Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2000
06/15/2000WO2000035258A1 Multilayered switching plate
06/15/2000WO2000035257A1 Contact node
06/15/2000WO2000035085A1 Encapsulated surface wave component and collective method for making same
06/15/2000WO2000035015A1 Rf circuit module
06/15/2000WO2000035014A1 Method for producing an integrated switching circuit
06/15/2000WO2000035013A1 An integrated circuit device
06/15/2000WO2000035012A1 Mechanical assembly for regulating the temperature of an electronic device
06/15/2000WO2000035011A1 Mechanical assembly for regulating the temperature of an electronic device
06/15/2000WO2000035010A1 Heat exchanger that contacts an entire planar face of an electronic device except for its corners
06/15/2000WO2000035009A1 Substrate for ic crystals
06/15/2000WO2000035008A1 Monocrystalline ic module
06/15/2000WO2000035004A1 Integrated circuit
06/15/2000WO2000035002A1 Method and device for optically monitoring processes for manufacturing microstructured surfaces in the production of semiconductors
06/15/2000WO2000035001A1 Method for housing electronic components
06/15/2000WO2000035000A1 Ultra high-speed semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectric
06/15/2000WO2000034539A1 Composite material and use thereof
06/15/2000WO1999065074A3 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
06/15/2000WO1999062117A9 Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
06/15/2000WO1999049499A3 Method for connecting and supporting a csp housing connection with an integrated circuit
06/15/2000WO1999038196A3 Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions
06/15/2000DE19959164A1 Electronic device for an integrated input/output circuit which combines a current switching circuit with a bus cabling system
06/15/2000DE19958229A1 Casing for optical semiconductor sensor, comprises focusing unit, transparent plate and casing
06/15/2000DE19922614A1 Method to control manufacturing processes of fine structure surfaces in semiconductor manufacturing; involves comparing signatures obtained from diffraction image with references for reference surfaces
06/15/2000DE19856955A1 Housing for a cooling system for a computer has fan that draws air over the surface of a heat sink
06/15/2000DE19856332A1 Electronic component housing, e.g. for a Gunn diode of a distance radar for an automobile adaptive cruise control system, comprises a cover with an integral contact spring for electrically contacting the component
06/15/2000DE19843624C1 Integrierte Schaltungsanordnung und Verfahren zu deren Herstellung An integrated circuit assembly and method for their preparation
06/15/2000CA2320343A1 Encapsulated surface wave component and collective method for making same
06/14/2000EP1009202A1 Soldering member for printed wiring boards
06/14/2000EP1009195A1 Radiation structure for heating element
06/14/2000EP1009079A1 Device for limiting the temperature of a light emitting laser device
06/14/2000EP1009029A1 Semiconductor device and method of producing the same
06/14/2000EP1009027A2 Multipoint conductive sheet
06/14/2000EP1009026A2 Power semiconductor module
06/14/2000EP1009025A2 Epoxy resin composition for encapsulation of semiconductor devices
06/14/2000EP1009019A2 Method and apparatus for processing leadframe
06/14/2000EP1008570A1 Method for producing oxide type ceramic sintered body
06/14/2000EP1008414A2 Solder ball connections and assembly process
06/14/2000EP1008186A1 Power transistor cell
06/14/2000EP1008180A1 Gallium arsenide monolithic microwave integrated circuits employing thermally bumped devices
06/14/2000EP1008179A1 Method for producing a matrix from thin film transistors with storage capacities
06/14/2000EP1008176A1 Method for making an anisotropic conductive coating with conductive inserts
06/14/2000EP1008172A4 Improved interface between titanium and aluminum-alloy in metal stack for integrated circuit
06/14/2000EP1008172A1 Improved interface between titanium and aluminum-alloy in metal stack for integrated circuit
06/14/2000EP1008002A1 Electronic or optoelectronic housing with ceramic insert
06/14/2000EP1007308A4 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/14/2000EP1007308A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/14/2000EP1007249A1 Method for producing a cooling element, and a cooling element
06/14/2000CN2383212Y Integrated circuit packaging structure
06/14/2000CN1256792A 三维器件 3D device
06/14/2000CN1256791A Method of manufacturing three-dimensional device
06/14/2000CN1256532A Socket for pin grid array component and actuating mechanism thereof
06/14/2000CN1256531A Socket for pin grid array component
06/14/2000CN1256515A Semiconductor device with grid ball bonded array structure and its manufacturing method
06/14/2000CN1256514A Insulated substrate, its making method and modular semiconductor device having the same thereof
06/14/2000CN1256512A Semiconductor device and its manufacturing method
06/14/2000CN1256288A Epoxy resin composition for packaging semiconductor and semiconductor device thereof
06/13/2000US6075909 Optical monitoring system for III-V wafer processing
06/13/2000US6075712 Flip-chip having electrical contact pads on the backside of the chip
06/13/2000US6075711 System and method for routing connections of integrated circuits
06/13/2000US6075710 Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
06/13/2000US6075703 Heat sink assembly
06/13/2000US6075701 Electronic structure having an embedded pyrolytic graphite heat sink material
06/13/2000US6075700 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
06/13/2000US6075699 Heat sink assembly with snap-in legs
06/13/2000US6075427 MCM with high Q overlapping resonator
06/13/2000US6075293 Semiconductor device having a multi-layer metal interconnect structure
06/13/2000US6075292 Semiconductor device and method of manufacturing the same in which degradation due to plasma can be prevented
06/13/2000US6075290 Surface mount die: wafer level chip-scale package and process for making the same
06/13/2000US6075289 Thermally enhanced packaged semiconductor assemblies
06/13/2000US6075288 Semiconductor package having interlocking heat sinks and method of fabrication
06/13/2000US6075287 Integrated, multi-chip, thermally conductive packaging device and methodology
06/13/2000US6075286 Stress clip design
06/13/2000US6075285 Semiconductor package substrate with power die
06/13/2000US6075284 Stack package
06/13/2000US6075283 Downset lead frame for semiconductor packages
06/13/2000US6075282 Leadframe for a semiconductor device and associated method
06/13/2000US6075281 Modified lead finger for wire bonding
06/13/2000US6075280 Precision breaking of semiconductor wafer into chips by applying an etch process
06/13/2000US6075279 Semiconductor device
06/13/2000US6075278 Containing copper, lithium, optionally silicon; specified concentration of lithium based on solubility in aluminum
06/13/2000US6075277 Power integrated circuit
06/13/2000US6075263 Method of evaluating the surface state and the interface trap of a semiconductor
06/13/2000US6075255 Contactor system for a ball grid array device
06/13/2000US6075208 Component mounting arrangement and assembly
06/13/2000US6074963 Cured silicone rubber layer composite sheets with fillers of thermoconductive material, porous reinforcing material from olefin polysiloxanes reacted with hydrogen polysiloxanes
06/13/2000US6074948 Method for manufacturing thin semiconductor device
06/13/2000US6074940 Fusion forming a semiconductors substrate, insulation films, etching, burying metal in etched region
06/13/2000US6074938 Method of forming a semiconductor device comprising a dummy polysilicon gate electrode short-circuited to a dummy element region in a substrate
06/13/2000US6074925 Method for fabricating semiconductor device with polycide structure for electrode or interconnect
06/13/2000US6074898 Lead frame and integrated circuit package
06/13/2000US6074896 Method of processing semiconductor material wafers and method of forming flip chips and semiconductor chips
06/13/2000US6074894 Mounting method of semiconductor device
06/13/2000US6074886 Electrical characterization of an insulating layer covering a conducting or semiconducting substrate
06/13/2000US6074567 Method for producing a semiconductor package
06/13/2000US6073829 Method and arrangement for attaching a component
06/13/2000US6073684 Clad casting for laptop computers and the like
06/13/2000US6073683 Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same
06/13/2000CA2159243C Method of manufacturing chip-size package-type semiconductor device
06/08/2000WO2000033628A1 A fibrous thermal interface adaptor
06/08/2000WO2000033622A2 Improved heat sink and process of manufacture
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