Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2000
05/31/2000DE19855193A1 Wiring plate for peripheral type surface mounting component
05/31/2000CN2381022Y Cooling device for chip of computer
05/31/2000CN1254955A Semiconductor device and its associated ICs
05/31/2000CN1254952A 电子器件 Electronic devices
05/31/2000CN1254951A Process for preparing thin-film transistor
05/31/2000CN1254949A Semiconductor metallizing system and method
05/31/2000CN1254947A Method for manufacturing thin-film transistor
05/31/2000CN1254941A Fuse arrangement for improving technologic window of blowing fuses
05/31/2000CN1254710A Polybenzoxazole resin and precursor thereof
05/31/2000CN1053064C Method for forming plug in semicondcutor device
05/30/2000US6069794 Bushing for combining fan and heat sink
05/30/2000US6069793 Circuit module and information processing apparatus
05/30/2000US6069501 Semiconductor device
05/30/2000US6069482 Ball grid array package emulator
05/30/2000US6069408 Semiconductor device and method of manufacturing semiconductor device
05/30/2000US6069407 BGA package using PCB and tape in a die-up configuration
05/30/2000US6069406 Wiring patterned film and production thereof
05/30/2000US6069402 Card with a built-in electronic part
05/30/2000US6069401 Semiconductor chip
05/30/2000US6069400 Semiconductor device and method of fabricating the same
05/30/2000US6069397 Integrable using amorphous magnetic material circuit inductor
05/30/2000US6069093 Process of forming metal films and multi layer structure
05/30/2000US6069089 Defective semiconductor redistribution labeling system
05/30/2000US6069078 Multi-level interconnect metallization technique
05/30/2000US6069076 Method of making a semiconductor device with changeable interconnection
05/30/2000US6069070 Multilevel interconnections of electronic components
05/30/2000US6069068 Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
05/30/2000US6069067 Method of manufacturing a semiconductor device
05/30/2000US6069066 Method of forming bonding pad
05/30/2000US6069065 Increasing a bond strength with solder when performing wiring through soldering.
05/30/2000US6069064 Method for forming a junctionless antifuse
05/30/2000US6069045 Method of forming C49-structure tungsten-containing titanium salicide structure
05/30/2000US6069029 Semiconductor device chip on lead and lead on chip manufacturing
05/30/2000US6069028 Technique for attaching die to leads
05/30/2000US6069027 Fixture for lid-attachment for encapsulated packages
05/30/2000US6069026 Semiconductor device and method of fabrication
05/30/2000US6069025 Method for packaging a semiconductor device
05/30/2000US6069023 Attaching heat sinks directly to flip chips and ceramic chip carriers
05/30/2000US6068923 Use of argon sputtering to modify surface properties by thin film deposition
05/30/2000US6068912 Platible non-metallic filler material for metallurgical screening paste
05/30/2000US6068892 Methods and structures for pad reconfiguration to allow intermediate testing during manufacture of an integrated circuit
05/30/2000US6068884 Method of making low κ dielectric inorganic/organic hybrid films
05/30/2000US6068669 Compliant interconnect for testing a semiconductor die
05/30/2000US6068180 System, apparatus, and method for connecting a semiconductor chip to a three-dimensional leadframe
05/30/2000US6068130 Device and method for protecting electronic component
05/30/2000US6068051 Channeled heat sink
05/25/2000WO2000030175A1 Interlayer between titanium nitride and high density plasma oxide
05/25/2000WO2000030171A1 Low alpha emissive solder bumps
05/25/2000WO2000030170A1 A semiconductor chip and a lead frame
05/25/2000WO2000017914A3 Method for forming silicide regions on an integrated device
05/25/2000WO2000017913A3 Method for forming a silicide region on a silicon body
05/25/2000WO1999063590A9 A method for treating a deposited film for resistivity reduction
05/25/2000DE19953594A1 Surface-mounted electronic component, e.g. a capacitor, has electrodes of migration resistant material formed on the entire surface of a substrate
05/25/2000DE19951752A1 Electrical device, e.g. a thyristor, IGBT or large capacitor diode, has an intermediate contact of two different diameter electrically and thermally conductive components between a heat emitting element and an electrode
05/25/2000DE19950402A1 Stencil heat pipe for cooling electronic components, has heat transfer block and cavities formed by joining inner walls of endogenic surface and heat releasing surface of container
05/25/2000DE19852072A1 Halbleiterbauelement mit einer stückweise im Substrat verlaufenden Verdrahtung und Verfahren zu dessen Herstellung Semiconductor component with a piecewise extending wiring in the substrate and process for its production
05/25/2000DE19851458A1 Monolithisch integrierte Schaltung mit mehreren einen Nebenschluß nach Masse bildenden Kapazitäten Monolithic integrated circuit with multiple shunt to ground forming capacity
05/24/2000EP1003216A2 Multilayered ceramic structure
05/24/2000EP1003215A2 Heat sink with integral self-locking clamp
05/24/2000EP1003214A2 Semiconductor device and method of producing the same
05/24/2000EP1003213A2 Method of fabricating resin-sealed semiconductor devices
05/24/2000EP1003209A1 Process for manufacturing semiconductor device
05/24/2000EP1002815A1 Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
05/24/2000EP1002611A1 Solder ball connections and assembly process
05/24/2000EP1002610A1 Solder ball connections and assembly process
05/24/2000EP1002338A1 Wafer marking
05/24/2000EP1002337A1 Semiconductor chip packaging and method for the production thereof
05/24/2000EP1002330A1 Method for monitoring the performance of an ion implanter using reusable wafers
05/24/2000EP1001852A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom
05/24/2000EP0943157A4 Integrated electronic circuit
05/24/2000EP0739499B1 Method of forming polyimide patterns on substrates
05/24/2000CN2379996Y Memory element moulding device
05/24/2000CN1254186A Electric fuse with close space length and its production method in semiconductor
05/24/2000CN1254185A Packaging device for small semiconductor
05/24/2000CN1254182A Method for making element by using reworkable gap packing sealant
05/24/2000CN1254181A Method for preparing electronic instrument component by simultaneously adopoting soldifying adhesive and sealant
05/24/2000CN1254180A Method for correcting photo-adjacency effect in course of production of semiconductor device
05/24/2000CN1052813C Method for producing semiconductor radiating body and specific mould
05/23/2000US6067633 Design and methodology for manufacturing data processing systems having multiple processors
05/23/2000US6067507 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processd during their manufacture
05/23/2000US6067231 Heat-dissipating structure for an electrical device
05/23/2000US6067230 Electronic device with heat radiation members
05/23/2000US6067228 Heat sink
05/23/2000US6067227 Heat sink for cooling a heat producing element and application
05/23/2000US6067025 Apparatus and method for detecting the height above a silicon surface
05/23/2000US6066896 Semiconductor integrated circuit device and its manufacturing method
05/23/2000US6066895 Interconnecting structure for semiconductor integrated circuits and method
05/23/2000US6066894 Semiconductor device and a method of manufacturing the same
05/23/2000US6066893 Contaminant resistant barriers to prevent outgassing
05/23/2000US6066892 Copper alloy seed layer for copper metallization in an integrated circuit
05/23/2000US6066890 Separate circuit devices in an intra-package configuration and assembly techniques
05/23/2000US6066888 Tape carrier and tape carrier device using the same
05/23/2000US6066887 LOC semiconductor package
05/23/2000US6066886 Semiconductor wafer in which redundant memory portion is shared by two neighboring semiconductor memory portions and is connected to the semiconductor memory portions
05/23/2000US6066877 Vertical power MOSFET having thick metal layer to reduce distributed resistance
05/23/2000US6066861 Wavelength-converting casting composition and its use
05/23/2000US6066804 Electronic circuit package
05/23/2000US6066577 Prevent degradation of metal from exposure to fluorine
05/23/2000US6066573 Method of producing dielectric film
05/23/2000US6066560 Forming a trench in semiconductor substrate, applying diffusion barrier on the substrate, depositing a copper layer, forming copper oxide on copper layer, planarizing the oxide layer, then depositing a diffusion barrier layer
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