Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2000
05/11/2000WO2000026963A1 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
05/11/2000WO2000026959A1 Semiconductor device, method of manufacture thereof, circuit board and electronic device
05/11/2000WO2000026958A1 System for assembling substrates to bonding zones provided with cavities
05/11/2000WO2000026952A1 Method for in-situ, post deposition surface passivation of a chemical vapor deposited film
05/11/2000WO2000026942A2 Method for producing filled vias in electronic components
05/11/2000WO2000026444A1 Copper metallization structure and method of construction
05/11/2000WO2000026149A1 High performance embedded rf filters
05/11/2000WO2000008686A3 Substrate for high-voltage modules
05/11/2000WO2000008659A3 Isolator
05/11/2000WO2000007219A3 High density printed circuit substrate and method of fabrication
05/11/2000DE19952966A1 Modular semiconductor device, e.g. a power semiconductor module, has a tin-soldered heat sink of reduced thickness relative to the tin solder layer
05/11/2000DE19952273A1 Copper connection film, e.g. for an ultra large scale integration, is produced by high pressure grain growth heat treatment of a deposited film while suppressing pore formation
05/11/2000DE19951754A1 Background radiation blocking component structure used for circuit boards comprises a blocking component having a magnetic layer and a conducting layer
05/11/2000DE19949378A1 Abgeschirmte impedanzgesteuerte Gatling-Geschütz-Durchkontaktierung Screened impedance controlled Gatling gun-plated-through hole
05/11/2000DE19948331A1 Gehäuse für elektrische/elektronische Schaltungen Enclosures for electrical / electronic circuits
05/11/2000DE19929606A1 Production of a printed circuit comprises using a protective layer made of plastic to encapsulate the printed circuit unit and a section of the lead frame
05/11/2000CA2349340A1 Heatsink for electronic component, and apparatus and method for manufacturing the same
05/10/2000EP0999728A1 An electrical component and an electrical circuit module having connected ground planes
05/10/2000EP0999592A1 Fuse layout for improved fuse blow process window
05/10/2000EP0999591A1 Semiconductor package
05/10/2000EP0999590A2 Heat sink for electric and/or electronic devices
05/10/2000EP0999589A2 Silicon nitride circuit board
05/10/2000EP0999588A2 Semiconductor device and method for assembling the same
05/10/2000EP0999587A2 Production of semiconductor device
05/10/2000EP0999586A2 Semiconductor device and method of producing same
05/10/2000EP0999584A2 Method for manufacturing semiconductor device
05/10/2000EP0999580A2 Simplified high q inductor substrate
05/10/2000EP0999579A2 An inductor or low loss interconnect in an integrated circuit
05/10/2000EP0998757A1 Integrated circuit and method for the production thereof
05/10/2000EP0998724A1 Method for producing a chip module
05/10/2000EP0948808A4 Integrated circuits and methods for their fabrication
05/10/2000EP0799325B1 Computer hard disk and process for making same
05/10/2000CN2377767Y Improved generator commutator for car
05/10/2000CN2377680Y Heat sink for chip module
05/10/2000CN1252894A BGA connector with heat activated connection and disconnection means
05/10/2000CN1252828A Semiconductor sealing resin composition, semiconductor device sealed withe the same, and process for preparing semiconductor device
05/10/2000CN1252683A Attached structure for control element of radiation noise
05/10/2000CN1252425A Packing sealing agent prepared from allylated amide compound
05/10/2000CN1052340C Plastic moulded integrated circuit assembly with low-glancing-flatness deviation lead wire
05/09/2000US6061260 Board mounted power supply having an auxiliary output
05/09/2000US6061251 Lead-frame based vertical interconnect package
05/09/2000US6061248 Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
05/09/2000US6061246 Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same
05/09/2000US6061245 Free standing, three dimensional, multi-chip, carrier package with air flow baffle
05/09/2000US6061243 Modular and multifunctional structure
05/09/2000US6061242 Die paddle heat sink with thermal posts
05/09/2000US6061240 Push pin assembly for heat sink for cooling electronic modules
05/09/2000US6061239 Cam-type retainer clip for heat sinks for electronic integrated circuits
05/09/2000US6061235 Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
05/09/2000US6061228 Multi-chip module having an integral capacitor element
05/09/2000US6061222 Method and apparatus for reducing noise in integrated circuit chips
05/09/2000US6060968 Device with circuit element and transmission line formed by a dielectric between facing conductor strips
05/09/2000US6060893 Carrier having slide connectors for testing unpackaged semiconductor dice
05/09/2000US6060787 Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer
05/09/2000US6060786 Alignment-marker structure and method of forming the same in integrated circuit fabrication
05/09/2000US6060785 Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors
05/09/2000US6060784 Interconnection layer structure in a semiconductor integrated circuit device having macro cell regions
05/09/2000US6060783 Self-aligned contact plugs
05/09/2000US6060782 Semiconductor device with improved mounting on tape-shaped insulating substrate
05/09/2000US6060781 Semiconductor device
05/09/2000US6060779 Resin sealed ceramic package and semiconductor device
05/09/2000US6060778 Ball grid array package
05/09/2000US6060777 Underside heat slug for ball grid array packages
05/09/2000US6060776 Rectifier diode
05/09/2000US6060775 Semiconductor device
05/09/2000US6060774 Semiconductor device
05/09/2000US6060771 Connecting lead for semiconductor devices and method for fabricating the lead
05/09/2000US6060770 Semiconductor device and process for producing the same
05/09/2000US6060769 Flip-chip on leads devices
05/09/2000US6060768 Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame
05/09/2000US6060766 Protection of hydrogen sensitive regions in semiconductor devices from the positive charge associated with plasma deposited barriers or layers
05/09/2000US6060765 Semiconductor device and a method of manufacturing the same
05/09/2000US6060764 Field shield isolated transistor
05/09/2000US6060748 Semiconductor integrated circuit device using a silicon-on-insulator substrate
05/09/2000US6060729 Light-emitting device
05/09/2000US6060692 Low power compact heater for piezoelectric device
05/09/2000US6060664 Electronic circuit component
05/09/2000US6060398 Guard cell for etching
05/09/2000US6060388 Conductors for microelectronic circuits and method of manufacture
05/09/2000US6060385 Method of making an interconnect structure
05/09/2000US6060382 Method for forming insulating film between metal wirings of semiconductor device
05/09/2000US6060381 Method of manufacturing an electronic part having an air-bridge interconnection
05/09/2000US6060378 Semiconductor bonding pad for better reliability
05/09/2000US6060373 Method for manufacturing a flip chip semiconductor device
05/09/2000US6060363 Method of manufacturing semiconductor device
05/09/2000US6060346 Semiconductor device and method for manufacturing the same
05/09/2000US6060343 Applying a polycyanurate resin on a surface of the fabricated wafer to form a buffer layer and curing
05/09/2000US6060342 Circuit packaging for millimeter-wave components
05/09/2000US6060341 Method of making an electronic package
05/09/2000US6060340 Packing method of semiconductor device
05/09/2000US6060339 Method and apparatus providing redundancy for fabricating highly reliable memory modules
05/09/2000US6060330 Method of customizing integrated circuits by selective secondary deposition of interconnect material
05/09/2000US6060170 A polyarylene ether modified by alkoxyarylene ketone groups crosslinked to form a heat resistant, low dielectric, elastic modulus above the increased glass transition temperature; very fine dimensioned integrated circuits; replaces silica
05/09/2000US6060169 Exhibits a characteristic unique absorption spectrum with distinct features in individual regions during fourier-transform infra-red (ftir) spectroscopy; difficult to duplicate; warrenty cards for computers and electronics
05/09/2000US6060150 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
05/09/2000US6059940 Method for fabricating dual layer protective barrier copper metallization
05/09/2000US6059939 Method for high density edge mounting of chips
05/09/2000US6059917 Control of parallelism during semiconductor die attach
05/09/2000US6059872 Smooth titanium nitride films having low resistivity
05/09/2000US6059553 Integrated circuit dielectrics
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