Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2000
03/07/2000US6033922 Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer
03/07/2000US6033787 Ceramic circuit board with heat sink
03/07/2000US6033764 Bumped substrate assembly
03/07/2000US6033542 Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices
03/07/2000US6033235 Socket apparatus particularly adapted for BGA type semiconductor devices
03/07/2000US6032852 Reworkable microelectronic multi-chip module
03/07/2000US6032850 Fine pitch bonding technique using rectangular wire and capillary bore
03/07/2000US6032477 Method and apparatus for cooling electrical components
03/07/2000US6032476 Electronic device cooling apparatus
03/07/2000US6032362 Method for producing a heat spreader and semiconductor device with a heat spreader
03/07/2000US6032356 Wafer-level test and burn-in, and semiconductor process
03/07/2000US6032355 Method of forming thermal conductive structure on printed circuit board
03/02/2000WO2000011922A1 Heat sink, and semiconductor laser and semiconductor laser stacker using the same
03/02/2000WO2000011919A1 Improved wiring substrate with thermal insert
03/02/2000WO2000011757A1 A retention mechanism for an electrical assembly
03/02/2000WO2000011722A1 Field effect transistors, integrated circuitry, methods of forming field effect transistor gates, and methods of forming integrated circuitry
03/02/2000WO2000011719A1 Semiconductor chip with surface coating
03/02/2000WO2000011718A1 Flip-chip type electronic component
03/02/2000WO2000011717A1 Heatsink, and semiconductor laser device and semiconductor laser stack using heatsink
03/02/2000WO2000011716A1 Isolated flip chip or bga to minimize interconnect stress due to thermal mismatch
03/02/2000WO2000011715A1 Method for producing integrated switching circuits and semiconductor wafer comprising integrated switching circuits
03/02/2000WO2000011714A1 Collective method for conditioning a plurality of components initially formed in a common substrate
03/02/2000WO2000011713A1 Integrated electronic circuit comprising at least an electronic power component
03/02/2000WO2000011489A1 Method of manufacturing ic cards
03/02/2000WO2000011423A1 Heat exchanger for conducting elsewhere heat energy generated by heat source
03/02/2000WO2000011084A1 Paste composition, and protective film and semiconductor device both obtained with the same
03/02/2000WO1999034443A9 Ceramic microelectronics package with co-planar waveguide feed-through
03/02/2000DE19940633A1 IC-Gehäuse IC package
03/02/2000DE19938302A1 Power semiconductor circuit with oscillation damped parallel circuit of IGBT power switches
03/02/2000DE19920757A1 Nonlinear circuit element or interconnection structure, e.g. a copper oxide rectifier, is formed on an integrated circuit by successive formation of a diffusion barrier layer, a copper layer and a copper oxide layer
03/02/2000DE19857043C1 Interference suppression circuit for integrated circuit
03/02/2000DE19839422A1 Explosionsschutz für Halbleitermodule Explosion protection for semiconductor modules
03/02/2000DE19836753A1 Integrierter Halbleiterchip mit Zuleitungen zu einem oder mehreren externen Anschlüssen Integrated semiconductor chip with supply lines to one or more external terminals
03/01/2000EP0982775A2 Semiconductor device with conductive lines thereon and barriers against parasitic current
03/01/2000EP0982774A2 Avoidance of cross-sectional surface reduction in wide soft metal wires
03/01/2000EP0982773A2 System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein
03/01/2000EP0982611A2 Housing
03/01/2000EP0982392A1 Thermally conductive grease composition and semiconductor device using the same
03/01/2000EP0938639A4 Thin, planar heat spreader
03/01/2000EP0781455A4 Integrated circuit contacts with secured stringers
03/01/2000CN1246202A Flip-chip type connection with elastic contacts
03/01/2000CN1246201A Fiducial for aligning integrated circuit die
03/01/2000CN1245819A Double side coated pressure sensitive adhesive sheet and its application
02/2000
02/29/2000US6031729 Integral heater for reworking MCMS and other semiconductor components
02/29/2000US6031724 IC card and method of manufacturing the same
02/29/2000US6031723 Insulated surface mount circuit board construction
02/29/2000US6031720 Cooling system for semiconductor die carrier
02/29/2000US6031716 Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity
02/29/2000US6031292 Semiconductor device, interposer for semiconductor device
02/29/2000US6031291 Common contact hole structure in semiconductor device
02/29/2000US6031290 Electronic circuit
02/29/2000US6031289 Integrated circuit which uses a recessed local conductor for producing staggered interconnect lines
02/29/2000US6031288 Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof
02/29/2000US6031287 Contact structure and memory element incorporating the same
02/29/2000US6031286 Semiconductor structures containing a micro pipe system therein
02/29/2000US6031285 Heat sink for semiconductors and manufacturing process thereof
02/29/2000US6031284 Package body and semiconductor chip package using same
02/29/2000US6031283 Integrated circuit package
02/29/2000US6031282 High performance integrated circuit chip package
02/29/2000US6031281 Semiconductor integrated circuit device having dummy bonding wires
02/29/2000US6031280 Semiconductor device having resin encapsulated package structure
02/29/2000US6031278 IC card and manufacturing method thereof
02/29/2000US6031277 Multi-layered conducting devices and methods for manufacturing the same
02/29/2000US6031275 Antifuse with a silicide layer overlying a diffusion region
02/29/2000US6031266 Semiconductor device with conductive sidewall film
02/29/2000US6031258 High DC current stagger power/ground pad
02/29/2000US6031257 Semiconductor integrated circuit device
02/29/2000US6031255 Bipolar transistor stabilized with electrical insulating elements
02/29/2000US6031246 Method of producing semiconductor devices and method of evaluating the same
02/29/2000US6031188 Multi-circuit RF connections using molded and compliant RF coaxial interconnects
02/29/2000US6030903 Non-destructive method for gauging undercut in a hidden layer
02/29/2000US6030897 Method of forming an alignment mark without a specific photolithographic step
02/29/2000US6030896 Self-aligned copper interconnect architecture with enhanced copper diffusion barrier
02/29/2000US6030895 Method of making a soft metal conductor
02/29/2000US6030894 A diffusion layer of the opposite conductivity type formed on silicon substrate, dilectric covering the substrate surface, a hole is formed in dielectric layer which reaches the diffusion layer, forming silicon/germenium silicide/silicon
02/29/2000US6030890 Method of manufacturing a semiconductor device
02/29/2000US6030889 Substrate-holding fixture of non-wettable material
02/29/2000US6030865 Process for manufacturing semiconductor integrated circuit device
02/29/2000US6030859 Method of making a packaged semiconductor device and a lead-frame therefor
02/29/2000US6030858 Stacked bottom lead package in semiconductor devices and fabricating method thereof
02/29/2000US6030857 Method for application of spray adhesive to a leadframe for chip bonding
02/29/2000US6030856 Bondable compliant pads for packaging of a semiconductor chip and method therefor
02/29/2000US6030855 Self-aligned connector for stacked chip module
02/29/2000US6030711 Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
02/29/2000US6030706 Integrated circuit insulator and method
02/29/2000US6030684 Protecting electronic components in acidic and basic environment
02/29/2000US6030513 Full face mask for capacitance-voltage measurements
02/29/2000US6029742 Heat exchanger for electronic equipment
02/29/2000US6029740 Protective cap for heat conducting medium
02/29/2000US6029344 Composite interconnection element for microelectronic components, and method of making same
02/29/2000US6029343 Insulated surface mount circuit board construction
02/29/2000US6029330 Tool for compressing a torsional spring for clamping a heat sink
02/24/2000WO2000010370A1 A flexible circuit with conductive vias and a method of making
02/24/2000WO2000010203A1 Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices
02/24/2000WO2000010202A1 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics
02/24/2000WO2000010198A1 Method of selectively forming silicide
02/24/2000WO2000010197A1 Integrated circuit trenched features and method of producing same
02/24/2000WO2000010179A1 Bonding wire inductor and manufacturing method thereof
02/24/2000WO2000009623A1 Adhesive for bonding circuit members, circuit board, and method of producing the same
02/24/2000WO2000003576A3 Process and apparatus for manufacturing semiconductor devices
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