Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2000
07/25/2000US6093633 Method of making a semiconductor device
07/25/2000US6093630 Semi-conductor personalization structure and method
07/25/2000US6093615 Forming an effective titanium nitride barrier layer between the upper surface of a polysilicon plug and a platinum lower capacitor plate in a dynamic random access memory using low-pressure chemical vapor deposition and reactive sputtering
07/25/2000US6093584 Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
07/25/2000US6093583 Semiconductor component and method of manufacture
07/25/2000US6093576 Semiconductor sensor and manufacturing method thereof
07/25/2000US6093476 Wiring substrate having vias
07/25/2000US6093302 Electrochemical solid phase synthesis
07/25/2000US6093029 Vertically stackable integrated circuit
07/25/2000US6092713 Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof
07/25/2000US6092281 Electromagnetic interference shield driver and method
07/25/2000US6092280 Flexible interface structures for electronic devices
07/20/2000WO2000042664A1 Compression bonded semiconductor device
07/20/2000WO2000042663A1 Compression bonded semiconductor device
07/20/2000WO2000042659A2 System and method for esd protection
07/20/2000WO2000042657A1 Electronic component and use of a protective structure contained therein
07/20/2000WO2000042656A1 Power semiconductor module with cover
07/20/2000WO2000042655A1 Method of manufacturing a semiconductor device
07/20/2000WO2000042654A1 Electronic semiconductor module
07/20/2000WO2000042653A1 Method for protecting an integrated circuit chip
07/20/2000WO2000042652A1 Semiconductor device and its production method
07/20/2000WO2000042651A1 Semiconductor device
07/20/2000WO2000042649A1 Test device of semiconductor integrated circuit
07/20/2000WO2000042648A1 Attaching a semiconductor to a substrate
07/20/2000WO2000042640A1 Pattern matching method and device, position determining method and device, position aligning method and device, exposing method and device, and device and its production method
07/20/2000WO2000042636A2 Micromachined device and method of forming the micromachined device
07/20/2000WO2000042231A2 Polycrystalline silicon germanium films for forming micro-electromechanical systems
07/20/2000WO2000042100A1 Crosslinkable elastomer composition and formed article prepared from said composition
07/20/2000WO2000041841A1 Conductive leads with non-wettable surfaces
07/20/2000WO2000022666A3 METHOD AND DEVICE FOR INTERCONNECT RADIO FREQUENCY POWER SiC FIELD EFFECT TRANSISTORS
07/20/2000WO2000014788A3 An electronic arrangement comprising a component carrier, a carrier for an electronic component, and a method of producing an electronic arrangement
07/20/2000WO2000004582A9 Temperature control of electronic devices using power following feedback
07/20/2000WO2000003573A9 Integrated circuit module having springy contacts of at least two different types for reduced stress, and subassembly for such module
07/20/2000DE19900970A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
07/20/2000DE19900803A1 Integrated circuit
07/19/2000EP1020919A2 Stacked capacitor DRAM cell
07/19/2000EP1020916A2 Method for making an integrated circuit including alignment marks
07/19/2000EP1020915A2 Semiconductor device
07/19/2000EP1020914A2 Ceramic substrate used for fabricating electric or electronic circuit
07/19/2000EP1020913A2 Lead frame, resin-encapsulated semiconductor device and fabrication process therefor
07/19/2000EP1020912A1 Semi-rigid heat transfer devices
07/19/2000EP1020911A2 Cooling apparatus for electronic device
07/19/2000EP1020910A2 Heat sink attachment
07/19/2000EP1020909A2 Thick-film hybrid circuit on a metal circuit board and method therefor
07/19/2000EP1020908A1 Resin-sealed surface mounting type electronic parts
07/19/2000EP1020907A1 Periphery barrier structure for integrated circuits
07/19/2000EP1020903A1 A semiconductor device using a lead frame and its manufacturing method
07/19/2000EP1020642A1 Bearing for refrigerating machine compressor and compressor
07/19/2000EP1020104A1 Method for mounting semiconductor element to circuit board, and semiconductor device
07/19/2000EP1020036A4 Slotline-mounted flip chip
07/19/2000EP1020036A1 Slotline-mounted flip chip
07/19/2000EP1019962A1 Method for coating a silicon chip and electronic card comprising at least one chip coated by such method
07/19/2000EP1019961A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules
07/19/2000EP1019960A1 Ball grid array semiconductor package and method for making the same
07/19/2000EP1019959A1 Interconnect structure with a low permittivity dielectric layer
07/19/2000EP1019925A1 Microelectronic component carrier and method of its manufacture
07/19/2000EP1019762A1 Optical device having optical component isolated from housing
07/19/2000CN2388642Y Firm joint device
07/19/2000CN1260909A Sequentially built integrated circuit package
07/19/2000CN1260908A Nanoporous dielectric films with graded density and for making such films
07/19/2000CN1260810A Synthesis of siloxane resins
07/19/2000CN1260597A Insulator-base silicon thick-oxide structure and mfg. method thereof
07/19/2000CN1260591A Semiconductor package and mfg. method thereof
07/19/2000CN1260590A Semiconductor device, semiconductor crystal wafer, semiconductor assembly and mfg. method for semiconductor device
07/19/2000CN1260589A Semiconductor device and manufacturing method thereof, and reinforcing belt for manufacturing said semiconductor device
07/19/2000CN1260588A Method for producing semiconductor device
07/19/2000CN1260362A Epoxy resin and resin sealed semiconductor device
07/18/2000US6091606 Semiconductor device including combed bond pad opening, assemblies and methods
07/18/2000US6091603 Customizable lid for improved thermal performance of modules using flip chips
07/18/2000US6091592 Protective circuit and electric circuit using the protective circuit
07/18/2000US6091318 Integral bump technology sense resistor
07/18/2000US6091310 Multi-layer printed board with an inductor providing a high impedance at high frequency
07/18/2000US6091254 Universal wafer carrier for wafer level die burn-in
07/18/2000US6091251 Discrete die burn-in for nonpackaged die
07/18/2000US6091250 Discrete die burn-in for nonpackaged die
07/18/2000US6091199 Heat spreader for electronic ballast
07/18/2000US6091157 Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets
07/18/2000US6091156 Semiconductor pellet having plural chips
07/18/2000US6091155 BGA land pattern
07/18/2000US6091152 Semiconductor device and method for fabricating the same
07/18/2000US6091151 Wiring layer and method of forming the wiring layer
07/18/2000US6091150 Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms
07/18/2000US6091148 Electrical connection for a semiconductor structure
07/18/2000US6091147 Connector type semiconductor package
07/18/2000US6091146 Ceramic lid for large multi-chip modules
07/18/2000US6091145 Thin multichip module including a connector frame socket
07/18/2000US6091144 Semiconductor package
07/18/2000US6091143 Stacked leads-over chip multi-chip module
07/18/2000US6091142 Assembly for dissipating heat from a stacked semiconductor package
07/18/2000US6091141 Bump chip scale semiconductor package
07/18/2000US6091140 Thin chip-size integrated circuit package
07/18/2000US6091139 Semiconductor device
07/18/2000US6091137 Semiconductor device substrate and method of manufacturing the same
07/18/2000US6091136 Plastic lead frames for semiconductor devices
07/18/2000US6091135 Lead frame with pre-mold paddle for a semiconductor chip package
07/18/2000US6091134 Semiconductor lead frame and method for manufacturing the same
07/18/2000US6091133 Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers
07/18/2000US6091131 Integrated circuit having crack stop for interlevel dielectric layers
07/18/2000US6091121 Semiconductor device and method for manufacturing the same
07/18/2000US6091113 Semiconductor device with evaluation MISFET
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