| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/27/2000 | WO2000024061A1 Semiconductor power component, operational method and use thereof as a switch |
| 04/27/2000 | WO2000024057A1 Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with a grating and an at least partially recessed oxide pattern |
| 04/27/2000 | WO2000024056A1 Semiconductor package for high frequency performance |
| 04/27/2000 | WO2000024054A1 Structure comprising a semiconductor layer and/or electronic elements on an insulating support and method for making same |
| 04/27/2000 | WO2000024050A1 Cvd nanoporous silica low dielectric constant films |
| 04/27/2000 | WO2000024042A1 Arrangement with at least one integrated inductive element on a substrate |
| 04/27/2000 | WO2000023494A1 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 04/27/2000 | WO2000007225A3 Method of and apparatus for sealing an hermetic lid to a microelectronic machine |
| 04/27/2000 | WO1999065077A9 Low resistance package for semiconductor devices |
| 04/27/2000 | WO1999052129A3 Resistive interconnect of transistor cells |
| 04/27/2000 | DE4143592C2 Improved intermediate insulation layer between metallisation levels |
| 04/27/2000 | DE19848712A1 Thermoplastics hot melt adhesive application for formation of smart card component layer or electronic transponder |
| 04/26/2000 | EP0996320A1 Double sided circuit board |
| 04/26/2000 | EP0996157A1 Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections |
| 04/26/2000 | EP0996156A2 Heat sink |
| 04/26/2000 | EP0996155A2 Radio frequency integrated circuit apparatus |
| 04/26/2000 | EP0996154A1 Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device |
| 04/26/2000 | EP0995348A1 Clamping device, tool and method of mounting tools |
| 04/26/2000 | EP0995347A1 Transporter for lead frames and transport assembly |
| 04/26/2000 | EP0995346A1 A heating method for a printed circuit board and a printed circuit board comprising a heating element |
| 04/26/2000 | EP0995235A1 Contact and method for producing a contact |
| 04/26/2000 | EP0995226A1 Heat-transfer enhancing features for semiconductor carriers and devices |
| 04/26/2000 | EP0835274B1 Process for making hydroxy-substituted ethynylated biphenyls |
| 04/26/2000 | CN2376080Y Radiator shaping device |
| 04/26/2000 | CN2376079Y Heat pipe |
| 04/26/2000 | CN2376078Y Semiconductor encaspulated element |
| 04/26/2000 | CN1251494A Radiating method for electronic and electric products and apparatus thereof |
| 04/26/2000 | CN1251469A Method for producing semiconductor integrated circuit card and semiconductor integrated circuit card |
| 04/26/2000 | CN1251431A Integrated processor mounting mechanism and radiating fins |
| 04/25/2000 | US6055159 Heat dissipating module for a heat generating electronic component |
| 04/25/2000 | US6055154 In-board chip cooling system |
| 04/25/2000 | US6055151 A capacitor ink comprising a dielectric selected from barium titanate, titanium oxide and lead-magnesium niobate, a low firing temperature glass including 2% or less barium oxide and an organic vehicle for screen printing of ink on the tape |
| 04/25/2000 | US6054975 Liquid crystal display device having tape carrier packages |
| 04/25/2000 | US6054900 Power amplifier MMIC and mobile communication terminal |
| 04/25/2000 | US6054873 Interconnect structure between heterogeneous core regions in a programmable array |
| 04/25/2000 | US6054780 Magnetically coupled signal isolator using a Faraday shielded MR or GMR receiving element |
| 04/25/2000 | US6054774 Thin type semiconductor package |
| 04/25/2000 | US6054773 Semiconductor device and method of manufacturing the same |
| 04/25/2000 | US6054772 Chip sized package |
| 04/25/2000 | US6054771 Interconnection system in a semiconductor device |
| 04/25/2000 | US6054770 Electric solid state device and method for manufacturing the device |
| 04/25/2000 | US6054769 Low capacitance interconnect structures in integrated circuits having an adhesion and protective overlayer for low dielectric materials |
| 04/25/2000 | US6054768 Metal fill by treatment of mobility layers |
| 04/25/2000 | US6054767 Programmable substrate for array-type packages |
| 04/25/2000 | US6054766 Package for enclosing microoptical and/or microelectronic devices so as to minimize the leakage of microwave electromagnetic radiation |
| 04/25/2000 | US6054764 Integrated circuit with tightly coupled passive components |
| 04/25/2000 | US6054763 Semiconductor device |
| 04/25/2000 | US6054762 Semiconductor substrates of high reliability ceramic metal composites |
| 04/25/2000 | US6054761 Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
| 04/25/2000 | US6054759 Semiconductor chip and package with heat dissipation |
| 04/25/2000 | US6054758 Differential pair geometry for integrated circuit chip packages |
| 04/25/2000 | US6054757 Semiconductor apparatus, circuit board and combination thereof |
| 04/25/2000 | US6054756 Connection components with frangible leads and bus |
| 04/25/2000 | US6054755 Semiconductor package with improved moisture vapor relief function and method of fabricating the same |
| 04/25/2000 | US6054754 Multi-capacitance lead frame decoupling device |
| 04/25/2000 | US6054753 Plastic-encapsulated semiconductor device equipped with LOC package structure |
| 04/25/2000 | US6054749 Thin film device repaired using enhanced repair process |
| 04/25/2000 | US6054727 Power semiconductor component |
| 04/25/2000 | US6054721 Detection of undesired connection between conductive structures within multiple layers on a semiconductor wafer |
| 04/25/2000 | US6054720 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture |
| 04/25/2000 | US6054676 Method and apparatus for cooling an integrated circuit device |
| 04/25/2000 | US6054652 Thin-film multi-layer substrate and electronic device |
| 04/25/2000 | US6054383 Fabrication method of semiconductor device |
| 04/25/2000 | US6054381 Semiconductor device, and method of manufacturing same |
| 04/25/2000 | US6054378 Method for encapsulating a metal via in damascene |
| 04/25/2000 | US6054376 Method of sealing a semiconductor substrate |
| 04/25/2000 | US6054375 Method for making laser synthesized ceramic electronic devices and circuits |
| 04/25/2000 | US6054372 Stress-free silicon wafer and a die or chip made therefrom |
| 04/25/2000 | US6054361 Preserving the zero mark for wafer alignment |
| 04/25/2000 | US6054351 Method of evaluating a tunnel insulating film |
| 04/25/2000 | US6054340 Method for forming a cavity capable of accessing deep fuse structures and device containing the same |
| 04/25/2000 | US6054339 Fusible links formed on interconnects which are at least twice as long as they are deep |
| 04/25/2000 | US6054338 Low cost ball grid array device and method of manufacture thereof |
| 04/25/2000 | US6054334 Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit |
| 04/25/2000 | US6054329 Method of forming an integrated circuit spiral inductor with ferromagnetic liner |
| 04/25/2000 | US6054222 For high density packaging of electronic parts |
| 04/25/2000 | US6054220 Silica-coated aluminum nitride powders with improved properties and method for their preparation |
| 04/25/2000 | US6054198 Conformal thermal interface material for electronic components |
| 04/25/2000 | US6054173 Forming patterned aluminum layer on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containging surface adjacent to catalyst |
| 04/25/2000 | US6054172 Forming patterned catalyst material on substrate, such that titanium-containing surface is exposed in selected regions; depositing copper from electroless solution onto exposed regions of titanium-containing surface adjacent to catalyst |
| 04/25/2000 | US6053394 Column grid array substrate attachment with heat sink stress relief |
| 04/25/2000 | US6053242 Heat sink assembly |
| 04/25/2000 | US6053240 Heat sink |
| 04/25/2000 | US6052893 Process for manufacturing a resin-encapsulated electronic product |
| 04/20/2000 | WO2000022901A1 Spray cooled module with removable spray cooled sub-module |
| 04/20/2000 | WO2000022900A1 Mass reflowable windowed non-ceramic package |
| 04/20/2000 | WO2000022899A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 04/20/2000 | WO2000022896A1 Fabrication process for flex circuit applications |
| 04/20/2000 | WO2000022893A1 Article having an embedded electronic device, and method of making same |
| 04/20/2000 | WO2000022676A1 Semiconductor device and method of manufacture thereof |
| 04/20/2000 | WO2000022675A1 Method for making an integrated circuit containing an alignment mark area |
| 04/20/2000 | WO2000022674A1 Tape ball grid array with interconnected ground plane |
| 04/20/2000 | WO2000022673A1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support |
| 04/20/2000 | WO2000022672A1 Cooling system for power amplifier and communication system employing the same |
| 04/20/2000 | WO2000022670A1 Integrated circuit rewiring using gas-assisted fib etching |
| 04/20/2000 | WO2000022668A1 Electronic module, especially a multichip module, with multi-layer metallization and corresponding production method |
| 04/20/2000 | WO2000022666A2 METHOD AND DEVICE FOR INTERCONNECT RADIO FREQUENCY POWER SiC FIELD EFFECT TRANSISTORS |
| 04/20/2000 | WO2000022446A1 Method and system for manufacturing lamp tiles |
| 04/20/2000 | WO2000021904A1 Composite plate and method for producing and using such a composite plate |
| 04/20/2000 | WO2000004585A3 Chip carrier device and method for the production of a chip carrier device with an electrical test |