Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2000
03/28/2000US6043563 Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
03/28/2000US6043560 Thermal interface thickness control for a microprocessor
03/28/2000US6043559 Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses
03/28/2000US6043558 IC packages including separated signal and power supply edge connections, systems and devices including such packages, and methods of connecting such packages
03/28/2000US6043557 Tape application platform and processes therefor
03/28/2000US6043556 High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same
03/28/2000US6043551 Metal locking structures to prevent a passivation layer from delaminating
03/28/2000US6043539 Electro-static discharge protection of CMOS integrated circuits
03/28/2000US6043443 Fabrication of semiconductor devices
03/28/2000US6043437 Alumina insulation for coating implantable components and other microminiature devices
03/28/2000US6043436 Wiring structure having rotated wiring layers
03/28/2000US6043430 Bottom lead semiconductor chip package
03/28/2000US6043429 Method of making flip chip packages
03/28/2000US6043330 Synthesis of siloxane resins
03/28/2000US6043165 Methods of forming electrically interconnected lines using ultraviolet radiation as an organic compound cleaning agent
03/28/2000US6043158 Semiconductor device with contact holes differing in depth and manufacturing method thereof
03/28/2000US6043151 Method for forming a semiconductor connection with a top surface having an enlarged recess
03/28/2000US6043150 Method for uniform plating of dendrites
03/28/2000US6043149 Method of purifying a metal line in a semiconductor device
03/28/2000US6043146 Process for forming a semiconductor device
03/28/2000US6043145 Method for making multilayer wiring structure
03/28/2000US6043144 Bonding-pad structure for integrated circuit and method of fabricating the same
03/28/2000US6043142 Semiconductor apparatus having conductive thin films and manufacturing apparatus therefor
03/28/2000US6043134 Semiconductor wafer alignment processes
03/28/2000US6043125 Method of fabricating vertical power MOSFET having low distributed resistance
03/28/2000US6043111 Small size semiconductor package
03/28/2000US6043110 Wire mesh insert for thermal adhesives
03/28/2000US6043109 Method of fabricating wafer-level package
03/28/2000US6043108 Lead frame with lead-securing tape bonded to the inner lead sections of plural leads and a method of manufacturing the same
03/28/2000US6043100 Chip on tape die reframe process
03/28/2000US6042953 Substrate on which bumps are formed and method of forming the same
03/28/2000US6042933 Comprising electroconductive composite non-noble metal powder particles having a flat shape covered with a noble metal layer; providing a layer of a mixture of the non-noble and noble metal between the two along with a binder
03/28/2000US6042899 Method of manufacturing a thin-film magnetic device
03/28/2000US6042889 Immersing substrate in aqueous plating bath containing dissolved metal salt, chelating agent, reducing agent, dissolved mediator organometallic compound
03/28/2000US6042712 Apparatus for controlling plating over a face of a substrate
03/28/2000US6042409 Socket for electrical parts
03/28/2000US6042391 High density electrical connectors
03/28/2000US6041496 Method of making ceramic substrate
03/28/2000US6041495 Filling holes in a photoresist-coated polyimide film with metal, removing photoresist leaving metal bumps projecting from film; electroplating bumps forms connections on circuit board surface opposite from where semiconductor chip attaches
03/23/2000WO2000016443A1 Non-circular micro-via
03/23/2000WO2000016400A1 Applications of protective ceramics
03/23/2000WO2000016398A1 Power semiconductor module and motor drive system
03/23/2000WO2000016397A1 Electronic device
03/23/2000WO2000016394A1 Press contact semiconductor device
03/23/2000WO2000016349A1 Integrated inductive components and method of fabricating such components
03/23/2000WO2000015547A2 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
03/23/2000WO1999067811A3 Electronic device having fibrous interface
03/23/2000DE19944980A1 Encased electrical connection for a connecting structure used for testing, e.g., semiconductor wafer has a holding structure arranged between an elastomeric element and PCB substrate
03/23/2000DE19858759C1 Integrated circuit with nanoscale devices and CMOS device
03/23/2000DE19850915C1 Monolithically integrated capacitor for compensating parasitic inductivities by connecting conductors together with highly resistive wires for bypassing the capacitor has two substrate conductive layers and a dielectric layer
03/23/2000DE19843424A1 Smart card device for delivering output data in response to input data and providing proof of authenticity uses operating data to influence algorithm used to generate output data
03/23/2000DE19843309A1 Kurzschlussfestes IGBT Modul Short-circuit-proof IGBT module
03/23/2000DE19842977A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
03/23/2000DE19841204A1 Anordnung mit lichtemittierendem Leistungshalbleiterbauelement sowie Verfahren zur Herstellung derselben Arrangement with a light-emitting power semiconductor component, and methods for manufacturing the same
03/23/2000CA2343445A1 Non-circular micro-via
03/22/2000EP0987760A2 Multimodule interconnect structure and process
03/22/2000EP0987759A2 Electrical fuses in semiconductors
03/22/2000EP0987758A2 Semiconducter device and method of producing the same
03/22/2000EP0987757A2 Heat dissipator for electronic device
03/22/2000EP0987752A2 Improved-reliability damascene interconnects and process of manufacture
03/22/2000EP0987749A2 Semiconductor device, electrode structure therefore, and production thereof
03/22/2000EP0987748A2 Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
03/22/2000EP0987744A1 Method for optimizing the control of metal CMP processes
03/22/2000EP0987653A2 Self assembled nano-devices using DNA
03/22/2000EP0987346A1 Copper deposition method using a precursor with (alkyloxy) (alkyl)silylolefin ligands
03/22/2000EP0987231A1 Silicon carbide based composite material and manufacturing method thereof
03/22/2000CN2370568Y Water cooling radiation system for water-proof data processor
03/22/2000CN2370567Y Base for semiconductor packaging
03/22/2000CN2370566Y Packaging device for ball lattice array integrated circuit
03/22/2000CN2370565Y Stacking device for electronic element
03/22/2000CN1248145A Method for manufacturing sealed electronic component using reproduceable packaging sealant
03/22/2000CN1248064A Method of forming shielding wire adjacement to signal wire
03/22/2000CN1248062A Semiconductor device and process for producing the same
03/22/2000CN1050698C Ball-grid-array-type semiconductor device
03/22/2000CN1050697C Large power semiconductor module with pin
03/22/2000CN1050696C Method and apparatus for directly joining chip to heat sink
03/22/2000CN1050694C Semiconductor device and method for manufacturing the same
03/22/2000CN1050681C Non-contact tpype IC card and method and apparatus for manufacturing the same
03/22/2000CN1050592C Metallized ceramic substrate having smooth plating layer and method for producing the same
03/21/2000US6041013 Semiconductor memory device, method of laying out semiconductor memory device, method of driving semiconductor pattern of semiconductor device
03/21/2000US6040984 Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
03/21/2000US6040702 Carrier and system for testing bumped semiconductor components
03/21/2000US6040633 Oxide wire bond insulation in semiconductor assemblies
03/21/2000US6040632 Multiple sized die
03/21/2000US6040631 Method of improved cavity BGA circuit package
03/21/2000US6040628 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics
03/21/2000US6040627 Semiconductor device and method of manufacturing semiconductor device
03/21/2000US6040626 Semiconductor package
03/21/2000US6040624 Semiconductor device package and method
03/21/2000US6040623 Slotted lead for a semiconductor device
03/21/2000US6040622 Semiconductor package using terminals formed on a conductive layer of a circuit board
03/21/2000US6040621 Semiconductor device and wiring body
03/21/2000US6040620 Lead frame for LOC having a regulating lead to prevent variation in adhesive coverage
03/21/2000US6040619 Semiconductor device including antireflective etch stop layer
03/21/2000US6040618 Multi-chip module employing a carrier substrate with micromachined alignment structures and method of forming
03/21/2000US6040615 Semiconductor device with moisture resistant fuse portion
03/21/2000US6040614 Semiconductor integrated circuit including a capacitor and a fuse element
03/21/2000US6040613 Antireflective coating and wiring line stack
03/21/2000US6040604 Semiconductor component comprising an electrostatic-discharge protection device
03/21/2000US6040589 Semiconductor device having larger contact hole area than an area covered by contact electrode in the hole
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