| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/20/2000 | DE19932960A1 Chip card module manufacture comprises adhering leadframe set to surface of semiconductor wafer and electrically connecting to contact bumps before separation of individual chip card modules |
| 04/20/2000 | DE19916010C1 Heat conduction device for circuit board component heat sink has press-fit element inserted in opening in printed circuit board between circuit board component and heat sink mounted on opposite circuit board surfaces |
| 04/20/2000 | DE19904571C1 Three-dimensional IC, e.g. a DRAM cell array, is produced by electron beam passage through a substrate to locate an alignment structure in a bonded second substrate for mask alignment |
| 04/20/2000 | DE19900464A1 Semiconductor component e.g. for integrated electronic circuit |
| 04/20/2000 | DE19847175A1 Integrated memory circuitry; has support, semiconductor chip, containing shadow RAM, circuitry casing and capacitor |
| 04/20/2000 | DE19846662A1 Electronic module used in the production of high density interconnects and quad flat pack packages has the assembly side of the wiring adhered to a hermetic housing |
| 04/20/2000 | DE19846638A1 Composite board, especially a mounting board for power electronic modules, comprises a ceramic board eutectic bonded directly to a silver sheet |
| 04/20/2000 | DE19845665A1 Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein zum Einbau in Chipkarten A process for producing a carrier element for an IC module for installation in smart card |
| 04/20/2000 | DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions |
| 04/20/2000 | DE19845374A1 Method to manufacture cooler for electric or electronic components with parallel, spaced cooling baffles |
| 04/20/2000 | DE19830512A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs |
| 04/20/2000 | CA2345786A1 Method and device for interconnect radio frequency power sic field effect transistors |
| 04/20/2000 | CA2344826A1 Fabrication process for flex circuit applications |
| 04/20/2000 | CA2344663A1 Tape ball grid array with interconnected ground plane |
| 04/19/2000 | EP0994645A2 Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature |
| 04/19/2000 | EP0994511A1 Semiconductor device and manufacturing method of the same |
| 04/19/2000 | EP0994508A1 Semiconductor device comprising bump contacts |
| 04/19/2000 | EP0994507A2 Flip chip metallization for an electronic assembly |
| 04/19/2000 | EP0994357A1 Sensor with diaphragm sensor chip |
| 04/19/2000 | EP0993653A1 Method and arrangement for protecting electronic computing units, in particular chip cards |
| 04/19/2000 | EP0858433A4 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board |
| 04/19/2000 | EP0854968A4 Microminiature stirling cycle cryocoolers and engines |
| 04/19/2000 | CN2374979Y Chip radiator |
| 04/19/2000 | CN2374978Y Radiator fixer of ball lattice array integrated circuit |
| 04/19/2000 | CN1251253A Heat sink mounting assembly for surface mount electronic device packages |
| 04/19/2000 | CN1250951A Semiconductor device and its mfg. method |
| 04/19/2000 | CN1051670C Method for mfg. laminar stackable circuit board structure |
| 04/19/2000 | CN1051645C Structure and mfg. method for chip of semiconductor diode and their main insulating casing |
| 04/19/2000 | CN1051643C 功率集成电路 Power IC |
| 04/19/2000 | CN1051641C Method for mfg. semiconductor |
| 04/18/2000 | US6052289 Interdigitated leads-over-chip lead frame for supporting an integrated circuit die |
| 04/18/2000 | US6052287 Silicon ball grid array chip carrier |
| 04/18/2000 | US6052284 Printed circuit board with electronic devices mounted thereon |
| 04/18/2000 | US6052269 Electrostatic discharge protection circuit using point discharge |
| 04/18/2000 | US6051890 Interleaving a bondwire between two bondwires coupled to a same terminal |
| 04/18/2000 | US6051889 Semiconductor device having a flip-chip structure |
| 04/18/2000 | US6051888 Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package |
| 04/18/2000 | US6051885 Semiconductor device having a conductor with a wedge shaped depression |
| 04/18/2000 | US6051884 Method of forming interconnections in an integrated circuit |
| 04/18/2000 | US6051883 Manufacturing method and semiconductor device with low contact resistance between transparent electrode and pad electrode |
| 04/18/2000 | US6051882 Subtractive dual damascene semiconductor device |
| 04/18/2000 | US6051881 Forming local interconnects in integrated circuits |
| 04/18/2000 | US6051880 Base layer structure covering a hole of decreasing diameter in an insulation layer in a semiconductor device |
| 04/18/2000 | US6051879 Electrical interconnection for attachment to a substrate |
| 04/18/2000 | US6051877 Semiconductor device and fabrication method |
| 04/18/2000 | US6051876 Semiconductor device with a graded passivation layer |
| 04/18/2000 | US6051875 Semiconductor chip |
| 04/18/2000 | US6051871 Heterojunction bipolar transistor having improved heat dissipation |
| 04/18/2000 | US6051869 Silicon-rich block copolymers to achieve unbalanced vias |
| 04/18/2000 | US6051867 Interlayer dielectric for passivation of an elevated integrated circuit sensor structure |
| 04/18/2000 | US6051862 MOS-technology power device integrated structure |
| 04/18/2000 | US6051851 Semiconductor devices utilizing silicide reaction |
| 04/18/2000 | US6051784 Semiconductor package |
| 04/18/2000 | US6051497 Formation of sub-groundrule features |
| 04/18/2000 | US6051491 Multilevel interconnection structure for integrated circuits and method of producing same |
| 04/18/2000 | US6051490 Method of forming wirings |
| 04/18/2000 | US6051489 Electronic component package with posts on the active side of the substrate |
| 04/18/2000 | US6051472 Semiconductor device and method of producing the same |
| 04/18/2000 | US6051450 Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus |
| 04/18/2000 | US6051449 Attaching a semiconductor device to a lead frame by using a quick curable adhesive |
| 04/18/2000 | US6051321 Low dielectric constant materials and method |
| 04/18/2000 | US6051281 Subjecting the substrate to the plasma processing in an atmosphere of the mixed gas of nitrogen gas and hydrogen gas, thereby nitriding a surface layer of the titanium film to form thereon a nitride layer |
| 04/18/2000 | US6051093 Mounting method of semiconductor element |
| 04/18/2000 | US6050836 Socket apparatus |
| 04/18/2000 | US6050832 Chip and board stress relief interposer |
| 04/18/2000 | US6050830 Tape carrier package for liquid crystal display |
| 04/18/2000 | US6050476 Reworkable microelectronic multi-chip module |
| 04/18/2000 | US6050332 Extruded, tiered high fin density heat sinks and method of manufacture |
| 04/18/2000 | US6050326 Method and apparatus for cooling an electronic device |
| 04/18/2000 | US6050125 Calibrating wafer and method for the production of a calibrating wafer |
| 04/18/2000 | US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components |
| 04/18/2000 | US6049975 Method of forming a thin multichip module |
| 04/18/2000 | US6049971 Casing for integrated circuit chips and method of fabrication |
| 04/13/2000 | WO2000021135A1 Semiconductor device and method for manufacturing the same |
| 04/13/2000 | WO2000021133A1 Embedded capacitor multi-chip modules |
| 04/13/2000 | WO2000021132A1 Semiconductor integrated circuit with temporarily interconnected bond pads |
| 04/13/2000 | WO2000021131A1 Method for mounting an electric of electronic installation and heat exchanger for power electrical or electronic components |
| 04/13/2000 | WO2000021130A1 Methods and apparatus for hermetically sealing electronic packages |
| 04/13/2000 | WO2000021129A1 In situ titanium aluminide deposit in high aspect ratio features |
| 04/13/2000 | WO2000021126A1 Semiconductor copper bond pad surface protection |
| 04/13/2000 | WO2000021124A1 Semiconductor device and method for manufacturing the same |
| 04/13/2000 | WO2000021027A1 Method for producing a supporting element for an integrated circuit module for placement in chip cards |
| 04/13/2000 | WO2000020900A2 Silicon carbide for use as a low dielectric constant anti-reflective coating and its deposition method |
| 04/13/2000 | WO2000020519A2 Preparations containing fine-particulate inorganic oxides |
| 04/13/2000 | WO2000020483A2 Impact-resistant epoxide resin compositions |
| 04/13/2000 | WO2000020154A1 Method and apparatus for placing solder balls on a substrate |
| 04/13/2000 | DE19942885A1 Semiconductor device has an electrode or wiring layer of a thick aluminum layer below a nickel layer to prevent an aluminum-nickel intermetallic compound from reaching the underlying substrate |
| 04/13/2000 | DE19846096A1 Präparation von Suspensionen ternärer Oxide für Drucktinten Preparation of suspensions of ternary oxides for printing inks |
| 04/13/2000 | DE19845064A1 Halbleiterschaltkreis mit integrierter Selbsttestschaltung Semiconductor circuit with integrated self-test circuit |
| 04/13/2000 | DE19844965A1 Chip card module for chip card e.g. for entry access |
| 04/13/2000 | DE19844873A1 Carrier arrangement to accommodate semiconducting element has carrying frame to which heat conducting body is attached using at least one welded joint, e.g. laser welded joint |
| 04/13/2000 | DE19844872A1 Support for semiconductor component(s) has a frame on which is secured at least one heat source with first elements for positive connection to second elements on the frame |
| 04/13/2000 | DE19833131A1 Contacting electronic components on flexible substrates involves using substrate and other part elasticity and causing elastic deformation by contact force generating or introducing elements |
| 04/13/2000 | CA2346634A1 Impact-resistant epoxide resin compositions |
| 04/13/2000 | CA2346361A1 Methods and apparatus for hermetically sealing electronic packages |
| 04/12/2000 | EP0993243A2 Method and system for thermal coupling an electronic device to a heat exchange member |
| 04/12/2000 | EP0993047A1 Semiconductor device with elements of integrated circuits of III-V group and means to prevent the pollution by hydrogen |
| 04/12/2000 | EP0993045A1 Integrated circuit die with directly coupled noise suppression |
| 04/12/2000 | EP0993043A2 Semiconductor package and method of manufacturing the same |
| 04/12/2000 | EP0993042A2 Manufacturing a semiconductor device using a film substrate |