Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/30/2013CN103378042A 半导体封装模块 The semiconductor package module
10/30/2013CN103378041A Methods and apparatus for bump-on-trace chip packaging
10/30/2013CN103378040A Semiconductor device packages and methods
10/30/2013CN103378039A Stud bump structure for semiconductor package assemblies
10/30/2013CN103378038A 半导体装置 Semiconductor device
10/30/2013CN103378037A Methods and apparatus for solder connections
10/30/2013CN103378036A Semiconductor devices and methods of manufacturing and using thereof
10/30/2013CN103378035A Pressure contact arrangement and method for producing a pressure contact arrangement
10/30/2013CN103378034A Semiconductor package with through silicon via interconnect
10/30/2013CN103378033A Through-substrate vias and methods for forming the same
10/30/2013CN103378032A Semiconductor chip and method for forming same
10/30/2013CN103378031A Semiconductor chip, packaging structure and method for forming same
10/30/2013CN103378030A Through-silicon-via structure
10/30/2013CN103378029A Through-silicon-via structure
10/30/2013CN103378028A Semiconductor structure with stress protection structure and forming method of semiconductor structure
10/30/2013CN103378027A Liquid-cooled assembly with in-line power semiconductor modules and power semiconductor module
10/30/2013CN103378026A Three-dimensional packaging method having heat radiation function
10/30/2013CN103378025A 半导体装置 Semiconductor device
10/30/2013CN103378024A Heat dissipation device and method for manufacturing the same
10/30/2013CN103378023A Electric apparatus with excellent exothermic and re-work performance and manufacture method thereof
10/30/2013CN103378022A 散热片及其制造方法 Heat sink and a manufacturing method
10/30/2013CN103378021A Power module with directly attached thermally conductive structures
10/30/2013CN103378020A Method for forming heat sink with through silicon vias
10/30/2013CN103378019A Semiconductor packages with heat dissipation structures and related methods
10/30/2013CN103378018A Double side cooling power semiconductor module and multi-stacked power semiconductor module package using the same
10/30/2013CN103378017A High density 3D package
10/30/2013CN103378016A Chip assembling structure, chip assembling method and optical fiber coupling module
10/30/2013CN103378015A Semiconductor chip, packaging structure and method for forming same
10/30/2013CN103378014A Package carrier and manufacturing method thereof
10/30/2013CN103378013A Electronic component and electronic apparatus
10/30/2013CN103378012A 半导体封装 The semiconductor package
10/30/2013CN103378011A Optoelectronic package and method for making same
10/30/2013CN103377999A 3d integrated circuit system with connecting via structure and method for forming the same
10/30/2013CN103377998A Methods and apparatus for via last through-vias
10/30/2013CN103377997A Method for forming buried conductive line and structure of buried conductive line
10/30/2013CN103377995A Semiconductor chip, semiconductor encapsulation structure and forming method thereof
10/30/2013CN103377992A Silicon through hole structure and method for manufacturing same
10/30/2013CN103377957A Chip package and method of forming the same
10/30/2013CN103377955A Package on package structures and methods for forming the same
10/30/2013CN103377950A Substrate and method of producing substrate for at least one power semiconductor component
10/30/2013CN103377949A Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/30/2013CN103377890A Methods for fabricating and orienting semiconductor wafers
10/30/2013CN103377880A Coil and method of manufacturing a coil
10/30/2013CN103377305A Trace layout method in bump-on-trace structures
10/30/2013CN103376395A Test structure of transistor alternating current hot carrier injection characteristics
10/30/2013CN103376021A 热交换器 Heat exchanger
10/30/2013CN102449192B Electroless palladium plating solution
10/30/2013CN102386167B Structure of semiconductor device
10/30/2013CN102364676B Packaging shell structure for semiconductor power module
10/30/2013CN102211984B Epoxy molding compound, epoxy resin and preparation methods thereof
10/30/2013CN102210021B Surface-mountable apparatus
10/30/2013CN102208438B Virtually substrate-less composite power semiconductor device and method
10/30/2013CN102197456B Improved metal-on-metal capacitor with diagonal feedline
10/30/2013CN102169877B Circuit module, electronic device including same, and circuit module manufacturing method
10/30/2013CN102142450B Manufacturing method of photoelectric conversion apparatus
10/30/2013CN102136462B General output and input unit as well as related device and method thereof
10/30/2013CN101976657B Substrate structure for semiconductor device fabrication and method for fabricating same
10/30/2013CN101925530B Package method for manufacturing semiconductor device
10/30/2013CN101924063B Integrated circuit system employing low-K dielectrics and method of manufacture thereof
10/30/2013CN101794852B Lighting emitting device package
10/30/2013CN101777512B Local interconnect structure for CMOS image sensor and its manufacturing method
10/30/2013CN101728339B Sealing device
10/30/2013CN101681834B Process for producing semiconductor device
10/30/2013CN101673729B 半导体器件 Semiconductor devices
10/30/2013CN101606168B Method for applying markings to substrate surfaces by means of transfer method
10/30/2013CN101517728B Electronic device and method for making same
10/30/2013CN101438405B Method and apparatus for indicating directionality in integrated circuit manufacturing
10/29/2013USRE44562 Solder joint flip chip interconnection having relief structure
10/29/2013US8571249 Silicon microphone package
10/29/2013US8570748 Planar electrical power electronic modules for high-temperature applications, and corresponding production methods
10/29/2013US8570746 Mounting apparatus for heat dissipating member
10/29/2013US8570693 Compensating for an electrostatic discharge capacitance load
10/29/2013US8570515 Periodic patterns and technique to control misalignment between two layers
10/29/2013US8569949 Method of light dispersion and preferential scattering of certain wavelengths of light-emitting diodes and bulbs constructed therefrom
10/29/2013US8569900 Nanowire sensor with angled segments that are differently functionalized
10/29/2013US8569899 Device and method for alignment of vertically stacked wafers and die
10/29/2013US8569898 Semiconductor device
10/29/2013US8569897 Protection layer for preventing UBM layer from chemical attack and oxidation
10/29/2013US8569896 Active area bonding compatible high current structures
10/29/2013US8569895 Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die
10/29/2013US8569894 Semiconductor package with single sided substrate design and manufacturing methods thereof
10/29/2013US8569893 Self-aligned, integrated circuit contact
10/29/2013US8569892 Semiconductor device and manufacturing method thereof
10/29/2013US8569890 Power semiconductor device module
10/29/2013US8569889 Nano thick Pt metallization layer
10/29/2013US8569888 Wiring structure and method of forming the structure
10/29/2013US8569887 Post passivation interconnect with oxidation prevention layer
10/29/2013US8569886 Methods and apparatus of under bump metallization in packaging semiconductor devices
10/29/2013US8569885 Stacked semiconductor packages and related methods
10/29/2013US8569884 Multiple die in a face down package
10/29/2013US8569883 Package for high power devices
10/29/2013US8569882 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
10/29/2013US8569881 Semiconductor device
10/29/2013US8569880 Multilayer printed wiring board
10/29/2013US8569879 Accessing or interconnecting integrated circuits
10/29/2013US8569878 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
10/29/2013US8569877 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
10/29/2013US8569876 Packaged semiconductor chips with array
10/29/2013US8569875 Integrally molded die and bezel structure for fingerprint sensors and the like
10/29/2013US8569874 High memory density, high input/output bandwidth logic-memory structure and architecture
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