| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/05/2000 | CN1249847A Method of checking for presence of connection balls |
| 04/05/2000 | CN1249538A Modifiable semiconductor circuit element |
| 04/05/2000 | CN1249537A Miltilayer wiring structure and producing method thereof |
| 04/05/2000 | CN1249536A 半导体器件 Semiconductor devices |
| 04/05/2000 | CN1249534A Method and system for testing IC in wafer stage |
| 04/05/2000 | CN1051197C Method for mfg. circuit board, and made circuit board |
| 04/05/2000 | CN1051171C Electrostatic protecting circuit for semiconductor device, and structure thereof |
| 04/05/2000 | CN1051170C Lead-wire frame for resin sealed semiconductor device and method for production of said device |
| 04/04/2000 | US6047068 Method for determining an encryption key associated with an integrated circuit |
| 04/04/2000 | US6046907 Heat conductor |
| 04/04/2000 | US6046905 Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges |
| 04/04/2000 | US6046901 Support structure, electronic assembly |
| 04/04/2000 | US6046597 Test socket for an IC device |
| 04/04/2000 | US6046507 Electrophoretic coating methodology to improve internal package delamination and wire bond reliability |
| 04/04/2000 | US6046506 Semiconductor device with package |
| 04/04/2000 | US6046504 Resin-encapsulated LOC semiconductor device having a thin inner lead |
| 04/04/2000 | US6046503 Metalization system having an enhanced thermal conductivity |
| 04/04/2000 | US6046502 Semiconductor device with improved adhesion between titanium-based metal layer and insulation film |
| 04/04/2000 | US6046501 RF-driven semiconductor device |
| 04/04/2000 | US6046500 Method of controlling the spread of an adhesive on a circuitized organic substrate |
| 04/04/2000 | US6046499 Heat transfer configuration for a semiconductor device |
| 04/04/2000 | US6046498 Device having a heat sink for cooling an integrated circuit |
| 04/04/2000 | US6046496 Chip package |
| 04/04/2000 | US6046495 Semiconductor device having a tab tape and a ground layer |
| 04/04/2000 | US6046488 Semiconductor device having conductive layer and manufacturing method thereof |
| 04/04/2000 | US6046433 Monolithic integrated circuit die heater and methods for using same |
| 04/04/2000 | US6046410 Interface structures for electronic devices |
| 04/04/2000 | US6046102 Moisture barrier gap fill structure and method for making the same |
| 04/04/2000 | US6046101 Passivation technology combining improved adhesion in passivation and a scribe street without passivation |
| 04/04/2000 | US6046100 Method of fabricating a fabricating plug and near-zero overlap interconnect line |
| 04/04/2000 | US6046094 Method of forming wafer alignment patterns |
| 04/04/2000 | US6046077 Semiconductor device assembly method and semiconductor device produced by the method |
| 04/04/2000 | US6046076 Vacuum dispense method for dispensing an encapsulant and machine therefor |
| 04/04/2000 | US6046075 Oxide wire bond insulation in semiconductor assemblies |
| 04/04/2000 | US6046074 Hermetic thin film metallized sealband for SCM and MCM-D modules |
| 04/04/2000 | US6046072 Bonding a semiconductor chip to a lead frame with adhesive member having low moisture absorbing, low flow adhesive and encapsulating package with sealant |
| 04/04/2000 | US6046071 Plastic molded semiconductor package and method of manufacturing the same |
| 04/04/2000 | US6046070 Method of post-processing solid-state imaging device |
| 04/04/2000 | US6046061 Method of inspecting wafer water mark |
| 04/04/2000 | US6046060 Method of making a high planarity, low CTE base for semiconductor reliability screening |
| 04/04/2000 | US6045927 Composite material for electronic part and method of producing same |
| 04/04/2000 | US6045893 Multilayered electronic part with minimum silver diffusion |
| 04/04/2000 | US6045892 Metal wiring structures for integrated circuits including seed layer |
| 04/04/2000 | US6045886 Adhesive tape for electronic parts |
| 04/04/2000 | US6045666 Hole is first filled with a barrier film comprising a layer of titanium nitride, conductive aluminum is coated into the hole with an ionized metal process in presence of high density plasma, then filled the hole using low density plasma |
| 04/04/2000 | US6045655 Method of mounting a connection component on a semiconductor chip with adhesives |
| 04/04/2000 | US6045382 Socket apparatus for IC packages |
| 04/04/2000 | US6045369 Device for mounting semiconductor package and method of fabricating same |
| 04/04/2000 | US6044899 Low EMI emissions heat sink device |
| 04/04/2000 | US6044850 Forming photoresist ad wiring |
| 04/04/2000 | US6044661 Coaxial waveguide applicator for an electromagnetic wave-activated sorption system |
| 04/04/2000 | US6044548 Methods of making connections to a microelectronic unit |
| 04/02/2000 | CA2284396A1 Semiconductor mounting package |
| 03/30/2000 | WO2000017928A1 Integrated circuit and method for producing the same |
| 03/30/2000 | WO2000017927A1 Semiconductor power converter and application device of the same |
| 03/30/2000 | WO2000017926A1 Semiconductor chip and a semiconductor component comprising such a semiconductor chip |
| 03/30/2000 | WO2000017924A2 Method and device for buried chips |
| 03/30/2000 | WO2000017915A1 Method of manufacturing a semiconductor device comprising a semiconductor body having a surface provided with a coil having a magnetic core |
| 03/30/2000 | WO2000017914A2 Method for forming silicide regions on an integrated device |
| 03/30/2000 | WO2000017913A2 Method for forming a silicide region on a silicon body |
| 03/30/2000 | WO2000017826A1 Device for supplying output data in reaction to input data, method for checking authenticity and method for encrypted data transmission |
| 03/30/2000 | WO2000017414A1 Tantalum films and methods for their deposition |
| 03/30/2000 | WO2000017278A1 Method for the chemical vapor deposition of copper-based films and copper source precursors for the same |
| 03/30/2000 | WO2000017262A1 Salt-modified electrostatic dissipative polymers |
| 03/30/2000 | WO2000017254A1 PREPARATION OF CROSS-LINKED 2-DIMENSIONAL POLYMERS WITH SIDEDNESS FROM α,β-LACTONES |
| 03/30/2000 | DE19906292C1 Test structure, especially for checking etch attack of gate polysilicon in a DRAM circuit during surface strap etching, has MOS transistors with external connections connected to the first and last of series-connected source-drain regions |
| 03/30/2000 | DE19843983A1 Electrical or electronic component, e.g. a force, pressure or acceleration sensor, has a substrate with a porous layer for forming a strong joint with a packaging element |
| 03/30/2000 | DE19843479A1 Semiconducting component |
| 03/30/2000 | DE19843433A1 Halbleiterchip und Halbleiterbauelement mit einem solchen Halbleiterchip Semiconductor chip and semiconductor device having such a semiconductor chip |
| 03/29/2000 | EP0989795A2 Refrigeration system for electronic components |
| 03/29/2000 | EP0989615A2 Semiconductor device with capacitor and manufacturing method thereof |
| 03/29/2000 | EP0989611A2 Short-circuit resistant IGBT module |
| 03/29/2000 | EP0989610A2 Multilayered wiring structure and method of manufacturing the same |
| 03/29/2000 | EP0989609A1 Multilevel Interconnect Structure |
| 03/29/2000 | EP0989608A2 Plastic integrated circuit device package and method of making the same |
| 03/29/2000 | EP0989607A1 IMPROVEMENTS TO THE PROTECTION OF FETs BY MEANS OF TRACKS OF PRINTED CIRCUIT BOARDS |
| 03/29/2000 | EP0989606A2 Power module substrate, method of producing the same, and semiconductor device including the substrate |
| 03/29/2000 | EP0989605A2 Package for electronic component, lid material for package lid, and production method for lid material |
| 03/29/2000 | EP0989602A1 Method of manufacturing a semiconductor device using lithography and etching of stacked layers |
| 03/29/2000 | EP0989596A1 Substrate for device manufacturing, process for manufacturing the substrate, and method of exposure using the substrate |
| 03/29/2000 | EP0989095A1 Hydrotalcite compounds of low uranium (U) content and processes for their preparation |
| 03/29/2000 | EP0988650A2 Method of manufacturing semiconductor devices with "chip size package" |
| 03/29/2000 | CN1248882A Multi-layer circuit board for semiconductor chip set unit and making method thereof |
| 03/29/2000 | CN1248807A Testable electric connector for inserter grid mesh array component |
| 03/29/2000 | CN1248806A Thin cross section electric connector and terminal thereof for inserter grid mesh array component |
| 03/29/2000 | CN1248795A Polycrystal chip semiconductor package structure and making method |
| 03/29/2000 | CN1248794A Insulating grid bipolar transistor modular block capable of preventing short circuit |
| 03/29/2000 | CN1248789A Laminated element with material layer and barrier layer for preventing diffusion material from diffusion |
| 03/29/2000 | CN1248590A Depled uranium hydrotalcite compound and preparation process thereof |
| 03/29/2000 | CN1050935C Lead frame for providing electric contact with IC device and IC package |
| 03/28/2000 | US6043986 Printed circuit board having a plurality of via-holes |
| 03/28/2000 | US6043985 Thermal connecting structure for connecting materials with different expansion coefficients |
| 03/28/2000 | US6043984 Electrical assembly that includes a heat sink which is attached to a substrate by a clip |
| 03/28/2000 | US6043982 Integrated circuit package having a thermoelectric cooling element therein |
| 03/28/2000 | US6043981 Heat sink assembly for electrical components |
| 03/28/2000 | US6043980 Heat sink and information processor using it |
| 03/28/2000 | US6043968 ESD protection circuit |
| 03/28/2000 | US6043859 Active matrix base with reliable terminal connection for liquid crystal display device |
| 03/28/2000 | US6043704 Clock distribution circuit for semiconductor integrated circuit |
| 03/28/2000 | US6043564 Semiconductor device having ball-bonded pads |