| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/09/2000 | US6059172 Method for establishing electrical communication between a first object having a solder ball and a second object |
| 05/09/2000 | US6059116 Heat sink packaging devices |
| 05/09/2000 | US6058602 Method for encapsulating IC packages with diamond substrate |
| 05/04/2000 | WO2000025562A1 Stacked circuit board assembly adapted for heat dissipation |
| 05/04/2000 | WO2000025561A1 Heat sink assembly with threaded collar and multiple pressure capabillty |
| 05/04/2000 | WO2000025559A1 Method for manufacturing a circuit board |
| 05/04/2000 | WO2000025558A1 A circuit board and a method for manufacturing the same |
| 05/04/2000 | WO2000025361A1 Semiconductor device and manufacture thereof |
| 05/04/2000 | WO2000025359A1 Method for manufacturing an ic component |
| 05/04/2000 | WO2000025355A1 Method for fabricating semiconductor device |
| 05/04/2000 | WO2000025350A1 Apparatus for and method of manufacturing a semiconductor die carrier |
| 05/04/2000 | WO2000025266A1 Self-adhesive electronic circuit |
| 05/04/2000 | WO2000025264A1 Hot-melt adhesive component layers for smart cards |
| 05/04/2000 | WO2000024692A1 Silicon nitride composite substrate |
| 05/04/2000 | WO2000007218A3 Method for manufacturing a semiconductor device having a metal layer floating over a substrate |
| 05/04/2000 | WO2000005748A3 Blind pin placement on circuit boards |
| 05/04/2000 | WO1999067087A9 Method of making an adhesive preform lid for electronic devices |
| 05/04/2000 | DE19850526A1 Lead-free solderable copper substrate, e.g. a lead frame for semiconductor components, production |
| 05/04/2000 | DE19850388A1 Hybrid carrier board, e.g. for motor vehicle engine control circuit, with microcontroller as flip chip module attached to board with further hybrid carrier substrate arranged over flip chip for additional components |
| 05/04/2000 | DE19847537A1 Platine mit auf beiden Seiten angeordneten Leiterbahnen Board having arranged on both sides conductor tracks |
| 05/04/2000 | CA2348507A1 Stacked circuit board assembly adapted for heat dissipation |
| 05/04/2000 | CA2347818A1 Hot-melt adhesive component layers for smart cards |
| 05/03/2000 | EP0998181A2 Assembly and method for cooling an electronic component or module with a liquid |
| 05/03/2000 | EP0998180A2 Apparatus to enhance cooling of electronic device |
| 05/03/2000 | EP0998038A1 Module of stacked elements in the same housing |
| 05/03/2000 | EP0997944A2 Printed circuit board with integrated circuit devices mounted on both sides thereof |
| 05/03/2000 | EP0997942A2 Chip Size Semiconductor Package and process for producing it |
| 05/03/2000 | EP0997941A2 Conductive paste and ceramic printed circuit substrate using the same |
| 05/03/2000 | EP0997940A1 Process for electrically connecting IGBTs mounted on an IC |
| 05/03/2000 | EP0997939A1 Semiconductor device comprising a lead wire |
| 05/03/2000 | EP0997938A2 Multi-chip module |
| 05/03/2000 | EP0997937A2 Semiconductor device module with a heat sink |
| 05/03/2000 | EP0997936A1 Manufacturing method for an IGBT gate electrode |
| 05/03/2000 | EP0997935A1 Printed wiring board and method for manufacturing the same |
| 05/03/2000 | EP0997782A1 Reticle having mark for detecting alignment and method for detected alignment |
| 05/03/2000 | EP0997498A1 Silicone composition, method for the preparation thereof and silicone elastomer |
| 05/03/2000 | EP0996980A1 Two-chip power integrated circuit with improved short circuit characteristics |
| 05/03/2000 | EP0996979A2 Housing for at least one semiconductor body |
| 05/03/2000 | EP0996977A1 Electrical bonding of a semiconductor junction |
| 05/03/2000 | EP0996962A2 Resin molded type semiconductor device and a method of manufacturing the same |
| 05/03/2000 | EP0953008A4 Thermosetting resin compositions |
| 05/03/2000 | CN1251943A Connecting terminal bay and manufacture thereof |
| 05/03/2000 | CN1251942A Semiconductor sealing, semiconductor device and manufacture thereof |
| 05/03/2000 | CN1251830A Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 05/03/2000 | CN1052088C Display board having wiring with three-layered structure and display device including the display board |
| 05/03/2000 | CN1052027C Pastes for coating of substrates, methods for manufacturing them and their use |
| 05/02/2000 | US6058257 Integrated circuit, design method for the same, and memory storing the program for executing the design method |
| 05/02/2000 | US6058020 Component housing for surface mounting of a semiconductor component |
| 05/02/2000 | US6058015 Electronic packages and a method to improve thermal performance of electronic packages |
| 05/02/2000 | US6058013 Molded housing with integral heatsink |
| 05/02/2000 | US6058012 Apparatus, method and system for thermal management of an electronic system having semiconductor devices |
| 05/02/2000 | US6057604 Integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure |
| 05/02/2000 | US6057603 Fabrication of integrated circuit inter-level dielectrics using a stop-on-metal dielectric polish process |
| 05/02/2000 | US6057601 Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate |
| 05/02/2000 | US6057600 Structure for mounting a high-frequency package |
| 05/02/2000 | US6057599 Hybrid high-power microwave-frequency integrated circuit |
| 05/02/2000 | US6057598 Face on face flip chip integration |
| 05/02/2000 | US6057597 Semiconductor package with pre-fabricated cover |
| 05/02/2000 | US6057596 Chip carrier having a specific power join distribution structure |
| 05/02/2000 | US6057595 Integrated semiconductor circuit housing |
| 05/02/2000 | US6057594 High power dissipating tape ball grid array package |
| 05/02/2000 | US6057593 Hybrid high-power microwave-frequency integrated circuit |
| 05/02/2000 | US6057591 Process for forming an edge structure to seal integrated electronic devices, and corresponding device |
| 05/02/2000 | US6057589 Method for over-etching to improve voltage distribution |
| 05/02/2000 | US6057573 Design for high density memory with relaxed metal pitch |
| 05/02/2000 | US6057571 High aspect ratio, metal-to-metal, linear capacitor for an integrated circuit |
| 05/02/2000 | US6057402 Blend of cycloaliphatic epoxy resins, cyanate esters, lewis acid catalyst and flexibility modifier |
| 05/02/2000 | US6057381 Method of making an electronic component using reworkable underfill encapsulants |
| 05/02/2000 | US6057242 Flat interlayer insulating film suitable for multi-layer wiring |
| 05/02/2000 | US6057236 CVD/PVD method of filling structures using discontinuous CVD AL liner |
| 05/02/2000 | US6057234 Method for fabricating semiconductor device |
| 05/02/2000 | US6057232 Wiring structure for semiconductor device and fabrication method therefor |
| 05/02/2000 | US6057231 Method for improved metal fill by treatment of mobility layers |
| 05/02/2000 | US6057229 Method for metallizing submicron contact holes in semiconductor bodies |
| 05/02/2000 | US6057228 Method of forming interconnection for semiconductor device |
| 05/02/2000 | US6057226 Air gap based low dielectric constant interconnect structure and method of making same |
| 05/02/2000 | US6057225 Semiconductor integrated circuit device having fundamental cells and method of manufacturing the semiconductor integrated circuit device using the fundamental cells |
| 05/02/2000 | US6057224 Methods for making semiconductor devices having air dielectric interconnect structures |
| 05/02/2000 | US6057223 Passivated copper conductive layers for microelectronic applications |
| 05/02/2000 | US6057222 Method for the production of flip-chip mounting-ready contacts of electrical components |
| 05/02/2000 | US6057221 Laser-induced cutting of metal interconnect |
| 05/02/2000 | US6057216 Low temperature diffusion process for dopant concentration enhancement |
| 05/02/2000 | US6057206 Mark protection scheme with no masking |
| 05/02/2000 | US6057202 Method for manufacturing an inductor with resonant frequency and Q value increased in semiconductor process |
| 05/02/2000 | US6057180 Method of severing electrically conductive links with ultraviolet laser output |
| 05/02/2000 | US6057177 Reinforced leadframe to substrate attachment |
| 05/02/2000 | US6057176 Lead frame coining for semiconductor devices |
| 05/02/2000 | US6057175 Method of making encapsulated package |
| 05/02/2000 | US6057174 Semiconductor device, method of fabricating the same, and electronic apparatus |
| 05/02/2000 | US6057171 Methods for determining on-chip interconnect process parameters |
| 05/02/2000 | US6057169 Method for I/O device layout during integrated circuit design |
| 05/02/2000 | US6056204 Synthetic jet actuators for mixing applications |
| 05/02/2000 | US6056190 Solder ball placement apparatus |
| 05/02/2000 | US6056186 Method for bonding a ceramic to a metal with a copper-containing shim |
| 05/02/2000 | US6055822 Circuit-board mounted cooling apparatus for a computer |
| 05/02/2000 | US6055724 Method and device for sealing IC chip |
| 05/02/2000 | US6055723 Using fluoropolymers |
| 05/02/2000 | CA2118649C Interconnection structure of electronic parts |
| 04/30/2000 | CA2287095A1 Module of components superimposed in the same housing |
| 04/28/2000 | CA2252017A1 Method of fineblanking a workpiece and the tool for carrying out the method and the resulting workpiece thereof |