| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/18/2000 | US6091097 Semiconductor device and a method of manufacturing the same |
| 07/18/2000 | US6091089 Semiconductor integrated circuit device |
| 07/18/2000 | US6091081 Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film |
| 07/18/2000 | US6091080 Evaluation method for wirings of semiconductor device |
| 07/18/2000 | US6091027 Via structure |
| 07/18/2000 | US6091022 High pressure header for a semiconductor pressure transducer |
| 07/18/2000 | US6090719 Dry etching method for multilayer film |
| 07/18/2000 | US6090710 Heating, diffusion, alloying; electromigration reduction; corrosion resistance |
| 07/18/2000 | US6090707 Method of forming a conductive silicide layer on a silicon comprising substrate and method of forming a conductive silicide contact |
| 07/18/2000 | US6090703 Method of forming an integrated circuit having conductors of enhanced cross-sectional area with etch stop barrier layer |
| 07/18/2000 | US6090702 Embedded electroconductive layer and method for formation thereof |
| 07/18/2000 | US6090700 Metallization method for forming interconnects in an integrated circuit |
| 07/18/2000 | US6090699 Method of making a semiconductor device |
| 07/18/2000 | US6090696 Dry or wet etching to roughen the surface |
| 07/18/2000 | US6090687 System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein |
| 07/18/2000 | US6090672 Ultra short channel damascene MOS transistors |
| 07/18/2000 | US6090647 Capacitor for a semiconductor device |
| 07/18/2000 | US6090644 Underfill coating for LOC package |
| 07/18/2000 | US6090643 Semiconductor chip-substrate attachment structure |
| 07/18/2000 | US6090641 Electro-thermal nested die-attach design |
| 07/18/2000 | US6090633 Multiple-plane pair thin-film structure and process of manufacture |
| 07/18/2000 | US6090484 Thermally conductive filled polymer composites for mounting electronic devices and method of application |
| 07/18/2000 | US6090468 Insulation adhesive layer which is a semi-cured product of an epoxy group-containing acrylic rubber |
| 07/18/2000 | US6090436 Mixture containing binder and solvent |
| 07/18/2000 | US6090263 Process for coating an article with a conformable nickel coating |
| 07/18/2000 | US6090261 Method and apparatus for controlling plating over a face of a substrate |
| 07/18/2000 | US6089315 Composite heat sink |
| 07/18/2000 | US6089314 Cooling body for cooling power gates |
| 07/18/2000 | US6088917 Method for making heat sink device and a heat sink made thereby |
| 07/18/2000 | US6088915 C4-GT stand off rigid flex interposer method |
| 07/18/2000 | US6088901 Method for producing a carrier element for semiconductor chips |
| 07/13/2000 | WO2000041451A1 Removable remote control amplifier |
| 07/13/2000 | WO2000041446A1 Circuit board features with reduced parasitic capacitance and method therefor |
| 07/13/2000 | WO2000041281A1 Method and apparatus for hermetically sealing photonic devices |
| 07/13/2000 | WO2000041242A1 Semiconductor unit |
| 07/13/2000 | WO2000041241A1 Vertically integrated semiconductor system |
| 07/13/2000 | WO2000041240A1 Vertically integrated circuit system |
| 07/13/2000 | WO2000041239A1 Chip package including peltier cooling |
| 07/13/2000 | WO2000041235A1 Method of depositing a copper seed layer which promotes improved feature surface coverage |
| 07/13/2000 | WO2000041234A1 Method and device for encapsulating an electronic component, notably a semiconductor chip |
| 07/13/2000 | WO2000041219A1 Method and device for processing components, notably semiconductor chips, arranged on a substrate |
| 07/13/2000 | WO2000040983A1 Method for controlling ic handler and control system using the same |
| 07/13/2000 | WO2000040637A1 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| 07/13/2000 | WO2000020483A3 Impact-resistant epoxide resin compositions |
| 07/13/2000 | WO1999021707A8 A laminate comprising a thin borosilicate glass substrate as a constituting layer |
| 07/13/2000 | DE19917875A1 Befestigung von Gehäusen elektronischer Bauteile an Kühlkörpern Mounting of electronic component housings to heat sinks |
| 07/13/2000 | DE19900603A1 Elektronisches Halbleitermodul Electronic semiconductor module |
| 07/12/2000 | EP1018765A2 Crack stop between neighbouring fuses for protection from fuse blow damage |
| 07/12/2000 | EP1018764A1 Member for lead |
| 07/12/2000 | EP1018763A2 An improved heatsink assembly |
| 07/12/2000 | EP1018762A2 Semiconductor device and fabrication method thereof |
| 07/12/2000 | EP1018761A1 Semiconductor device and method of fabricating the same |
| 07/12/2000 | EP1018760A1 Method and apparatus for encapsulating an electronic device, especially a semiconductor chip |
| 07/12/2000 | EP1018527A2 Nano-porous copolymer films having low dielectric constants |
| 07/12/2000 | EP1018291A1 Flexible circuits and carriers and process for manufacture |
| 07/12/2000 | EP1018290A1 A system and method for packaging integrated circuits |
| 07/12/2000 | EP1018165A1 Integrated circuit package employing a transparent encapsulant and a method of making the package |
| 07/12/2000 | EP1018160A1 Hydrogenated oxidized silicon carbon material |
| 07/12/2000 | EP1018159A1 Cooling module for electronic components |
| 07/12/2000 | EP1018158A1 Moisture proofing for borate glass semiconductor passivation layers |
| 07/12/2000 | EP1018157A1 Improved solder ball joint |
| 07/12/2000 | EP1018152A1 Borderless vias with cvd barrier layer |
| 07/12/2000 | EP1018092A1 Method for making an electronic module or label, resulting electronic module or label and medium containing such a module or label |
| 07/12/2000 | EP0907963A4 Solder bump apparatus, electronic component and method for forming a solder bump |
| 07/12/2000 | CN1259844A Mounting of electronic components packages onto heat radiator |
| 07/12/2000 | CN1259800A Sound coding device and decoding device, optical recording medium and sound transmission method |
| 07/12/2000 | CN1259768A Interconnector made of conductive elastomer |
| 07/12/2000 | CN1259767A Wafer stage package and mfg. method therefor, and method for mfg. semiconductor device made up of same |
| 07/12/2000 | CN1259766A Device for controlling clearance of heat radiation surface |
| 07/12/2000 | CN1259764A Method for directly fixing heat radiator onto chip carrier by using flexible epoxy resin |
| 07/12/2000 | CN1259762A Plasma treatment for improving adhesiveness between inorgnic material and copper |
| 07/11/2000 | USRE36773 Method for plating using nested plating buses and semiconductor device having the same |
| 07/11/2000 | US6088233 Semiconductor device and assembly board having through-holes filled with filling core |
| 07/11/2000 | US6088226 Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink |
| 07/11/2000 | US6087912 High frequency multi-layer module comprising a dielectric resonator |
| 07/11/2000 | US6087845 Universal wafer carrier for wafer level die burn-in |
| 07/11/2000 | US6087763 Electronic component involving 3-terminal type piezo-electric device |
| 07/11/2000 | US6087733 Sacrificial erosion control features for chemical-mechanical polishing process |
| 07/11/2000 | US6087732 Bond pad for a flip-chip package |
| 07/11/2000 | US6087729 Low dielectric constant composite film for integrated circuits of an inorganic aerogel and an organic filler grafted to the inorganic material |
| 07/11/2000 | US6087728 Interconnect design with controlled inductance |
| 07/11/2000 | US6087727 Misfet semiconductor device having different vertical levels |
| 07/11/2000 | US6087726 Metal interconnect stack for integrated circuit structure |
| 07/11/2000 | US6087722 Multi-chip package |
| 07/11/2000 | US6087721 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
| 07/11/2000 | US6087720 Integrated circuit package electrical enhancement |
| 07/11/2000 | US6087719 Chip for multi-chip semiconductor device and method of manufacturing the same |
| 07/11/2000 | US6087718 Stacking type semiconductor chip package |
| 07/11/2000 | US6087717 Semiconductor device and manufacturing method |
| 07/11/2000 | US6087716 Semiconductor device package having a connection substrate with turned back leads and method thereof |
| 07/11/2000 | US6087715 Semiconductor device, and manufacturing method of the same |
| 07/11/2000 | US6087714 Semiconductor devices having tin-based solder film containing no lead and process for producing the devices |
| 07/11/2000 | US6087713 Plastic package, semiconductor device, and method of manufacturing plastic package |
| 07/11/2000 | US6087712 Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads |
| 07/11/2000 | US6087711 Integrated circuit metallization with superconductor BEOL wiring |
| 07/11/2000 | US6087710 Semiconductor device having self-aligned contacts |
| 07/11/2000 | US6087707 Structure for an antifuse cell |
| 07/11/2000 | US6087693 Semiconductor device with reduced stepped portions |
| 07/11/2000 | US6087682 High power semiconductor module device |
| 07/11/2000 | US6087677 High density self-aligned antifuse |