| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/15/2000 | US6025647 Apparatus for equalizing signal parameters in flip chip redistribution layers |
| 02/15/2000 | US6025646 Vertical MOSFET having penetrating wiring layers |
| 02/15/2000 | US6025645 Semiconductor device and method of manufacturing the same |
| 02/15/2000 | US6025643 Device for dissipating heat from a semiconductor element |
| 02/15/2000 | US6025642 Ultra high density integrated circuit packages |
| 02/15/2000 | US6025641 Tape automated bonding (tab) tapes having underlying camber suppressing films to inhibit warping |
| 02/15/2000 | US6025640 Resin-sealed semiconductor device, circuit member for use therein and method of manufacturing resin-sealed semiconductor device |
| 02/15/2000 | US6025638 Structure for precision multichip assembly |
| 02/15/2000 | US6025637 Spacer-based antifuse structure for low capacitance and high reliability and method of fabrication thereof |
| 02/15/2000 | US6025634 Integrated circuit having formed therein low contact leakage and low contact resistance integrated circuit device electrode |
| 02/15/2000 | US6025632 Semiconductor integrated circuit with tungston silicide nitride thermal resistor |
| 02/15/2000 | US6025631 Electrostatic discharge (ESD) protective device for integrated circuit packages with no-connect pins |
| 02/15/2000 | US6025609 Laser synthesized ceramic electronic devices and circuits and method for making |
| 02/15/2000 | US6025277 Method and structure for preventing bonding pad peel back |
| 02/15/2000 | US6025275 Forming bonds directly on thick plated interconnect, eliminating high parasitic series resistance associated with bond pads |
| 02/15/2000 | US6025273 Carbon atoms released from carbon doped polysilicon hard mask during contact hole etching reduce free oxygen and contamination buildup and increase etch rate of dielectric layer |
| 02/15/2000 | US6025265 Method of forming a landing pad structure in an integrated circuit |
| 02/15/2000 | US6025264 Forming organic low-k dielectric layer over conductive layer on semiconductor substrate, forming opening, forming doped silicon barrier layer over sides, depositing second barrier layer and conductive layer, polishing to expose dielectric |
| 02/15/2000 | US6025262 Patterning to produce conductive runners, applying passivation layer of silicon dioxide, planarizing by chemical mechanical polishing, applying overcoating layer of silicon nitride, etching to bonding pads associated with runners |
| 02/15/2000 | US6025256 Laser based method and system for integrated circuit repair or reconfiguration |
| 02/15/2000 | US6025214 Fusible link structure for semiconductor devices |
| 02/15/2000 | US6025212 Method for attaching semiconductor dice to lead-on-chip leadframes |
| 02/15/2000 | US6024466 Electronic parts holder |
| 02/15/2000 | US6024274 Method for tape automated bonding to composite bumps |
| 02/15/2000 | US6023934 Methods and apparatus for cooling systems for cryogenic power conversion electronics |
| 02/15/2000 | US6023853 Method for cleaning molding compound tablets |
| 02/15/2000 | US6023827 Cam heat sink clip installation and removal tool and method |
| 02/10/2000 | WO2000007421A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 02/10/2000 | WO2000007419A1 Production method for flexible substrate |
| 02/10/2000 | WO2000007417A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
| 02/10/2000 | WO2000007247A1 Lead frame attachment for optoelectronic device |
| 02/10/2000 | WO2000007242A1 Conductor frame, printed circuit board with a conductor frame and a method for producing a conductor frame |
| 02/10/2000 | WO2000007241A1 Buried local interconnect |
| 02/10/2000 | WO2000007240A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 02/10/2000 | WO2000007239A1 Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
| 02/10/2000 | WO2000007238A1 Electrically isolated power semiconductor package |
| 02/10/2000 | WO2000007236A2 Method and apparatus for forming improved metal interconnects |
| 02/10/2000 | WO2000007235A1 Semiconductor device, method of manufacture thereof, semiconductor module, and electronic device including circuit board and electronic unit board |
| 02/10/2000 | WO2000007234A1 Semiconductor device and method for manufacturing the same |
| 02/10/2000 | WO2000007233A1 An improved method of planarizing thin film layers deposited over a common circuit base |
| 02/10/2000 | WO2000007229A1 A system and a method for plating of a conductive pattern |
| 02/10/2000 | WO2000007227A1 Electronic device with a thermal control capability |
| 02/10/2000 | WO2000007225A2 Method of and apparatus for sealing an hermetic lid to a microelectronic machine |
| 02/10/2000 | WO2000007222A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 02/10/2000 | WO2000007219A2 High density printed circuit substrate and method of fabrication |
| 02/10/2000 | WO2000007218A2 Method for manufacturing a semiconductor device having a metal layer floating over a substrate |
| 02/10/2000 | WO2000006902A1 Bearing for refrigerating machine compressor and compressor |
| 02/10/2000 | WO1999066445A8 Method for producing an integrated circuit card and card produced according to said method |
| 02/10/2000 | WO1999057330A9 Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition |
| 02/10/2000 | DE19924934A1 Surface mountable electronic package for high frequency digital applications |
| 02/10/2000 | DE19915065A1 Semiconductor module with improved heat dissipation; has power component and control component chip on fastening face of carrier |
| 02/10/2000 | DE19900534A1 Air-cooled electronic device with a circuit board and an integrated circuit module has a heat transmission device to conduct heat by connecting to a heat sink in a cool air channel |
| 02/10/2000 | DE19834234A1 Integrierter Halbleiterchip mit modularen Füllstrukturen Integrated semiconductor chip with modular dummy |
| 02/10/2000 | DE19833707A1 Cooler for fluid cooling electronic component; has long thin cooling channel with length between twenty and two hundred times its height |
| 02/10/2000 | DE19831563A1 Semiconductor chips testing arrangement |
| 02/10/2000 | CA2338993A1 Lead frame attachment for optoelectronic device |
| 02/10/2000 | CA2338691A1 Method of and apparatus for sealing a hermetic lid to a semiconductor die |
| 02/10/2000 | CA2338335A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 02/09/2000 | EP0978876A2 Millimeter wave semiconductor device |
| 02/09/2000 | EP0978875A1 Integrated circuit comprising conductive lines with "negative" profile and related method of fabrication |
| 02/09/2000 | EP0978874A2 Cooling apparatus |
| 02/09/2000 | EP0978871A2 A low power packaging design |
| 02/09/2000 | EP0978542A1 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 02/09/2000 | EP0978144A2 Semiconductor device comprising a mos transistor |
| 02/09/2000 | EP0977797A1 Organohydridosiloxane resins with high organic content |
| 02/09/2000 | EP0977795A1 Synthesis of siloxane resins |
| 02/09/2000 | EP0852811A4 An integrated circuit package with permanent identification of device characteristics and method for adding the same |
| 02/09/2000 | CN1244038A Resin composition for semiconductor package |
| 02/09/2000 | CN1244037A Manufacture of semiconductor device |
| 02/09/2000 | CN1244034A Semiconductor device and manufacture thereof, electric circuit board and electronic device therefor |
| 02/09/2000 | CN1244028A Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same |
| 02/09/2000 | CN1244027A Method for transferring miniature machined block including integrated circuits |
| 02/08/2000 | US6023481 Module having Peltier element |
| 02/08/2000 | US6023413 Cooling structure for multi-chip module |
| 02/08/2000 | US6023338 Overlay alignment measurement of wafers |
| 02/08/2000 | US6023195 On-chip source follower amplifier |
| 02/08/2000 | US6023102 Low resistance contact between circuit metal levels |
| 02/08/2000 | US6023101 Semiconductor device and method for manufacturing the same |
| 02/08/2000 | US6023100 Metallization stack structure to improve electromigration resistance and keep low resistivity of ULSI interconnects |
| 02/08/2000 | US6023099 Semiconductor integrated circuit device with dummy pattern for equalizing thickness of inter-level insulating structure |
| 02/08/2000 | US6023098 Semiconductor device having terminals for heat radiation |
| 02/08/2000 | US6023097 Stacked multiple-chip module micro ball grid array packaging |
| 02/08/2000 | US6023096 Semiconductor device having metal foil integral with sealing resin |
| 02/08/2000 | US6023095 Semiconductor device and manufacture method thereof |
| 02/08/2000 | US6023094 Semiconductor wafer having a bottom surface protective coating |
| 02/08/2000 | US6023086 Semiconductor transistor with stabilizing gate electrode |
| 02/08/2000 | US6023084 Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance and method of manufacturing same |
| 02/08/2000 | US6023080 Input/output connection structure of a semiconductor device |
| 02/08/2000 | US6023041 Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance |
| 02/08/2000 | US6022810 Method of manufacturing semiconductor device |
| 02/08/2000 | US6022808 Filling hole with copper containing dope; annealing to diffuse dope |
| 02/08/2000 | US6022804 Semiconductor device and its manufacturing method |
| 02/08/2000 | US6022802 Low dielectric constant intermetal dielectric (IMD) by formation of air gap between metal lines |
| 02/08/2000 | US6022801 Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film |
| 02/08/2000 | US6022798 Method of forming an interconnect using thin films of Ti and TiN |
| 02/08/2000 | US6022797 Method of manufacturing through holes in a semiconductor device |
| 02/08/2000 | US6022792 Semiconductor dicing and assembling method |
| 02/08/2000 | US6022791 Chip crack stop |
| 02/08/2000 | US6022787 Method of making a structure for providing signal isolation and decoupling in an integrated circuit device |
| 02/08/2000 | US6022772 Stacked capacitor having a corrugated electrode |