| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/21/2000 | US6040395 Primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element |
| 03/21/2000 | US6040242 Method of manufacturing a contact plug |
| 03/21/2000 | US6040240 Substrate having the copper interconnect is exposed to atmosphere after the substrate is cooled to a temperature below 160.degree. c. under a non-oxidizable atmosphere. |
| 03/21/2000 | US6040235 Methods and apparatus for producing integrated circuit devices |
| 03/21/2000 | US6040206 The conductive layer has a layered structure of an al-containing metal film and an n-containing mo film. |
| 03/21/2000 | US6040205 Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid |
| 03/21/2000 | US6040203 Clock skew minimization and method for integrated circuits |
| 03/21/2000 | US6040199 Semiconductor test structure for estimating defects at isolation edge and test method using the same |
| 03/21/2000 | US6040093 Method and transferring conductor patterns to a film carrier, and masks and film carriers to be used therefor |
| 03/21/2000 | US6040068 Ceramic wiring board and method of producing the same |
| 03/21/2000 | US6040039 Printed circuits with thermal conductivity, oxide layer on silicon nitride substrate with metal circuits |
| 03/21/2000 | US6039114 Cooling body having lugs |
| 03/21/2000 | US6038883 Electromagnetic wave-activated sorption refrigeration system |
| 03/21/2000 | US6038878 Method and apparatus for cooling electrical components |
| 03/21/2000 | CA2033134C Fluxless solder coating and joining |
| 03/16/2000 | WO2000014837A1 Array with light-emitting power semiconductor component and corresponding production method |
| 03/16/2000 | WO2000014802A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 03/16/2000 | WO2000014801A1 High voltage shield |
| 03/16/2000 | WO2000014800A1 Circuit chip with light protection |
| 03/16/2000 | WO2000014799A1 Semiconductor component in a chip format and method for the production thereof |
| 03/16/2000 | WO2000014798A1 Electronic part module mounted on socket |
| 03/16/2000 | WO2000014796A1 Method of forming a silicon contact interface |
| 03/16/2000 | WO2000014792A1 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 03/16/2000 | WO2000014788A2 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement |
| 03/16/2000 | WO2000014780A1 Semiconductor processing method, semiconductor circuitry, and gate stacks |
| 03/16/2000 | WO2000014778A1 Diffusion barrier layers and methods of forming same |
| 03/16/2000 | WO2000014771A2 Non-circular micro-via |
| 03/16/2000 | WO2000014681A2 Circuit chip comprising a specific connection area configuration |
| 03/16/2000 | WO2000014679A1 Method for contacting a circuit chip |
| 03/16/2000 | WO2000014469A1 Heat exchanger, cabinet for telecommunication devices and method of cooling electronic devices |
| 03/16/2000 | WO2000013823A1 Functionally graded metal substrates and process for making same |
| 03/16/2000 | WO2000000929A3 Chip module for installation in a chip card carrier and method for the production thereof |
| 03/16/2000 | DE19940390A1 Pressure sensitive adhesive sheet to fix semiconductor wafers temporarily to support plates comprises a radiation curable adhesive layer |
| 03/16/2000 | DE19845296A1 Verfahren zur Kontaktierung eines Schaltungschips Method for contacting a circuit chip |
| 03/16/2000 | DE19843956C1 Edging for MOSFETs, high blocking diodes, high voltage transistors, and IGBTs has a sieve-like field plate provided over the surface on or in an insulating layer |
| 03/16/2000 | DE19842078A1 High ohmic substrate material, especially for highly integrated electronic components, comprises silicon carbide containing a transition metal dopant for compensating excess acceptor material content |
| 03/16/2000 | DE19841996A1 Halbleiterbauelement im Chip-Format und Verfahren zu seiner Herstellung A semiconductor device in chip format and process for its preparation |
| 03/16/2000 | DE19841911A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs |
| 03/16/2000 | DE19841583A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs |
| 03/16/2000 | DE19840251A1 Schaltungschip mit Lichtschutz Circuit chip with light protection |
| 03/16/2000 | DE19840248A1 Schaltungschip mit spezifischer Anschlußflächenanordnung Circuit chip with a specific array of pads |
| 03/16/2000 | CA2342904A1 High voltage shield |
| 03/15/2000 | EP0986104A1 Method of manufacturing three-dimensional device |
| 03/15/2000 | EP0986102A2 Polycrystalline silicon carbide ceramic wafer and substrate |
| 03/15/2000 | EP0986099A2 Translator for recessed flip-chip package |
| 03/15/2000 | EP0986098A1 Soldering material for die bonding |
| 03/15/2000 | EP0986095A2 Layered structure with a material layer and a diffusion barrier layer disposed at the grain boundary of the material layer and process for fabricating the same |
| 03/15/2000 | EP0985999A1 Liquid-cooled electronic apparatus |
| 03/15/2000 | EP0985237A1 Low-profile axial-flow single-blade piezoelectric fan |
| 03/15/2000 | EP0985231A1 Lithographically defined microelectronic contact structures |
| 03/15/2000 | EP0985230A1 Integrated circuit package and method of making |
| 03/15/2000 | EP0985226A1 Method for manufacturing electric modules, and the electric module |
| 03/15/2000 | EP0985123A1 Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components |
| 03/15/2000 | EP0985058A2 Stress tunable tantalum and tantalum nitride films |
| 03/15/2000 | EP0985007A1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 03/15/2000 | EP0764352A4 Microelectronic contacts and assemblies |
| 03/15/2000 | CN2369357Y Connecting terminal structure for wire connector |
| 03/15/2000 | CN2369356Y Miniature thin IC arrangement |
| 03/15/2000 | CN1247688A Combined electrical and optical edge contact for compact connection of part to another part, use thereof and method of mfg. such interconnection |
| 03/15/2000 | CN1247636A Direct contact die attach |
| 03/15/2000 | CN1247635A Via structure |
| 03/15/2000 | CN1247616A Carrier element for semiconductor chip for installing in chip cards |
| 03/15/2000 | CN1247395A Electrical connector of pin grid array assembly |
| 03/15/2000 | CN1247387A Semiconductor device and packed articles and mfg. method |
| 03/15/2000 | CN1247384A Semiconductor device and making method thereof |
| 03/15/2000 | CN1247383A Buried wiring structure and its mfg. method |
| 03/15/2000 | CN1050448C Highly intergrated semiconductor wiring structure and method for mfg. same |
| 03/15/2000 | CN1050447C Heat insulating plate and heat insulating method using same |
| 03/14/2000 | USRE36613 Multi-chip stacked devices |
| 03/14/2000 | US6038137 Chip carrier having a chip mounted on an organic dielectric substrate overlaid with a photoimageable dielectric having circuitry thereon |
| 03/14/2000 | US6038136 Chip package with molded underfill |
| 03/14/2000 | US6038135 Wiring board and semiconductor device |
| 03/14/2000 | US6038133 Circuit component built-in module and method for producing the same |
| 03/14/2000 | US6038132 Memory module |
| 03/14/2000 | US6037822 Method and apparatus for distributing a clock on the silicon backside of an integrated circuit |
| 03/14/2000 | US6037795 Multiple device test layout |
| 03/14/2000 | US6037677 Dual-pitch perimeter flip-chip footprint for high integration asics |
| 03/14/2000 | US6037671 Stepper alignment mark structure for maintaining alignment integrity |
| 03/14/2000 | US6037670 Alignment mark and structure covering the same |
| 03/14/2000 | US6037669 Staggered pad array |
| 03/14/2000 | US6037668 Integrated circuit having a support structure |
| 03/14/2000 | US6037667 Socket assembly for use with solder ball |
| 03/14/2000 | US6037665 Mounting assembly of integrated circuit device and method for production thereof |
| 03/14/2000 | US6037664 Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer |
| 03/14/2000 | US6037662 Chip scale package |
| 03/14/2000 | US6037661 Multichip module |
| 03/14/2000 | US6037660 Device for securing a finned radiating structure to a computer chip |
| 03/14/2000 | US6037659 Composite thermal interface pad |
| 03/14/2000 | US6037658 Electronic package with heat transfer means |
| 03/14/2000 | US6037657 Carrier, semiconductor device, and method of their mounting |
| 03/14/2000 | US6037656 Semiconductor integrated circuit device having short signal paths to terminals and process of fabrication thereof |
| 03/14/2000 | US6037654 Semiconductor device, tape carrier package, and display panel module |
| 03/14/2000 | US6037653 Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer |
| 03/14/2000 | US6037652 Lead frame with each lead having a peel generation preventing means and a semiconductor device using same |
| 03/14/2000 | US6037651 Semiconductor device with multi-level structured insulator and fabrication method thereof |
| 03/14/2000 | US6037649 Three-dimension inductor structure in integrated circuit technology |
| 03/14/2000 | US6037648 Semiconductor structure including a conductive fuse and process for fabrication thereof |
| 03/14/2000 | US6037621 On-chip capacitor structure |
| 03/14/2000 | US6037608 Liquid crystal display device with crossover insulation |
| 03/14/2000 | US6037607 Structure for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques |