Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2000
06/27/2000US6080604 Semiconductor device having tab-leads and a fabrication method thereof
06/27/2000US6080603 Fixtures and methods for lead bonding and deformation
06/27/2000US6080602 Method of producing a semiconductor device using a reduced mounting area
06/27/2000US6080597 Test pattern structure for measuring misalignment in semiconductor device fabrication process and method for measuring misalignment
06/27/2000US6080596 Method for forming vertical interconnect process for silicon segments with dielectric isolation
06/27/2000US6080494 Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array
06/27/2000US6080492 Gold alloy thin wire for semiconductor devices
06/27/2000US6080444 Placing substrate on susceptor equipped with heating member and situated in chamber, forming film on substrate by heating substrate using heating member while controlling total rate of supplying gas, annealing
06/27/2000US6080443 Method for production of microcapsule type conductive filler
06/27/2000US6080335 Conductive paste and method for producing ceramic substrate using the same
06/27/2000US6080264 Combination of semiconductor interconnect
06/27/2000US6079486 Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same
06/27/2000US6079256 Overlay alignment measurement of wafers
06/27/2000CA2166926C Packaging multi-chip modules without wire-bond interconnection
06/27/2000CA2148640C Contacting system for electrical devices
06/22/2000WO2000036893A2 Method of applying a phase change thermal interface material
06/22/2000WO2000036888A1 Flexible interconnection between integrated circuit chip and substrate or printed circuit board
06/22/2000WO2000036886A1 Conductive connecting pin and package board
06/22/2000WO2000036651A1 Integrated circuit with capacitative elements
06/22/2000WO2000036650A1 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
06/22/2000WO2000036648A1 Method of manufacturing diamond heat sink
06/22/2000WO2000036647A1 Diamond heat sink and method of manufacture thereof
06/22/2000WO2000036646A1 Mounting adapter for ball grid array packages, mounting structure for ball grid array packages utilizing the same, and method of repairing ball grid array package
06/22/2000WO2000036645A1 Light extractor apparatus
06/22/2000WO2000036643A1 Method and apparatus for removing one or more covers of an electronic module
06/22/2000WO2000036466A1 Semiconductor integrated circuit device and method of manufacturing the same
06/22/2000WO2000036193A1 Diamond structure and method of manufacture thereof
06/22/2000WO2000035623A1 Laser processing
06/22/2000WO2000008684A9 High performance flip chip package
06/22/2000WO2000007236A3 Method and apparatus for forming improved metal interconnects
06/22/2000WO2000003574A3 Heat sink with transverse ribs
06/22/2000CA2351822A1 Light extractor apparatus
06/21/2000EP1011145A2 Customizable semiconductor devices
06/21/2000EP1011143A1 Semiconductor device with BiCMOS type substrate having noise decoupling
06/21/2000EP1011142A1 Semiconductor device comprising a substrate on insulator with noise decoupling
06/21/2000EP1011141A2 Semiconductor device and process for producing it
06/21/2000EP1011140A2 Heat sink fin assembly for cooling an LSI package
06/21/2000EP1011139A1 Printed wiring board and method for manufacturing the same
06/21/2000EP1011133A1 Encapsulated microelectronic SMD component, especially for an active implantable medical device and method for its manufacture
06/21/2000EP1010201A1 Component with protective layer and method for producing a protective layer for a component
06/21/2000EP1010199A1 Method of forming a barrier layer in a contact structure
06/21/2000EP1010108A1 Method and apparatus for channel-routing of an electronic device
06/21/2000EP1010048A1 Voltage regulating circuit for eliminating "latch-up
06/21/2000EP0852812A4 Semiconductor memory circuitry
06/21/2000DE19960836A1 Construction of IC card to prevent breakage of semiconductor chip, with strengthening plate laid over semiconductor chip
06/21/2000DE19960503A1 Metall-Verbindungs-Kontakt-Struktur mit einem kleinen Kontaktwiderstand und einem geringen Übergangsverlust sowie Verfahren zur Herstellung derselben Metal connection contact structure with a small contact resistance and a low loss transition as well as methods for producing the same
06/21/2000DE19857550A1 Encapsulation of metallic microcomponents on analyzing circuit on substrate wafer, e.g. for car, machine control and consumer purposes, has protective coating on circuit covered by bonding medium on cap wafer
06/21/2000DE19857064A1 Passivation of surface of semiconductor material, with or without natural oxide film, e.g. for solar cell, involves coating with solution containing polyfluorinated hydrocarbon with acid side groups and drying
06/21/2000DE19856833A1 Verfahren zur Herstellung eines integrierten Schaltkreises A process for producing an integrated circuit
06/21/2000DE19855389A1 Elektronische Vorrichtung Electronic device
06/21/2000CN2384312Y Transverse current fan cooler for semiconductor device
06/21/2000CN1257599A Electronic module for chip card
06/21/2000CN1257597A Method for making a contactless card with antenna connected with soldered wires
06/20/2000US6078537 Semiconductor circuit, in particular for use in an integrated module
06/20/2000US6078506 Tape-ball grid array type semiconductor device having reinforcement plate with slits
06/20/2000US6078502 System having heat dissipating leadframes
06/20/2000US6078500 Pluggable chip scale package
06/20/2000US6078123 Structure and method for mounting a saw device
06/20/2000US6078106 Semiconductor memory device having a plurality of wiring layers
06/20/2000US6078104 Carrier film and integrated circuit device using the same and method of making the same
06/20/2000US6078103 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
06/20/2000US6078102 Semiconductor die package for mounting in horizontal and upright configurations
06/20/2000US6078101 High-power microwave-frequency hybrid integrated circuit
06/20/2000US6078100 Utilization of die repattern layers for die internal connections
06/20/2000US6078099 Lead frame structure for preventing the warping of semiconductor package body
06/20/2000US6078098 Crushable bead on lead finger side surface to improve moldability
06/20/2000US6078097 Lead frame
06/20/2000US6078092 Resettable fuse integrated circuit package
06/20/2000US6078091 Inter-conductive layer fuse for integrated circuits
06/20/2000US6078088 Low dielectric semiconductor device with rigid lined interconnection system
06/20/2000US6078074 Semiconductor device having multilayer metal interconnection
06/20/2000US6078073 Semiconductor apparatus formed by SAC (self-aligned contact) method and manufacturing method therefor
06/20/2000US6078068 Electrostatic discharge protection bus/die edge seal
06/20/2000US6078057 Semiconductor devices having backside probing capability
06/20/2000US6077879 Curable resin and resin composition
06/20/2000US6077782 Method to improve the texture of aluminum metallization
06/20/2000US6077781 Single step process for blanket-selective CVD aluminum deposition
06/20/2000US6077779 Multi-step deposition to improve the conformality of ionized PVD films
06/20/2000US6077774 Method of forming ultra-thin and conformal diffusion barriers encapsulating copper
06/20/2000US6077773 Damascene process for reduced feature size
06/20/2000US6077768 Process for fabricating a multilevel interconnect
06/20/2000US6077766 Variable thickness pads on a substrate surface
06/20/2000US6077765 Structure of bump electrode and method of forming the same
06/20/2000US6077757 Method of forming chip semiconductor devices
06/20/2000US6077756 Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing
06/20/2000US6077728 Method of producing a ceramic package main body
06/20/2000US6077727 Method for manufacturing lead frame
06/20/2000US6077726 Method and apparatus for stress relief in solder bump formation on a semiconductor device
06/20/2000US6077724 Multi-chips semiconductor package and fabrication method
06/20/2000US6077723 Method for fabricating a multi chip module with alignment member
06/20/2000US6077619 Polycrystalline silicon carbide ceramic wafer and substrate
06/20/2000US6077574 Plasma CVD process for forming a fluorine-doped SiO2 dielectric film
06/20/2000US6077564 Firing paste of pulverulent glass with manganese oxide, alumina and silica components in moist, reducing atmosphere; plating
06/20/2000US6077380 Method of forming an adhesive connection
06/20/2000US6077327 Filling with aluminum or alloy powder the surfaces of a mass of aluminum or alloy and silicon carbide mixture, compacting, heating within a mold while further compacting to melt the aluminum material and form aluminum or alloy covering layer
06/20/2000US6076680 Taped electronic components
06/20/2000US6076596 Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
06/20/2000US6076594 Heat dissipating device
06/20/2000CA2158785C Electronic thick film component multiple terminal and method of making the same
06/15/2000WO2000035262A2 Method for mounting an electronic component
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