| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/11/2000 | US6087676 Multi-chip module system |
| 07/11/2000 | US6087675 Semiconductor device with an insulation film having emitter contact windows filled with polysilicon film |
| 07/11/2000 | US6087623 Semiconductor device marking apparatus using a rotating stopper |
| 07/11/2000 | US6087597 Connecting member and a connecting method with ball and tapered via |
| 07/11/2000 | US6087586 Chip scale package |
| 07/11/2000 | US6087585 Micro-dimensional coupling conductor |
| 07/11/2000 | US6087278 Method for fabricating semiconductor devices having an HDP-CVD oxide layer as a passivation layer |
| 07/11/2000 | US6087264 Forming a gate silicide on a semiconductor substrate, forming a patterned mask on gate material, etching gate material with a mixture of chlorine and oxygen using mask and increasing bias power as the substrate temperature decreases |
| 07/11/2000 | US6087259 Chemical vapor deposition of a titanium nitride film which serves as a diffusion barrier to suppress a reaction of tungsten, which forms the bit line, with silicon on a contact region during a thermal process at a high temperature |
| 07/11/2000 | US6087250 Forming silicon oxide(sio2) film on a semiconductor having first metal interconnection(mi), coating sio2 with silicon ladder polymer, pressing to flatten device, heat treating, forming sio2 layer on ladder polymer, then forming second mi |
| 07/11/2000 | US6087204 Method of making a multi-layer lead frame |
| 07/11/2000 | US6087203 Method for adhering and sealing a silicon chip in an integrated circuit package |
| 07/11/2000 | US6087202 Process for manufacturing semiconductor packages comprising an integrated circuit |
| 07/11/2000 | US6087201 Method of manufacturing ball grid array electronic component |
| 07/11/2000 | US6087200 Using microspheres as a stress buffer for integrated circuit prototypes |
| 07/11/2000 | US6087199 Method for fabricating a very dense chip package |
| 07/11/2000 | US6087195 Method and system for manufacturing lamp tiles |
| 07/11/2000 | US6087192 Testing semiconductor devices situated within package with conductive leads extending from package to determine defects; marking defective devices with polymer marker which is able to with stand high temperature and acid and alkali resitant |
| 07/11/2000 | US6087189 Test structure for monitoring overetching of silicide during contact opening |
| 07/11/2000 | US6087006 Semiconductor device having surface-protecting film comprising polyimide obtained by heat-curing precursor having polar substituents as the side chains |
| 07/11/2000 | US6086994 Plastic film containing heat-conductive dielectric filler and having one surface subjected to high frequency sputter-etching, layer of heat-conductive pressure sensitive adhesive comprising hydrophilic alkyl (meth)acrylate polymer |
| 07/11/2000 | US6086990 High thermal conductivity silicon nitride circuit substrate and semiconductor device using the same |
| 07/11/2000 | US6086793 Method of producing electrically conductive pastes and materials using same |
| 07/11/2000 | US6086641 Bonding a pellet to the top or the bottom of a lead frame by paste-like adhesive or organic resin adhesive. |
| 07/11/2000 | US6086386 Flexible connectors for microelectronic elements |
| 07/11/2000 | US6085967 Method of registrably aligning fabricated wafers preceding bonding |
| 07/11/2000 | US6085833 Heat sink |
| 07/11/2000 | US6085831 Direct chip-cooling through liquid vaporization heat exchange |
| 07/11/2000 | US6085830 Heat sink, and process and apparatus for manufacturing the same |
| 07/11/2000 | US6085804 Apparatus and method for forming leads and removing tin dust from leads |
| 07/11/2000 | US6085412 Method for manufacturing card type memory device |
| 07/11/2000 | US6085396 Manufacturing method for rectifying diodes |
| 07/06/2000 | WO2000040068A1 High intensity cooler |
| 07/06/2000 | WO2000040067A1 Modular coolant manifold for use with power electronics devices having integrated coolers |
| 07/06/2000 | WO2000039854A1 Coaxial type signal line and manufacturing method thereof |
| 07/06/2000 | WO2000039853A1 Vertically integrated semiconductor arrangement |
| 07/06/2000 | WO2000039852A1 Modular power electronics device having integrated cooling apparatus |
| 07/06/2000 | WO2000039851A1 Method and apparatus for cooling backside optically probed integrated circuits |
| 07/06/2000 | WO2000039848A2 Test method and assembly including a test die for testing a semiconductor product die |
| 07/06/2000 | WO2000039219A1 Polyarylene sulfide resin composition for electronic part encapsulation |
| 07/06/2000 | WO2000039189A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 07/06/2000 | WO2000018387A3 Antibiotic compositions for treatment of the eye, ear and nose |
| 07/06/2000 | DE19963883A1 Power semiconductor casing for surface securing enclosing substrate top and bottom faces, with top face carrying power semiconductor chip |
| 07/06/2000 | DE19927747C1 Multi-chip module for leads-on-chip mounting, includes rectangular chips on single wafer |
| 07/06/2000 | DE19915651A1 Semiconductor component for semiconductor chip |
| 07/06/2000 | DE19904751C1 Vertical IC, e.g. a vertical integrated CMOS circuit, comprises a chip stack with a via which electrically connects metallizations of spaced-apart chips and which is insulated from an intermediate chip |
| 07/06/2000 | DE19859739A1 Heat sink for electronic control device has power component thermally coupled to heat sink block on underside of component carrier via heat conduction plate in component reception opening in component carrier |
| 07/06/2000 | DE10002097A1 Method for installing interposition device, for testing dense connection area array; involves applying solder preform to ends of terminal pins protruding through interposition circuit board and soldering in soldering furnace |
| 07/05/2000 | EP1017100A1 Three-dimensional device |
| 07/05/2000 | EP1017099A2 Improvements in or relating to semiconductor devices |
| 07/05/2000 | EP1017098A2 Integrated circuit having a bonding pad and manufacturing method thereof |
| 07/05/2000 | EP1017094A2 Wafer-level package and a method of manufacturing thereof |
| 07/05/2000 | EP1016337A1 Temperature control system for an electronic device |
| 07/05/2000 | EP1016143A2 Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means |
| 07/05/2000 | EP1016140A1 Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductor component made according to this method and use of said semi-conductor component in a chip card |
| 07/05/2000 | EP1016139A1 Rf power device having voltage controlled linearity |
| 07/05/2000 | EP1016138A1 Plastic integrated circuit package and method and leadframe for making the package |
| 07/05/2000 | EP1016137A1 Housing for receiving a planar power transistor |
| 07/05/2000 | EP1016135A1 Fusion-bond electrical feed-through |
| 07/05/2000 | EP1016132A1 Capacitors in integrated circuits |
| 07/05/2000 | EP1016106A1 Ceramic multilayer printed circuit boards with embedded passive components |
| 07/05/2000 | EP1015836A1 Heat sink including pedestal |
| 07/05/2000 | EP1015159A1 Solder ball placement apparatus |
| 07/05/2000 | CN2386532Y High-efficient cooling silicon rectifying bridge |
| 07/05/2000 | CN1259205A Circuit board and detector, and method for manufacturing the same |
| 07/05/2000 | CN1258935A Grid welding ball array semi-conductor device and its producing method |
| 07/05/2000 | CN1258934A Electronic power parts with cooler |
| 07/05/2000 | CN1054237C 半导体器件 Semiconductor devices |
| 07/05/2000 | CN1054236C Production method of semiconductor diode with laminar material structure |
| 07/04/2000 | US6085018 Integrated circuit, electronic equipment and method of assembly which uses said integrated circuit |
| 07/04/2000 | US6084777 Ball grid array package |
| 07/04/2000 | US6084775 Heatsink and package structures with fusible release layer |
| 07/04/2000 | US6084771 Power electronic module and power electronic device including such modules |
| 07/04/2000 | US6084770 Device and method for convective cooling of an electronic component |
| 07/04/2000 | US6084679 Universal alignment marks for semiconductor defect capture and analysis |
| 07/04/2000 | US6084678 Method of alignment between mask pattern and wafer pattern |
| 07/04/2000 | US6084464 On-chip decoupling capacitor system with parallel fuse |
| 07/04/2000 | US6084463 Fuse circuit |
| 07/04/2000 | US6084421 Test socket |
| 07/04/2000 | US6084312 Semiconductor devices having double pad structure |
| 07/04/2000 | US6084311 A lead frame paddle comprises a polyimide coatings for eliminating the flow of die attach adhesive, the undesirable effects such as wire bonding problems and encapsulation problems |
| 07/04/2000 | US6084310 Semiconductor device, lead frame, and lead bonding |
| 07/04/2000 | US6084309 Semiconductor device and semiconductor device mounting structure |
| 07/04/2000 | US6084308 Chip-on-chip integrated circuit package and method for making the same |
| 07/04/2000 | US6084307 Bi-level digit line architecture for high density DRAMS |
| 07/04/2000 | US6084306 Bridging method of interconnects for integrated circuit packages |
| 07/04/2000 | US6084304 Structure of metallization |
| 07/04/2000 | US6084303 Integrated circuit comprising connection pads emerging on one surface |
| 07/04/2000 | US6084302 Barrier layer cladding around copper interconnect lines |
| 07/04/2000 | US6084301 Composite bump structures |
| 07/04/2000 | US6084300 Compact resin-sealed semiconductor device |
| 07/04/2000 | US6084299 Integrated circuit package including a heat sink and an adhesive |
| 07/04/2000 | US6084298 Manufacturing of semiconductor device |
| 07/04/2000 | US6084297 Cavity ball grid array apparatus |
| 07/04/2000 | US6084295 Semiconductor device and circuit board used therein |
| 07/04/2000 | US6084294 Semiconductor device comprising stacked semiconductor elements |
| 07/04/2000 | US6084293 Stacked semiconductor device |
| 07/04/2000 | US6084292 Lead frame and semiconductor device using the lead frame |
| 07/04/2000 | US6084291 Tape carrier for TAB, integrated circuit device, a method of making the same, and an electronic device |
| 07/04/2000 | US6084289 Semiconductor processing method of forming a contact opening to a region adjacent a field isolation mass, and a semiconductor structure |