Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/31/2013US20130285222 Semiconductor package and method of manufacturing the same
10/31/2013US20130285221 Semiconductor device and method of manufacturing same
10/31/2013US20130285220 Vertically packaged integrated circuit
10/31/2013US20130285219 Integrated circuit power grid with improved routing resources and bypass capacitance
10/31/2013US20130285218 Integrated electronic components and methods of formation thereof
10/31/2013US20130285215 Stacked wafer structure and method for stacking a wafer
10/31/2013US20130285125 Through-Substrate Vias and Methods for Forming the Same
10/31/2013US20130285113 Bidirectional electrostatic discharge (esd) protection device
10/31/2013US20130285057 Semiconductor device
10/31/2013US20130285056 Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structure
10/31/2013US20130284992 Opening assembly for intergrated circuit socket
10/31/2013DE112008000446B4 Halbleitermodule und Wechselrichtervorrichtung Semiconductor modules and inverter device
10/31/2013DE112006000645B4 Systeme für eine verbesserte passive Flüssigkeitskühlung Systems for improved passive liquid cooling
10/31/2013DE10248927C5 Dünnschichtsolarzelle mit elektrischer Molybdän-Kontaktschicht und Herstellungsverfahren Thin film solar cell with electric molybdenum-contact layer and manufacturing method
10/31/2013DE102013207804A1 Leistungsmodul mit direkt verbundenen, wärmeleitenden strukturen Power module directly associated with thermally conductive structures
10/31/2013DE102013207542A1 Gatedielektrikumsschutz Gatedielektrikumsschutz
10/31/2013DE102013201056A1 Halbleitervorrichtung Semiconductor device
10/31/2013DE102013104282A1 Kühlung der Leistungselektronik Cooling the power electronics
10/31/2013DE102013103976A1 Halbleiterbauelement mit selbstausgerichteten Verbindungen und Sperrabschnitten A semiconductor device with self-aligned connections, and locking portions
10/31/2013DE102013102908A1 Verfahren zum Herstellen einer Halbleiter-Vorrichtung A method of manufacturing a semiconductor device
10/31/2013DE102012207172A1 Vorrichtung und verfahren zur oberflächenbehandlung eines substrats und verfahren zum herstellen eines optoelektronischen bauelements An apparatus and method for surface treatment of a substrate and methods for producing an optoelectronic component
10/31/2013DE102012202785B4 Halbleitervorrichtung mit Halbleitermodul, Kühleinheit und Federbauteil A semiconductor device comprising semiconductor module cooling unit and spring member
10/31/2013DE102012107899A1 Wafer assembly for use during manufacturing integrated switching circuits, has integrated circuits formed on process and carrier wafers bonded to process wafer, and adhesive layer bonding wafers, where carrier wafer includes alignment mark
10/31/2013DE102012103633A1 Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung Radiation-emitting device and method of manufacturing such a device
10/31/2013DE102007032636B4 Verfahren zur Herstellung einer dielektrischen Schicht für ein elektronisches Bauelement A process for producing a dielectric layer for an electronic component
10/31/2013DE102007012335B4 Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils Sensor component and method of producing a sensor component
10/31/2013DE10062399B4 Hochtemperaturtaugliches Multilayer-Kontaktsystem High-temperature-suitable multi-layer contact system
10/30/2013EP2657966A1 Insulating structure for power module and power conversion device using power module
10/30/2013EP2657965A1 Heat disperser with heat transmission, heat convection and heat radiation function
10/30/2013EP2657964A2 Electronic component and electronic apparatus
10/30/2013EP2657962A1 Electronic device with a metallisation layer having a high- and a low-melting-point component diffusion-bonded together and a synthetic resin layer covering the metallisation layer
10/30/2013EP2657297A1 Curable epoxy resin composition and photosemiconductor device using same
10/30/2013EP2656701A1 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
10/30/2013EP2656384A1 Method for producing an electrical terminal support
10/30/2013EP2656056A1 Single-position hall effect measurements
10/30/2013EP2655962A1 Cooling system and method for electronic components
10/30/2013EP2655955A1 Porous heat sink led lamps
10/30/2013CN203260577U 半导体装置 Semiconductor device
10/30/2013CN203260576U Igbt module
10/30/2013CN203260575U Bidirectional symmetrical overvoltage protection device
10/30/2013CN203260574U Electronic device
10/30/2013CN203260573U Frame-based carrier-free single-ring package
10/30/2013CN203260572U 导线架框条 Lead frame Moulding
10/30/2013CN203260571U Semiconductor package structure and leadframe strip without outer lead
10/30/2013CN203260570U Carrier-free novel package based on frame corrosion bump
10/30/2013CN203260569U Pin extended fan-in diffusion panel type BGA package
10/30/2013CN203260568U Large-power whole-wafer flat pressing/connecting-type packaging structure
10/30/2013CN203260567U Low-profile integrated circuit assembly, low-profile circuit assembly and low-profile assembly
10/30/2013CN203260566U Transistor fixing structure
10/30/2013CN203260565U Ceramic heat-dissipation structure of electronic component
10/30/2013CN203260564U Transistor heat dissipation device used for photovoltaic inverter
10/30/2013CN203260563U Power device packaging structure
10/30/2013CN203259264U Packaging structure of heat-sensitive temperature sensor
10/30/2013CN103380496A Interposers, electronic modules, and methods for forming the same
10/30/2013CN103380495A Pressure contact type semiconductor device and method for fabricating same
10/30/2013CN103380491A Manufacturing method for adhered material, manufacturing method for substrate having adhesive pattern, and substrate having adhesive pattern
10/30/2013CN103380487A Method for forming insulating film
10/30/2013CN103380368A Single-position hall effect measurements
10/30/2013CN103380189A Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component
10/30/2013CN103380188A Thermally conductive adhesive
10/30/2013CN103379806A In-line liquid cooled semiconductor module and assembly with the same
10/30/2013CN103379805A 电子设备 Electronic Equipment
10/30/2013CN103379737A 印刷电路板 A printed circuit board
10/30/2013CN103379733A Printed wiring board, semiconductor package, and printed circuit board
10/30/2013CN103378140A Insulated gate bipolar transistor
10/30/2013CN103378104A Semiconductor device and method of manufacturing the same
10/30/2013CN103378096A Semiconductor device and method for forming same
10/30/2013CN103378075A Semiconductor memory modules and methods of fabricating the same
10/30/2013CN103378074A Chip package
10/30/2013CN103378073A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
10/30/2013CN103378072A Semiconductor component with coreless transformer
10/30/2013CN103378071A Method and apparatus for ESD circuits
10/30/2013CN103378070A 半导体器件 Semiconductor devices
10/30/2013CN103378069A Method for stabilizing embedded silicon
10/30/2013CN103378068A Circuit module and method of manufacturing the same
10/30/2013CN103378067A Wafer assembly with carrier wafer
10/30/2013CN103378066A Interface for communication between voltage domains
10/30/2013CN103378065A Semiconductor device and method for fabricating the same
10/30/2013CN103378064A Metal interconnection structure and manufacturing method thereof
10/30/2013CN103378063A 半导体器件 Semiconductor devices
10/30/2013CN103378062A Software and method for via spacing in a semiconductor device
10/30/2013CN103378061A Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
10/30/2013CN103378060A Through silicon via and filling method thereof
10/30/2013CN103378059A Through silicon via and forming method thereof
10/30/2013CN103378058A Semiconductor chip and method for forming same
10/30/2013CN103378057A Semiconductor chip and method for forming same
10/30/2013CN103378056A Integrated circuit chip-level self-destructive method based on MEMS metal bridge transducer element structure and structure thereof
10/30/2013CN103378055A 半导体器件 Semiconductor devices
10/30/2013CN103378054A Semiconductor device with self-aligned interconnects
10/30/2013CN103378053A Semiconductor device with self-aligned interconnects and blocking portions
10/30/2013CN103378052A Semiconductor devices, methods of manufacture thereof, and methods of forming conductive features
10/30/2013CN103378051A Electronic device
10/30/2013CN103378050A Electronic assemblies and methods of fabricating electronic assemblies
10/30/2013CN103378049A Strain reduced structure for IC packaging
10/30/2013CN103378048A Semiconductor package, semiconductor module, and mounting structure thereof
10/30/2013CN103378047A Package carrier
10/30/2013CN103378046A Chip assembling structure and chip assembling method
10/30/2013CN103378045A Lead frame, semiconductor package, and manufacturing method of the same
10/30/2013CN103378044A Chip assembly structure and chip assembly method
10/30/2013CN103378043A Chip assembly structure and chip assembly method
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