| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/01/2000 | US6097073 Triangular semiconductor or gate |
| 08/01/2000 | US6097052 Semiconductor device and a method of manufacturing thereof |
| 08/01/2000 | US6097045 Semiconductor device having discharging portion |
| 08/01/2000 | US6097043 Semiconductor integrated circuit and supply method for supplying multiple supply voltages in a semiconductor integrated circuit |
| 08/01/2000 | US6096981 Packaging electrical circuits |
| 08/01/2000 | US6096808 Snap cure adhesive based on anhydride/epoxy resins |
| 08/01/2000 | US6096665 Coating a sheet with a thermosetting resin surrounding the fibers, and filling some, but not all, of said interstices; coating again with a thermosetting resin surrounding the fiber and filling all the interstices; curing; integrated circuits |
| 08/01/2000 | US6096654 Gapfill of semiconductor structure using doped silicate glasses |
| 08/01/2000 | US6096649 Creating dummy aluminum based structures to increase the roughens of the surface topography, improving adhesion between an overlying molding substance |
| 08/01/2000 | US6096641 Method of manufacturing semiconductor device |
| 08/01/2000 | US6096637 Forming a multilayer interconnection intermetallics which are connected through plugs formed in a connecting hole |
| 08/01/2000 | US6096636 Methods of forming conductive lines |
| 08/01/2000 | US6096634 Method of patterning a submicron semiconductor layer |
| 08/01/2000 | US6096633 Dual damascene process for forming local interconnect |
| 08/01/2000 | US6096580 Low programming voltage anti-fuse |
| 08/01/2000 | US6096579 Method for controlling the thickness of a passivation layer on a semiconductor device |
| 08/01/2000 | US6096577 Method of making semiconductor device, and film carrier tape |
| 08/01/2000 | US6096574 Injecting a flowable liquid material between the spacings around the semiconductor chips and substrate, curing to form a compliant dielectric layer |
| 08/01/2000 | US6096572 Forming an electrically conductive protection layer on metal layer to prevent oxidation of metal layer |
| 08/01/2000 | US6096571 Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors |
| 08/01/2000 | US6096566 Inter-conductive layer fuse for integrated circuits |
| 08/01/2000 | US6096565 Forming an interconnected layer by encasing within a noble metal gold or silver filled with the high temperature superconductor material; through-holes to enable direct connection of circuitry to the encased superconductor layer |
| 08/01/2000 | US6096438 Aluminum alloy film has not only a low resistivity and high hillock resistance but also a high dielectric strength when it is anodized into an anodic oxide film |
| 08/01/2000 | US6096433 Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof |
| 08/01/2000 | US6096404 Full face mask for capacitance-voltage measurements |
| 08/01/2000 | US6096259 Preparing a template with v-grooves, placing wires in grooves, adding molding compound, curing and removal of template |
| 08/01/2000 | US6096165 Method and apparatus for application of adhesive tape to semiconductor devices |
| 08/01/2000 | US6096163 Method and apparatus for application of spray adhesive to a leadframe for chip bonding |
| 08/01/2000 | US6096111 Pressing agglutinating particle mixture to form compact; melting; powder metallurgy |
| 08/01/2000 | US6095822 Component module holder |
| 08/01/2000 | US6095397 Solder deposit support |
| 08/01/2000 | US6094919 Package with integrated thermoelectric module for cooling of integrated circuits |
| 07/27/2000 | WO2000044212A1 Carbon/carbon cooling system |
| 07/27/2000 | WO2000044204A1 Electronic ballast with a piezoelectric cooling fan |
| 07/27/2000 | WO2000044071A1 Electric module for connection to external electric circuits and method of producing the same |
| 07/27/2000 | WO2000044047A1 Microelectronic structure |
| 07/27/2000 | WO2000044044A1 Method for reducing the capacitance between interconnects by forming voids in dielectric material |
| 07/27/2000 | WO2000044042A1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits |
| 07/27/2000 | WO2000044041A1 Semiconductor integrated circuit and manufacture thereof |
| 07/27/2000 | WO2000044040A1 Method of wire bonding, semiconductor device, circuit board, electronic device and wire bonder |
| 07/27/2000 | WO2000016400A8 Applications of protective ceramics |
| 07/27/2000 | DE19902979A1 Influencing thermal conductivity of solid body in preferred direction involves exposing body to ultrasonic sound field directed in preferred direction; thermal conductivity is increased |
| 07/27/2000 | DE19901384A1 Elektronisches Bauelement und Verwendung einer darin enthaltenen Schutzstruktur Electronic device and use a protective structure contained therein |
| 07/27/2000 | DE10002426A1 Band carrier for ball grid array (BGA) used with semiconductor flip-chip with pads in linear arrangement |
| 07/27/2000 | DE10002348A1 Thermally conducting resistance element in connection frame of semiconductor housing has near arm, paddle and far arm that are electrically connected with paddle arranged between arms |
| 07/27/2000 | CA2359473A1 Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits |
| 07/26/2000 | EP1022781A1 Optical device, electronic device enclosure, and getter assembly |
| 07/26/2000 | EP1022778A1 Method of dividing a wafer and method of manufacturing a semiconductor device |
| 07/26/2000 | EP1022777A1 Air gap formation between metal leads for high speed IC processing |
| 07/26/2000 | EP1022776A2 Wire bonding to copper |
| 07/26/2000 | EP1022775A1 Semiconductor device, mounting structure thereof and method of fabrication thereof |
| 07/26/2000 | EP1022773A2 Chip carrier substrate |
| 07/26/2000 | EP1022352A2 Method for forming metal interconnects with increased electromigration lifetime |
| 07/26/2000 | EP1021937A2 Method of manufacturing surface-mountable sil hybrid circuit |
| 07/26/2000 | EP1021837A1 Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device |
| 07/26/2000 | EP1021833A1 Device with security integrated circuit and method for making same |
| 07/26/2000 | EP1021832A1 Semiconductor component and method for the production thereof |
| 07/26/2000 | EP1021831A1 Improved leadframe structure with preplated leads and process for manufacturing the same |
| 07/26/2000 | EP1021830A1 Chip scale ball grid array for integrated circuit package |
| 07/26/2000 | EP1021827A1 Dual damascene metallization |
| 07/26/2000 | EP1021688A1 Multiple electrostatic gas phase heat pump and method |
| 07/26/2000 | EP0922379A4 Apparatus for cooling an electronic component |
| 07/26/2000 | EP0770305B1 Image display apparatus with line number conversion |
| 07/26/2000 | EP0698289B1 Contact structure for vertical chip connections |
| 07/26/2000 | CN1261410A Method and device for producing electrically conductive contiuity in semiconductor components. |
| 07/26/2000 | CN1261384A Organohydridosiloxane resins with high organic content |
| 07/26/2000 | CN1261206A Ball-array package method for integrated circuits |
| 07/26/2000 | CN1054944C Thermally activated noise immune fuse |
| 07/25/2000 | US6094356 Semiconductor device and semiconductor device module |
| 07/25/2000 | US6094354 Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board |
| 07/25/2000 | US6094114 Slotline-to-slotline mounted flip chip |
| 07/25/2000 | US6094058 Temporary semiconductor package having dense array external contacts |
| 07/25/2000 | US6094056 Multi-chip module with accessible test pads and test fixture |
| 07/25/2000 | US6093972 Microelectronic package including a polymer encapsulated die |
| 07/25/2000 | US6093971 Chip module with conductor paths on the chip bonding side of a chip carrier |
| 07/25/2000 | US6093970 Semiconductor device and method for manufacturing the same |
| 07/25/2000 | US6093969 Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (SOBC) modules |
| 07/25/2000 | US6093968 Germanium alloy contact to a silicon substrate |
| 07/25/2000 | US6093966 Ionizing by biasing refractory metal atoms and silicon atoms to form a copper barrier layer on the insulating layer and in the opening; depositing a copper-containing metal; uniform thickness, avoiding silicon enrichment on trenches' bottoms |
| 07/25/2000 | US6093964 Connection structure utilizing a metal bump and metal bump manufacturing method |
| 07/25/2000 | US6093963 Dual landing pad structure including dielectric pocket |
| 07/25/2000 | US6093961 Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment |
| 07/25/2000 | US6093960 Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance |
| 07/25/2000 | US6093959 Lead frame having supporters and semiconductor package using same |
| 07/25/2000 | US6093958 Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same |
| 07/25/2000 | US6093957 Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
| 07/25/2000 | US6093954 Semiconductor device having variable delay circuit having multi-layered semiconductor structure |
| 07/25/2000 | US6093942 Semiconductor device with improved pad layout |
| 07/25/2000 | US6093938 Stacked die integrated circuit device |
| 07/25/2000 | US6093933 Method and apparatus for fabricating electronic device |
| 07/25/2000 | US6093894 Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer |
| 07/25/2000 | US6093889 Semiconductor package and mounting socket thereof |
| 07/25/2000 | US6093658 Preventing exposed tungsten plugs from eroding during standard semiconductor fabrication by exposing to electron dose to neutralize positve charge |
| 07/25/2000 | US6093643 Electrically conductive projections and semiconductor processing method of forming same |
| 07/25/2000 | US6093642 Tungsten-nitride for contact barrier application |
| 07/25/2000 | US6093641 Method for fabricating semiconductor device with an increased process tolerance |
| 07/25/2000 | US6093640 Overlay measurement improvement between damascene metal interconnections |
| 07/25/2000 | US6093637 Forming an insulating film on a semiconductor substrate by (1) dual-frequency plasma enhanced chemical vapor deposition using a higher and lower frequency and a reactive tetraalkyl silane, (2) ozone/tetraalkoxysilane, (3) a third sio2 layer |
| 07/25/2000 | US6093636 Forming on a substrate a dielectric layer comprising decomposable polymer and thermosetting resin; heating to cure the thermosetting resin; decomposing the decomposable polymer; litographic patterning; depositing a metallic film |
| 07/25/2000 | US6093635 High-density multimetal layer semiconductor device with features of <0.25 microns; voidless interconnection pattern by filling the gaps with hydrogenpolysilsesquioxane and heat treating in an inert gas to remove water |