| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2000 | EP0993041A2 Heat-reducing silicone grease composition and semiconductor device using the same |
| 04/12/2000 | EP0993039A1 Substrate for mounting semiconductor chips |
| 04/12/2000 | EP0993031A2 Method of cleaning a via hole |
| 04/12/2000 | EP0992875A1 Integrated processor mounting mechanism and heat sink |
| 04/12/2000 | EP0992543A1 Film-shaped encapsulating agent for electronic parts |
| 04/12/2000 | EP0992521A2 Thermosetting resin composition |
| 04/12/2000 | EP0992470A2 Aluminium nitride sintered bodies and their use as substrate in an apparatus for producing semiconductors |
| 04/12/2000 | EP0992066A1 Semiconductor circuit device and method for the production thereof |
| 04/12/2000 | EP0992065A1 Film used as a substrate for integrated circuits |
| 04/12/2000 | EP0992064A1 Sequentially built integrated circuit package |
| 04/12/2000 | EP0991975A1 Wire electrode structure and liquid crystal display employing the structure |
| 04/12/2000 | EP0991797A2 Method and device for producing electrically conductive continuity in semiconductor components |
| 04/12/2000 | EP0972308A4 Interconnect design with controlled inductance |
| 04/12/2000 | EP0901695A4 Connectors for microelectronic elements |
| 04/12/2000 | EP0685144B1 Microminiature stirling cycle cryocoolers and engines |
| 04/12/2000 | CN2373897Y Reusable substandard semiconductor device with discriminatory mark |
| 04/12/2000 | CN2373896Y Heat sink for spherical lattice array assembled element |
| 04/12/2000 | CN2373895Y Assembling type LED fixing holder |
| 04/12/2000 | CN1250545A Wiring forming method for semiconductor device and semiconductor device |
| 04/12/2000 | CN1250229A Electric circuit apparatus and its producing method |
| 04/12/2000 | CN1250228A Integrated circuit tube core with direct coupled noise suppressing and/or other apparatus |
| 04/12/2000 | CN1250227A 半导体装置 Semiconductor device |
| 04/12/2000 | CN1250226A Method for producing semiconductor apparatus |
| 04/12/2000 | CN1250225A Method for producing semiconductor apparatus |
| 04/12/2000 | CN1051409C Pinned module |
| 04/12/2000 | CN1051402C Chip carrier |
| 04/11/2000 | US6049624 Non-lot based method for assembling integrated circuit devices |
| 04/11/2000 | US6049500 Semiconductor memory device and defect remedying method thereof |
| 04/11/2000 | US6049465 Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor |
| 04/11/2000 | US6049464 Electronic modules manufacturing |
| 04/11/2000 | US6049459 Nesting clamps for electrical components |
| 04/11/2000 | US6049458 Protective cap for thermal grease of heat sink |
| 04/11/2000 | US6049457 Device for fastening a heat dissipator to a central process unit |
| 04/11/2000 | US6049456 Electronic module adjustment design and process using shims |
| 04/11/2000 | US6049137 Readable alignment mark structure formed using enhanced chemical mechanical polishing |
| 04/11/2000 | US6049136 Integrated circuit having unique lead configuration |
| 04/11/2000 | US6049135 Bed structure underlying electrode pad of semiconductor device and method for manufacturing same |
| 04/11/2000 | US6049132 Multiple metallization structure for a reflection type liquid crystal display |
| 04/11/2000 | US6049130 Semiconductor device using gold bumps and copper leads as bonding elements |
| 04/11/2000 | US6049129 Chip size integrated circuit package |
| 04/11/2000 | US6049128 Semiconductor device |
| 04/11/2000 | US6049127 Hermetically sealed tungsten-copper composite package container for packaging of microwave devices |
| 04/11/2000 | US6049126 Semiconductor package and amplifier employing the same |
| 04/11/2000 | US6049125 Semiconductor package with heat sink and method of fabrication |
| 04/11/2000 | US6049123 Ultra high density integrated circuit packages |
| 04/11/2000 | US6049121 Tape carrier package and liquid crystal display device including such tape carrier package |
| 04/11/2000 | US6049119 Protection circuit for a semiconductor device |
| 04/11/2000 | US6049038 Flip-chip resin sealing structure and resin sealing method |
| 04/11/2000 | US6048919 Thermally conductive composite material |
| 04/11/2000 | US6048802 Selective nonconformal deposition for forming low dielectric insulation between certain conductive lines |
| 04/11/2000 | US6048800 Process for planarizing surface of a semiconductor device |
| 04/11/2000 | US6048797 Method of manufacturing interconnects |
| 04/11/2000 | US6048792 Method for manufacturing an interconnection structure in a semiconductor device |
| 04/11/2000 | US6048786 Process for forming fluorinated resin or amorphous carbon layer and devices containing same |
| 04/11/2000 | US6048777 Fabrication of high power semiconductor devices with respective heat sinks for integration with planar microstrip circuitry |
| 04/11/2000 | US6048772 Method for fabricating a lateral RF MOS device with an non-diffusion source-backside connection |
| 04/11/2000 | US6048760 Method of forming a self-aligned refractory metal silicide contact using doped field oxide regions |
| 04/11/2000 | US6048755 Method for fabricating BGA package using substrate with patterned solder mask open in die attach area |
| 04/11/2000 | US6048754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package |
| 04/11/2000 | US6048753 Standardized bonding location process and apparatus |
| 04/11/2000 | US6048745 Method for mapping scratches in an oxide film |
| 04/11/2000 | US6048744 Integrated circuit package alignment feature |
| 04/11/2000 | US6048576 Carboxylic group-containing acrylonitrile-butadiene copolymer, a mixed epoxy resin, a compound having at least two intramolecular maleimide groups, an aromatic diamine compound, an epoxy-containing liquid silicon resin, a filler and a |
| 04/11/2000 | US6048475 Gapfill of semiconductor structure using doped silicate glasses |
| 04/11/2000 | US6048433 Sealing structure and method of sealing electronic component |
| 04/11/2000 | US6048424 Method for manufacturing ceramic laminated substrate |
| 04/11/2000 | US6047765 Cross flow cooling device for semiconductor components |
| 04/11/2000 | US6047470 Singulation methods |
| 04/06/2000 | WO2000019534A1 Nitride etch stop for poisoned unlanded vias |
| 04/06/2000 | WO2000019533A1 Clad plate for lead frames, lead frame using the same, and method of manufacturing the lead frame |
| 04/06/2000 | WO2000019532A1 Package for providing improved electrical contact and methods for forming the same |
| 04/06/2000 | WO2000019531A1 Backside electrical contact structure for a module having an exposed backside |
| 04/06/2000 | WO2000019524A2 Ic interconnect structures and methods for making same |
| 04/06/2000 | WO2000019523A1 High-performance dual-damascene interconnect structures |
| 04/06/2000 | WO2000019522A1 Improved methods for barrier layer formation |
| 04/06/2000 | WO2000019517A1 Semiconductor chip and manufacture method thereof |
| 04/06/2000 | WO2000019516A1 Semiconductor device, connection method for semiconductor chip, circuit board and electronic apparatus |
| 04/06/2000 | WO2000019515A1 Semiconductor device and manufacturing method thereof, circuit board and electronic equipment |
| 04/06/2000 | WO2000019514A1 Semiconductor package and flip-chip bonding method therefor |
| 04/06/2000 | WO2000019508A1 Silicon carbide deposition method and use as a barrier layer and passivation layer |
| 04/06/2000 | WO2000019498A1 In situ deposition of low k si carbide barrier layer, etch stop, and anti-reflective coating for damascene applications |
| 04/06/2000 | WO2000019490A2 Dummy fill cell for reducing layer-to-layer interaction |
| 04/06/2000 | WO2000019222A2 Semiconductor switching circuit with an integrated self-testing circuit |
| 04/06/2000 | WO2000018387A2 Antibiotic compositions for treatment of the eye, ear and nose |
| 04/06/2000 | DE19939933A1 Leistungs-Moduleinheit Power module unit |
| 04/06/2000 | DE19860083A1 Vertical integrated semiconductor device |
| 04/06/2000 | DE19845821A1 Modular current converter unit especially for railway vehicles, has housing frame for receiving IGBT module, condenser, connection arrangements and cooling bodies |
| 04/06/2000 | CA2343811A1 Antibiotic compositions for treatment of the eye, ear and nose |
| 04/05/2000 | EP0991125A1 Modifiable semiconductor circuit element |
| 04/05/2000 | EP0991123A1 Microstructure with a magnetic antenna or a magnetic detector |
| 04/05/2000 | EP0991122A2 Connecting legs for electronic device |
| 04/05/2000 | EP0991121A2 Semiconductor mounting package for heat dissipation |
| 04/05/2000 | EP0991120A2 Semiconductor unit |
| 04/05/2000 | EP0991119A1 Semiconductor device and method for manufacturing the same |
| 04/05/2000 | EP0990673A2 Polybenzoxazole resin and precursor thereof |
| 04/05/2000 | EP0990512A1 An electrically insulating non-woven fabric, a prepreg and a laminate |
| 04/05/2000 | EP0990378A1 Heat spreader system and method for cooling heat generating components |
| 04/05/2000 | EP0990240A1 Electric capacitor |
| 04/05/2000 | CN2372785Y Radiator for electrical equipment |
| 04/05/2000 | CN1249851A Fabrication of semiconductor device with gaps for ultra-low capacitance interconnections |