| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/23/2000 | US6066559 Method for forming a semiconductor connection with a top surface having an enlarged recess |
| 05/23/2000 | US6066555 Method for eliminating lateral spacer erosion on enclosed contact topographies during RF sputter cleaning |
| 05/23/2000 | US6066553 Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry |
| 05/23/2000 | US6066548 Advance metallization process |
| 05/23/2000 | US6066537 Method for fabricating a shielded multilevel integrated circuit capacitor |
| 05/23/2000 | US6066515 Multilevel leadframe for a packaged integrated circuit |
| 05/23/2000 | US6066514 Depositing a layer of oxide-free copper and/or palladium metal directly on at least a portion of a back side of a die and encapsulating the die covering with metal layer with a mold compound |
| 05/23/2000 | US6066512 Semiconductor device, method of fabricating the same, and electronic apparatus |
| 05/23/2000 | US6066386 Printed circuit board with cavity for circuitization |
| 05/23/2000 | US6066219 One layer of aluminum nitride ceramic, in which one auxiliary or intermediate layer of aluminum oxide is applied to at least one side of this layer. |
| 05/23/2000 | US6066196 Method for the chemical vapor deposition of copper-based films and copper source precursors for the same |
| 05/23/2000 | US6065381 Apparatus for cutting tie bars of semiconductor packages |
| 05/23/2000 | US6065293 Thermoelectric cooling system |
| 05/23/2000 | US6065208 Method for cooling electronic devices using a flexible coolant conduit with slip on cold plates |
| 05/18/2000 | WO2000028772A1 Method and systems for providing information to a home system regarding a wireless unit roaming in a visited system |
| 05/18/2000 | WO2000028664A2 Fully integrated tuner architecture |
| 05/18/2000 | WO2000028629A1 Socket for ic device |
| 05/18/2000 | WO2000028593A1 Method for producing a semiconductor component with wiring partly extending in the substrate and semiconductor component produced according to said method |
| 05/18/2000 | WO2000028591A1 Monolithic integrated capacitor |
| 05/18/2000 | WO2000028590A1 Integrated circuit power supply |
| 05/18/2000 | WO2000028589A1 A plastic package having an air cavity and manufacturing method thereof |
| 05/18/2000 | WO2000028576A2 Semiconductor component having a wiring partly extending in the substrate and method for producing same |
| 05/18/2000 | WO2000027776A1 Carbon-based metal composite material, method for preparation thereof and use thereof |
| 05/18/2000 | WO2000007222A3 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
| 05/18/2000 | WO2000004582A8 Temperature control of electronic devices using power following feedback |
| 05/18/2000 | DE19955105A1 Semiconductor laminated conductor track structure (STACKED VIA) used high integration processes, e.g. LSI, VLSI |
| 05/18/2000 | DE19906875A1 Semiconductor assembly, especially with microwave chips e.g. for a mobile telephone, has a thin heat radiating substrate formed by diffusion metallization of molten copper into a molybdenum pressing |
| 05/18/2000 | DE19852933A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs |
| 05/18/2000 | DE19851461A1 Schnelle Leistungsdiode Fast power diode |
| 05/18/2000 | DE19847088A1 Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung Surface formed carrier for semiconductor chips and process for its preparation |
| 05/17/2000 | EP1001549A2 Audio signal processing apparatus |
| 05/17/2000 | EP1001465A2 Multi-chip memory apparatus and associated method |
| 05/17/2000 | EP1001464A1 Monolithic integrated circuit comprising a plurality of capacitors |
| 05/17/2000 | EP1001463A2 Aluminum interconnects for integrated circuits comprising titanium under and overlayers |
| 05/17/2000 | EP1001462A2 Semiconductor device with connection terminals in the form of a grid array |
| 05/17/2000 | EP1001461A1 High speed power diode having an amorphous carbon passivation layer and corresponding method |
| 05/17/2000 | EP1000915A2 Silicon carbide composite, method for producing it and heat dissipation device employing it |
| 05/17/2000 | EP1000531A2 Heat sink |
| 05/17/2000 | EP1000440A1 Ultra high-speed chip interconnect using free-space dielectrics |
| 05/17/2000 | EP0823196B1 Cooling body for cooling power gates |
| 05/17/2000 | EP0661916B1 Thermal conductivity sheet |
| 05/17/2000 | CN2378878Y Commutator apparatus for motorcycle |
| 05/17/2000 | CN1253662A Board for mounting semiconductor element, method for manufacturing same, and semiconductor device |
| 05/17/2000 | CN1253661A Capacitors in integrated circuits |
| 05/17/2000 | CN1253469A Array type multichip device and its manufacturing method |
| 05/17/2000 | CN1253468A Control of thermal distortion of chip mount |
| 05/17/2000 | CN1253415A Construction member units piling up in same outer casing |
| 05/17/2000 | CN1253378A Ball grid array type semiconductor device packaging |
| 05/17/2000 | CN1253377A Module type semi-conductor device |
| 05/17/2000 | CN1253376A Method for making semi-conductor device |
| 05/16/2000 | US6064576 Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
| 05/16/2000 | US6064573 Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits |
| 05/16/2000 | US6064572 Thermosyphon-powered jet-impingement cooling device |
| 05/16/2000 | US6064560 Active carbon and process for its production |
| 05/16/2000 | US6064557 Semiconductor device structured to be less susceptible to power supply noise |
| 05/16/2000 | US6064555 Radiation induced single event latchup protection and recovery of integrated circuits |
| 05/16/2000 | US6064286 Millimeter wave module with an interconnect from an interior cavity |
| 05/16/2000 | US6064119 Wiring structure and formation method thereof for semiconductor device |
| 05/16/2000 | US6064118 Multilevel interconnection structure having an air gap between interconnects |
| 05/16/2000 | US6064117 Plastic ball grid array assembly |
| 05/16/2000 | US6064116 Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
| 05/16/2000 | US6064115 Semiconductor device provided with a heat sink |
| 05/16/2000 | US6064114 Semiconductor device having a sub-chip-scale package structure and method for forming same |
| 05/16/2000 | US6064113 Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances |
| 05/16/2000 | US6064112 Resin-molded semiconductor device having a lead on chip structure |
| 05/16/2000 | US6064111 Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package |
| 05/16/2000 | US6064110 Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering |
| 05/16/2000 | US6064108 Integrated interdigitated capacitor |
| 05/16/2000 | US6064099 Layout of well contacts and source contacts of a semiconductor device |
| 05/16/2000 | US6064094 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
| 05/16/2000 | US6064084 Semiconductor device having a reliable contact structure |
| 05/16/2000 | US6063889 Liquid organopolysiloxane resins, a process for their preparation, low viscosity polydiorganosiloxane compositions containing liquid organopolysiloxane resins and their use |
| 05/16/2000 | US6063876 Epoxy resin composition and epoxy resin composition for encapsulating semiconductors |
| 05/16/2000 | US6063828 Curable composition with initiators with maleimides |
| 05/16/2000 | US6063695 Simplified process for the fabrication of deep clear laser marks using a photoresist mask |
| 05/16/2000 | US6063687 Formation of trench isolation for active areas and first level conductors |
| 05/16/2000 | US6063685 Device level identification methodology |
| 05/16/2000 | US6063651 Method for activating fusible links on a circuit substrate |
| 05/16/2000 | US6063650 Reduced stress LOC assembly |
| 05/16/2000 | US6063649 Device mounting a semiconductor element on a wiring substrate and manufacturing method thereof |
| 05/16/2000 | US6063648 Lead formation usings grids |
| 05/16/2000 | US6063647 Method for making circuit elements for a z-axis interconnect |
| 05/16/2000 | US6063640 Semiconductor wafer testing method with probe pin contact |
| 05/16/2000 | US6063529 Overlay accuracy measurement mark |
| 05/16/2000 | US6063506 Interconnection for electrical connections consisting of copper alloys containing an alloying element selected from carbon and/or indium for improved electromigration resistance, low resistivity and good corrosion resistance |
| 05/16/2000 | US6063228 Method and apparatus for sticking a film to a lead frame |
| 05/16/2000 | US6063139 Apparatus for continuous assembly of a semiconductor lead frame package |
| 05/16/2000 | US6062874 IC socket for IC package |
| 05/16/2000 | US6062873 Socket for chip package test |
| 05/16/2000 | US6062869 Method of making a stacked thin film assembly |
| 05/16/2000 | US6062302 Composite heat sink |
| 05/16/2000 | US6062301 Knockdown CPU heat dissipater |
| 05/16/2000 | US6062299 Heat sink |
| 05/16/2000 | CA2057490C Laminated diamond substrate |
| 05/13/2000 | CA2287167A1 Device for limiting the temperature of a laser diode which emits lightwaves |
| 05/11/2000 | WO2000027177A1 Heatsink for electronic component, and apparatus and method for manufacturing the same |
| 05/11/2000 | WO2000027174A1 An electrical component and an electrical circuit module having connected ground planes |
| 05/11/2000 | WO2000027160A1 Methods and systems to obtain a tldn for a home system in response to a call received for a wireless unit roaming in a visited system |
| 05/11/2000 | WO2000027159A1 Methods and systems to substantially prevent fraudulent use of a wireless unit roaming in a visited system |
| 05/11/2000 | WO2000026964A1 Raised pedestal radiation shield for sensitive electronics |