying out hydrogen passivation |
| 01/12/2000 | CN1241024A Method for fabricating DRAM cell capacitor |
| 01/12/2000 | CN1241000A Fuse circuit and redundant decoder |
| 01/12/2000 | CN1048359C Flexible wiring board having terminal array and its connection structure with circuit board |
| 01/11/2000 | US6014318 Resin-sealed type ball grid array IC package and manufacturing method thereof |
| 01/11/2000 | US6014317 Chip package mounting structure for controlling warp of electronic assemblies due to thermal expansion effects |
| 01/11/2000 | US6014315 Heat sink assembly with multiple pressure capability |
| 01/11/2000 | US6014314 Package structure of a multi-chip module |
| 01/11/2000 | US6014312 Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink |
| 01/11/2000 | US6013954 Semiconductor wafer having distortion-free alignment regions |
| 01/11/2000 | US6013953 Semiconductor device with improved connection reliability |
| 01/11/2000 | US6013952 Structure and method for measuring interface resistance in multiple interface contacts and via structures in semiconductor devices |
| 01/11/2000 | US6013951 Semiconductor device having an improved lead connection structure and manufacturing method thereof |
| 01/11/2000 | US6013948 Stackable chip scale semiconductor package with mating contacts on opposed surfaces |
| 01/11/2000 | US6013946 Wire bond packages for semiconductor chips and related methods and assemblies |
| 01/11/2000 | US6013945 Electronic module for data cards |
| 01/11/2000 | US6013944 Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board |
| 01/11/2000 | US6013939 Monolithic inductor with magnetic flux lines guided away from substrate |
| 01/11/2000 | US6013935 Solid-state switch driven by thermovoltaic generator |
| 01/11/2000 | US6013877 Solder bonding printed circuit boards |
| 01/11/2000 | US6013713 A paste for forming an electroconductive coatings on a c4 bump, comprising metallic particles selected from the group consisting of au, sn and au/sn alloy suspended in solvent solution; forming a coatings for testing integrated circuit |