| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/2000 | US6022763 Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof |
| 02/08/2000 | US6022762 Process for forming a morphological edge structure to seal integrated electronic devices |
| 02/08/2000 | US6022761 Method for coupling substrates and structure |
| 02/08/2000 | US6022759 Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit |
| 02/08/2000 | US6022758 Process for manufacturing solder leads on a semiconductor device package |
| 02/08/2000 | US6022757 Semiconductor device and manufacturing method |
| 02/08/2000 | US6022670 Hydrophobic photoimagable dielectric filmn in solvent;metallization |
| 02/08/2000 | US6022583 Dispensing series of discrete, single-point droplets and series of continuous beads within an area bounded by a dam, the encapsulant material spreading out from droplets and continuous beads to form encapsulating layer over the wire |
| 02/08/2000 | US6022426 Controlled oxygen content copper clad laminate, |
| 02/08/2000 | US6022225 Electrical assembly |
| 02/08/2000 | US6021844 Heat exchange apparatus |
| 02/08/2000 | US6021670 Semiconductor acceleration detecting device with shock absorbing structure |
| 02/08/2000 | US6021564 Method for reducing via inductance in an electronic assembly and article |
| 02/08/2000 | US6021563 Marking Bad printed circuit boards for semiconductor packages |
| 02/03/2000 | WO2000005773A1 Integrated circuit interconnect lines having sidewall layers |
| 02/03/2000 | WO2000005765A1 Method for producing rewiring substrates for semiconductor chip packages |
| 02/03/2000 | WO2000005756A1 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher |
| 02/03/2000 | WO2000005748A2 Blind pin placement on circuit boards |
| 02/03/2000 | WO2000005747A2 Metallization structures for microelectronic applications and process for forming the structures |
| 02/03/2000 | WO2000005734A1 Ultra-miniature magnetic device |
| 02/03/2000 | WO2000004955A1 Safety unit |
| 02/03/2000 | WO1999048143A3 Method of manufacturing semiconductor devices with 'chip size package' |
| 02/03/2000 | DE19935804A1 Encapsulated chip, especially an encapsulated integrated millimeter wave circuit, comprises interconnectors on a substrate-mountable base having wave-guide openings |
| 02/02/2000 | EP0977298A2 High-frequency module |
| 02/02/2000 | EP0977263A2 Apparatus and method for reducing propagation delay in a conductor |
| 02/02/2000 | EP0977262A2 Integrated semiconductor chip with modular dummy structures |
| 02/02/2000 | EP0977261A1 Pressure contact type semiconductor device and power application device |
| 02/02/2000 | EP0977260A2 Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same |
| 02/02/2000 | EP0977259A2 Semiconductor device and method of producing the same |
| 02/02/2000 | EP0977251A1 Resin sealed semiconductor device and method for manufacturing the same |
| 02/02/2000 | EP0976163A1 Electric supply source for semiconductor components |
| 02/02/2000 | EP0976160A1 Integrated circuit package |
| 02/02/2000 | EP0976156A1 Integrated circuit with several components and method for the production thereof |
| 02/02/2000 | EP0976155A1 High-voltage, high-current multilayer circuit board, method for the production thereof |
| 02/02/2000 | EP0976154A1 Emc-optimised power switch |
| 02/02/2000 | EP0976153A1 Nanoporous dielectric films with graded density and process for making such films |
| 02/02/2000 | CN2362257Y Cooling device for electronic element and device |
| 02/02/2000 | CN1243601A Mounting structure and mounting process for semiconductor devices |
| 02/02/2000 | CN1243526A Thermosetting resin compositions |
| 02/02/2000 | CN1243337A Improved interconnection of device |
| 02/02/2000 | CN1243105A Composite welded glass with low melt temp., its filling material and using method thereof |
| 02/02/2000 | CN1049070C Semiconductor device and method for fabricating same |
| 02/02/2000 | CN1049069C Method for forming multilevel interconnections in semiconductor device |
| 02/01/2000 | US6021048 High speed memory module |
| 02/01/2000 | US6021045 Heat sink assembly with threaded collar and multiple pressure capability |
| 02/01/2000 | US6021044 Heatsink assembly |
| 02/01/2000 | US6020820 CPU over-heat protection detection device |
| 02/01/2000 | US6020746 Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die |
| 02/01/2000 | US6020745 Method of batch testing surface mount devices using a substrate edge connector |
| 02/01/2000 | US6020649 Plastic molded semiconductor package and a method for producing the same |
| 02/01/2000 | US6020648 Die structure using microspheres as a stress buffer for integrated circuit prototypes |
| 02/01/2000 | US6020647 Composite metallization structures for improved post bonding reliability |
| 02/01/2000 | US6020645 Semiconductor device with semiconductor chip bonded face down on circuit-carrying substrate |
| 02/01/2000 | US6020642 Interconnection system in a semiconductor device |
| 02/01/2000 | US6020641 Multilevel interconnection with low contact resistance in a semiconductor device |
| 02/01/2000 | US6020640 Thick plated interconnect and associated auxillary interconnect |
| 02/01/2000 | US6020638 Packaging structure of BGA type semiconductor device mounted on circuit substrate |
| 02/01/2000 | US6020637 Ball grid array semiconductor package |
| 02/01/2000 | US6020636 Kilowatt power transistor |
| 02/01/2000 | US6020635 Converter socket terminal |
| 02/01/2000 | US6020634 Replaceable power module |
| 02/01/2000 | US6020631 Method and apparatus for connecting a bondwire to a bondring near a via |
| 02/01/2000 | US6020630 Tape automated bonding package for a semiconductor chip employing corner member cross-slots |
| 02/01/2000 | US6020626 Semiconductor device |
| 02/01/2000 | US6020625 Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
| 02/01/2000 | US6020624 Semiconductor package with bi-substrate die |
| 02/01/2000 | US6020616 Automated design of on-chip capacitive structures for suppressing inductive noise |
| 02/01/2000 | US6020613 Field effect transistor array including resistive interconnections |
| 02/01/2000 | US6020612 Semiconductor integrated circuit having efficient layout of wiring lines |
| 02/01/2000 | US6020597 Repairable multichip module |
| 02/01/2000 | US6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof |
| 02/01/2000 | US6020409 Curable; crosslinking |
| 02/01/2000 | US6020266 Single step electroplating process for interconnect via fill and metal line patterning |
| 02/01/2000 | US6020263 Method of recovering alignment marks after chemical mechanical polishing of tungsten |
| 02/01/2000 | US6020249 Method for photo alignment after CMP planarization |
| 02/01/2000 | US6020245 Method of manufacturing semiconductor device where characteristics can be measured at manufacture |
| 02/01/2000 | US6020229 Semiconductor device method for manufacturing |
| 02/01/2000 | US6020222 Silicon oxide insulator (SOI) semiconductor having selectively linked body |
| 02/01/2000 | US6020221 Process for manufacturing a semiconductor device having a stiffener member |
| 02/01/2000 | US6020220 Compliant semiconductor chip assemblies and methods of making same |
| 02/01/2000 | US6020219 Method of packaging fragile devices with a gel medium confined by a rim member |
| 02/01/2000 | US6020218 Method of manufacturing ball grid array semiconductor package |
| 02/01/2000 | US6020215 Process for manufacturing microstructure |
| 02/01/2000 | US6020111 Method of manufacturing semiconductor device with patterned lamination of Si film and metal film |
| 02/01/2000 | US6020048 Thick film circuit board and method of forming wire bonding electrode thereon |
| 02/01/2000 | US6019886 Comparator for monitoring the deposition of an electrically conductive material on a leadframe to warn of improper operation of a leadframe electroplating process |
| 02/01/2000 | US6019883 Process for producing a deposit on a removable support |
| 02/01/2000 | US6019523 Optical semiconductor module and method for manufacturing same |
| 02/01/2000 | US6019274 Semiconductor device and mounting method therefor |
| 02/01/2000 | US6019167 Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
| 02/01/2000 | US6019165 Heat exchange apparatus |
| 02/01/2000 | US6018866 Apparatus and method for printed circuit board repair |
| 01/27/2000 | WO2000004585A2 Chip carrier device and method for the production of a chip carrier device with an electrical test |
| 01/27/2000 | WO2000004584A2 Semiconductor component in a chip format and method for the production thereof |
| 01/27/2000 | WO2000004582A1 Temperature control of electronic devices using power following feedback |
| 01/27/2000 | WO2000004581A1 Passivation layer for power semiconductors with pn junctions appearing on the surface |
| 01/27/2000 | WO2000004580A1 Optical device, electronic device enclosure, and getter assembly |
| 01/27/2000 | WO2000004579A1 Process for mapping metal contaminant concentration on a silicon wafer surface |
| 01/27/2000 | WO2000004577A1 Method for producing a ceramic body having an integrated passive electronic component, such a body and use of same |
| 01/27/2000 | WO2000004491A1 Biometric sensor and corresponding production method |