| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/24/2000 | WO2000003435A3 A capsule for semiconductor components |
| 02/24/2000 | WO1999059206A3 Semiconductor device and method for making the device |
| 02/24/2000 | DE19929215A1 Production of a Ball Grid Array semiconductor component used in the manufacture of a Quad Flat Package comprises using a Tape Automated Bonding (TAB) strip |
| 02/24/2000 | DE19861113A1 Anordnung mit einer Substratplatte und einem Chip Arrangement with a substrate plate and a chip |
| 02/24/2000 | DE19837946A1 Chip mounting carrier has a solder wettable face that is partly removed or patterned to match the die bonding pads |
| 02/24/2000 | DE19836314A1 Heatsink attachment for semiconductor components, with cooler profiles extruded from special aluminum alloy has a bent semicircular shape |
| 02/24/2000 | CA2338102A1 A flexible circuit with conductive vias and a method of making |
| 02/23/2000 | EP0981268A1 Circuit board with an electronic component mounted thereon and multi-layer board |
| 02/23/2000 | EP0981165A1 Thin film transistors |
| 02/23/2000 | EP0981162A1 Semiconductor chip with surface cover against optical inspection of the circuit structure |
| 02/23/2000 | EP0981161A2 Semiconductor structure including a conductive fuse and process for fabrication thereof |
| 02/23/2000 | EP0981160A2 Integrated semiconductor chip with leads having a defined resistance |
| 02/23/2000 | EP0981159A1 Method for making microconnections, micrelectronic system, and infrared sensor manufactured using the method |
| 02/23/2000 | EP0981157A2 Circuitry and method of forming the same |
| 02/23/2000 | EP0981154A2 Doping frit appropriate for the production of conductor ceramic enamels |
| 02/23/2000 | EP0981137A2 Protection of electrical devices with voltage variable materials |
| 02/23/2000 | EP0980586A1 Power semiconductor module with ceramic substrate |
| 02/23/2000 | CN2365759Y Chip packaging structure |
| 02/23/2000 | CN1245629A Ceramic composite wiring structure for semiconductor devices and method of manufacture thereof |
| 02/23/2000 | CN1245392A Method for coating through-hole side wall with thick film |
| 02/23/2000 | CN1245351A Semiconductor chip with surface covering layer |
| 02/23/2000 | CN1245350A Semiconductor device and method for manufacturing same |
| 02/23/2000 | CN1245194A Bottom filling sealing agent prepared with allyl amide |
| 02/22/2000 | US6028986 Methods of designing and fabricating intergrated circuits which take into account capacitive loading by the intergrated circuit potting material |
| 02/22/2000 | US6028774 Base cards and IC cards using the same |
| 02/22/2000 | US6028772 Electronic assembly having improved resistance to delamination |
| 02/22/2000 | US6028756 Using topological features to lower the blowing current needed for fuses |
| 02/22/2000 | US6028497 RF pin grid array |
| 02/22/2000 | US6028472 Temperature sensing circuit, driving apparatus, and printer |
| 02/22/2000 | US6028368 Semiconductor device with potting resin structures |
| 02/22/2000 | US6028367 Bonds pads equipped with heat dissipating rings and method for forming |
| 02/22/2000 | US6028366 Ball grid array semiconductor device |
| 02/22/2000 | US6028365 Integrated circuit package and method of fabrication |
| 02/22/2000 | US6028364 Semiconductor device having a stress relieving mechanism |
| 02/22/2000 | US6028363 Vertical via/contact |
| 02/22/2000 | US6028362 Damascene wiring with flat surface |
| 02/22/2000 | US6028360 Semiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium film |
| 02/22/2000 | US6028358 Package for a semiconductor device and a semiconductor device |
| 02/22/2000 | US6028357 Semiconductor device with a solder bump over a pillar form |
| 02/22/2000 | US6028356 Plastic-packaged semiconductor integrated circuit |
| 02/22/2000 | US6028355 Method and apparatus for dissipating heat from an enclosed printed wiring board |
| 02/22/2000 | US6028354 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package |
| 02/22/2000 | US6028352 IC stack utilizing secondary leadframes |
| 02/22/2000 | US6028351 Gasket sealed integrated circuit package |
| 02/22/2000 | US6028350 Lead frame with strip-shaped die bonding pad |
| 02/22/2000 | US6028349 Re-routing lead frame package and semiconductor memory package using the same |
| 02/22/2000 | US6028348 Low thermal impedance integrated circuit |
| 02/22/2000 | US6028347 Semiconductor structures and packaging methods |
| 02/22/2000 | US6028335 Semiconductor device |
| 02/22/2000 | US6028324 Test structures for monitoring gate oxide defect densities and the plasma antenna effect |
| 02/22/2000 | US6028011 Method of forming electric pad of semiconductor device and method of forming solder bump |
| 02/22/2000 | US6028007 Low cost hermetic sealed microwave module packaging |
| 02/22/2000 | US6028000 Method of forming contact plugs in semiconductor device having different sized contact holes |
| 02/22/2000 | US6027995 Method for fabricating an interconnect structure with hard mask and low dielectric constant materials |
| 02/22/2000 | US6027994 Method to fabricate a dual metal-damascene structure in a substrate |
| 02/22/2000 | US6027991 Method of making a silicide semiconductor device with junction breakdown prevention |
| 02/22/2000 | US6027980 Method of forming a decoupling capacitor |
| 02/22/2000 | US6027958 Transferred flexible integrated circuit |
| 02/22/2000 | US6027957 Heating solder between joint of semiconductor and submount surfaces which have each been coated with solder of different melting points so that solder reflow causes alloying |
| 02/22/2000 | US6027812 Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product |
| 02/22/2000 | US6027590 Method for minimizing warp and die stress in the production of an electronic assembly |
| 02/22/2000 | US6026895 Flexible foil finned heatsink structure and method of making same |
| 02/17/2000 | WO2000008687A1 Integrated circuit comprising fuse links which can be separated by the action of energy |
| 02/17/2000 | WO2000008686A2 Substrate for high-voltage modules |
| 02/17/2000 | WO2000008685A1 Wiring substrate, method of manufacture thereof, and semiconductor device |
| 02/17/2000 | WO2000008684A1 High performance flip chip package |
| 02/17/2000 | WO2000008683A1 Flat semiconductor device, method for manufacturing the same, and converter comprising the same |
| 02/17/2000 | WO2000008659A2 Isolator |
| 02/17/2000 | WO2000008430A1 Method for measuring the temperature of a power semiconductor and component with such a semiconductor |
| 02/17/2000 | WO2000008218A1 Preparation of metal-matrix composite materials with high particulate loadings by concentration |
| 02/17/2000 | DE19937214A1 MOST contact structure, especially a gate contact structure, is produced using an etch-stop layer to protect the gate and adjacent side wall spacer during contact opening etching |
| 02/17/2000 | DE19853750A1 Heat sink device for electrical or electronic component, circuit or module |
| 02/17/2000 | DE19835916A1 Isolator Insulator |
| 02/17/2000 | DE19835453A1 Verfahren zum Messen der Temperatur eines Leistungshalbleiters und Bauelement A method for measuring the temperature of a power semiconductor component and |
| 02/17/2000 | DE19835266A1 Operating temperature determining method for semiconductor components e.g. DMOS transistors |
| 02/17/2000 | DE19835263A1 Integrierte Schaltung mit durch Energieeinwirkung auftrennbaren elektrischen Verbindungstellen Integrated circuit with separable exposure to energy electrical joints |
| 02/17/2000 | CA2339523A1 Flat semiconductor device, method for manufacturing the same, and converter comprising the same |
| 02/16/2000 | EP0980098A1 Semiconducting material substrate for use in integrated circuits manufacturing processes and production method thereof |
| 02/16/2000 | EP0980097A2 Dispersion containing Cu ultrafine particles individually dispersed therein |
| 02/16/2000 | EP0980096A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device |
| 02/16/2000 | EP0980095A1 Modular high frequency integrated circuit structure |
| 02/16/2000 | EP0980079A2 Low cross-talk ball grid array resistor network |
| 02/16/2000 | EP0979854A1 Circuit connecting material, and structure and method of connecting circuit terminal |
| 02/16/2000 | CN1244935A 芯片卡模块 Chip Card Module |
| 02/16/2000 | CN1244918A Housing for semiconductor sensor arrangement and process for producing the same |
| 02/16/2000 | CN1244914A Thin, planar heat spreader |
| 02/16/2000 | CN1244831A Method for transfer molding standard electronic packages and apparatus thereof |
| 02/16/2000 | CN1244733A 低压有源半导体体器件 Low body active semiconductor devices |
| 02/16/2000 | CN1244728A Soft and flexible surface layer of inverted packed sheet electronic packing piece |
| 02/16/2000 | CN1244727A Method for forming self alignment contact |
| 02/16/2000 | CN1244562A Packaging sealing composition for electronic device |
| 02/16/2000 | CN1049478C Furnace tube apparatus for manufacturing semiconductors |
| 02/15/2000 | US6026221 Prototyping multichip module |
| 02/15/2000 | US6025997 Chip module for semiconductor chips having arbitrary footprints |
| 02/15/2000 | US6025995 Integrated circuit module and method |
| 02/15/2000 | US6025994 Heat sink fastener |
| 02/15/2000 | US6025992 Integrated heat exchanger for memory module |
| 02/15/2000 | US6025651 Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
| 02/15/2000 | US6025650 Semiconductor device including a frame terminal |
| 02/15/2000 | US6025649 Pb-In-Sn tall C-4 for fatigue enhancement |