Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/29/2013US8569873 Mitigation of plating stub resonance by controlling surface roughness
10/29/2013US8569872 Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
10/29/2013US8569871 Semiconductor device having a molded package
10/29/2013US8569869 Integrated circuit packaging system with encapsulation and method of manufacture thereof
10/29/2013US8569836 Semiconductor device
10/29/2013US8569835 Semiconductor device
10/29/2013US8569802 Semiconductor device and display device
10/29/2013US8569790 Light emitting diode package having interconnection structures
10/29/2013US8569113 Method for producing a microfluid component, as well as microfluid component
10/29/2013US8569111 Manufacturing method for semiconductor devices
10/29/2013US8569109 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
10/29/2013US8569107 Semiconductor integrated circuit device and process for manufacturing the same
10/29/2013US8569082 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
10/29/2013CA2525664C Card with embedded ic and electrochemical cell
10/24/2013WO2013158976A1 Heat reduction sheet
10/24/2013WO2013158741A1 Thermally conductive polymer compostions to reduce molding cycle time
10/24/2013WO2013158721A1 Enhanced package thermal management using external and internal capacitive thermal material
10/24/2013WO2013157782A1 Method of manufacturing chip package substrate amd method of manufacturing chip package
10/24/2013WO2013157618A1 Encapsulant composition for light-emitting diode
10/24/2013WO2013157467A1 Semiconductor device and cooler for semiconductor device
10/24/2013WO2013157300A1 Device-mounting structure in semiconductor device
10/24/2013WO2013157218A1 Refrigeration device
10/24/2013WO2013157172A1 Semiconductor package and method for producing same, semiconductor module, and semiconductor device
10/24/2013WO2013157117A1 Computer provided with cooling system
10/24/2013WO2013157080A1 Semiconductor device and method for manufacturing same
10/24/2013WO2013157079A1 Circuit substrate and circuit substrate on which semiconducor device is mounted
10/24/2013WO2013156013A1 Optical sensor arrangement
10/24/2013WO2013095692A3 Electrical fuse and method of making the same
10/24/2013WO2013094952A9 Method of manufacturing thermoelectric device and thermoelectric cooling module and device using the same
10/24/2013WO2013057949A3 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
10/24/2013US20130280889 Semiconductor device and method capable of scribing chips with high yield
10/24/2013US20130280865 QFN Package and Manufacturing Process Thereof
10/24/2013US20130280864 Stacked interconnect heat sink
10/24/2013US20130280842 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
10/24/2013US20130280521 Gas barrier film and electronic device
10/24/2013US20130279114 Vehicular Power Conversion Apparatus
10/24/2013US20130278326 Pressure Contact Arrangement and Method for Producing a Pressure Contact Arrangement
10/24/2013US20130278284 Semiconductor device and control system
10/24/2013US20130277867 Epoxy resin composition for sealing, and electronic component device
10/24/2013US20130277866 Methods for Multi-Wire Routing and Apparatus Implementing Same
10/24/2013US20130277865 Multi die package structures
10/24/2013US20130277864 Method for producing a component and device comprising a component
10/24/2013US20130277863 Solderable pad fabrication for microelectronic components
10/24/2013US20130277862 Intermediate for electronic component mounting structure, electronic component mounting structure, and method for manufacturing electronic component mounting structure
10/24/2013US20130277861 Vertically stackable dies having chip identifier structures
10/24/2013US20130277860 Chip Pad Resistant to Antenna Effect and Method
10/24/2013US20130277859 Fabrication of semiconductor device including chemical mechanical polishing
10/24/2013US20130277858 Electrical interconnection structure and electrical interconnection method
10/24/2013US20130277857 Stack type semiconductor device and method of fabricating and testing the same
10/24/2013US20130277856 Method for stabilizing embedded silicon
10/24/2013US20130277855 High density 3d package
10/24/2013US20130277854 3d integrated circuit system with connecting via structure and method for forming the same
10/24/2013US20130277853 Semiconductor Devices, Methods of Manufacture Thereof, and Methods of Forming Conductive Features
10/24/2013US20130277852 Method for Creating a 3D Stacked Multichip Module
10/24/2013US20130277851 Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units
10/24/2013US20130277850 Electronic device
10/24/2013US20130277849 Internal wiring structure of semiconductor device
10/24/2013US20130277848 Method of forming contact and semiconductor device manufactured by using the method
10/24/2013US20130277847 Chip package and method for assembling chip package
10/24/2013US20130277846 Circuit arrangement for a thermally conductive chip assembly and a manufacturing method
10/24/2013US20130277845 Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
10/24/2013US20130277844 Through via process
10/24/2013US20130277843 Flip chip mounted monolithic microwave integrated circuit (mmic) structure
10/24/2013US20130277842 Copper interconnect with cvd liner and metallic cap
10/24/2013US20130277840 Thermally Enhanced Structure for Multi-Chip Device
10/24/2013US20130277839 Chip package and method for assembling same
10/24/2013US20130277838 Methods and Apparatus for Solder Connections
10/24/2013US20130277837 Controlled solder-on-die integrations on packages and methods of assembling same
10/24/2013US20130277836 Method and structure of sensors and mems devices using vertical mounting with interconnections
10/24/2013US20130277835 Semiconductor device
10/24/2013US20130277834 Flip chip package with shelf and method of manufacturing thereof
10/24/2013US20130277833 Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure
10/24/2013US20130277832 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/24/2013US20130277831 Semiconductor package and method of fabricating the same
10/24/2013US20130277830 Bump-on-Trace Interconnect
10/24/2013US20130277829 Method of Fabricating Three Dimensional Integrated Circuit
10/24/2013US20130277828 Methods and Apparatus for bump-on-trace Chip Packaging
10/24/2013US20130277827 Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
10/24/2013US20130277826 Semiconductor device and method of forming bump-on-lead interconnection
10/24/2013US20130277825 Method for Preventing Corrosion of Copper-Aluminum Intermetallic Compounds
10/24/2013US20130277824 Manufacturing Method for Semiconductor Device and Semiconductor Device
10/24/2013US20130277823 Split Loop Cut Pattern For Spacer Process
10/24/2013US20130277822 Interconnect structures for integrated circuits and their formation
10/24/2013US20130277821 Thermal package wth heat slug for die stacks
10/24/2013US20130277820 Semiconductor device
10/24/2013US20130277819 Semiconductor device and method of manufacturing semiconductor device
10/24/2013US20130277818 Chip carrier support systems
10/24/2013US20130277817 Lead frame, semiconductor package, and manufacturing method of the same
10/24/2013US20130277816 Plastic-packaged semiconductor device having wires with polymerized insulator skin
10/24/2013US20130277815 Method of forming a thin substrate chip scale package device and structure
10/24/2013US20130277814 Method for fixing semiconductor chip on circuit board and structure thereof
10/24/2013US20130277813 Chip package and method of forming the same
10/24/2013US20130277812 Electronic assembly with improved thermal management
10/24/2013US20130277811 Stacked interposer leadframes
10/24/2013US20130277807 Electronic device including a feature in an opening
10/24/2013US20130277801 Chip package
10/24/2013US20130277796 Electrical fuse and method of making
10/24/2013US20130277794 Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps
10/24/2013US20130277761 Motor control multilayer circuit board
10/24/2013US20130277756 Semiconductor device and method of manufacturing the same
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