Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2000
08/08/2000US6100594 Semiconductor device and method of manufacturing the same
08/08/2000US6100593 Multiple chip hybrid package using bump technology
08/08/2000US6100591 Semiconductor device and method of fabricating the same
08/08/2000US6100590 Low capacitance multilevel metal interconnect structure and method of manufacture
08/08/2000US6100589 Semiconductor device and a method for making the same that provide arrangement of a connecting region for an external connecting terminal
08/08/2000US6100588 Multiple level conductor wordline strapping scheme
08/08/2000US6100585 Structure for mounting device on circuit board
08/08/2000US6100583 Semiconductor device containing semiconductor element in package
08/08/2000US6100581 Semiconductor chip packaging having printed circuitry or printed circuit registration feature
08/08/2000US6100580 Semiconductor device having all outer leads extending from one side of a resin member
08/08/2000US6100579 Insulating film for use in semiconductor device
08/08/2000US6100578 Silicon-based functional matrix substrate and optical integrated oxide device
08/08/2000US6100574 Capacitors in integrated circuits
08/08/2000US6100573 Structure of a bonding pad for semiconductor devices
08/08/2000US6100554 High-frequency semiconductor device
08/08/2000US6100486 Method for sorting integrated circuit devices
08/08/2000US6100475 Solder bonding printed circuit boards
08/08/2000US6100202 First flowing a silicon source material absent a flow of a dopant source material; then depositing a doped silicate glass dielectric layer using chemical vapor deposition; anisotropically patterning a via with voidless sidewalls
08/08/2000US6100199 Embedded thermal conductors for semiconductor chips
08/08/2000US6100197 Method of fabricating a semiconductor device
08/08/2000US6100196 Method of making a copper interconnect with top barrier layer
08/08/2000US6100194 Silver metallization by damascene method
08/08/2000US6100184 Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer
08/08/2000US6100179 Electromigration resistant patterned metal layer gap filled with HSQ
08/08/2000US6100177 Grooved wiring structure in semiconductor device and method for forming the same
08/08/2000US6100176 Methods and structures for gold interconnections in integrated circuits
08/08/2000US6100157 Formation of alignment mark and structure covering the same
08/08/2000US6100133 Capacitors in integrated circuits
08/08/2000US6100118 Fabrication of metal fuse design for redundancy technology having a guard ring
08/08/2000US6100117 Method for manufacturing DRAM having a redundancy circuit region
08/08/2000US6100116 Method to form a protected metal fuse
08/08/2000US6100115 Semiconductor device
08/08/2000US6100113 Very thin multi-chip-package and method of mass producing the same
08/08/2000US6100112 Method of manufacturing a tape carrier with bump
08/08/2000US6100108 Method of fabricating electronic circuit device
08/08/2000US6099992 Generating main pattern and first dummy patterns separated with spacings, dividing the dummy patterns into plurality of spaced apart second dummy patterns and measuring to find third pattern having specific value, connecting with second
08/08/2000US6099959 Method of controlling the spread of an adhesive on a circuitized organic substrate
08/08/2000US6099701 AlCu electromigration (EM) resistance
08/08/2000US6099677 Method of making microwave, multifunction modules using fluoropolymer composite substrates
08/08/2000US6098938 Retention mechanism for cassette CPU module
08/08/2000US6098283 Method for filling vias in organic, multi-layer packages
08/08/2000US6098280 Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes
08/08/2000US6098279 Method for making heat sink device
08/08/2000US6098278 Method for forming conductive epoxy flip-chip on chip
08/08/2000CA2091438C Semiconductor chip assemblies, methods of making same and components for same
08/03/2000WO2000045462A1 Housing for an electronic apparatus in microwave technology
08/03/2000WO2000045435A1 Polyimides used as microelectronic coatings
08/03/2000WO2000045434A1 Integrated circuit device, electronic module for chip card using said device and method for making same
08/03/2000WO2000045420A2 Multiple chip module with integrated rf capabilities
08/03/2000WO2000045410A1 Method and apparatus for utilizing heat dissipated from an electrical device
08/03/2000WO2000045399A1 Multi-track integrated spiral inductor
08/03/2000WO2000044823A1 Thermally conductive composite material
08/03/2000DE19903245A1 Leistungshalbleitermodul The power semiconductor module
08/03/2000DE19901445A1 Semiconductor heat-sink arrangement
08/02/2000EP1024536A2 Semiconductor integrated circuit having an improved grounding structure
08/02/2000EP1024534A2 Device comprising thermally stable, low dielectric constant material
08/02/2000EP1024533A2 Thick-film paste with insoluble additive
08/02/2000EP1024532A2 Semiconductor device and method of producing the same
08/02/2000EP1024531A2 Semiconductor wafer and device having columnar electrodes
08/02/2000EP1024530A1 Semiconductor power module
08/02/2000EP1024529A2 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
08/02/2000EP1024526A1 An integrated circuit device having a planar interlevel dielectric layer
08/02/2000EP1023469A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
08/02/2000EP1023174A1 Manufacture of thin metal objects
08/02/2000CN1261724A Connector with prolonged electric migration life
08/01/2000US6097857 Microelectronic module having optical and electrical interconnects
08/01/2000US6097612 Radio frequency module and method for fabricating the radio frequency module
08/01/2000US6097611 Multi-chip land grid array carrier
08/01/2000US6097610 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
08/01/2000US6097603 Heat sink for direct attachment to surface mount electronic device packages
08/01/2000US6097602 Integrated circuit package heat sink attachment
08/01/2000US6097598 Thermal conductive member and electronic device using same
08/01/2000US6097597 Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus
08/01/2000US6097581 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
08/01/2000US6097453 Display apparatus and fabrication process thereof
08/01/2000US6097277 Resistor network with solder sphere connector
08/01/2000US6097209 Erroneous operation protection circuit formed between data buses and intergrated circuit employing the same
08/01/2000US6097195 Methods and apparatus for increasing metal density in an integrated circuit while also reducing parasitic capacitance
08/01/2000US6097102 Reticle, semiconductor wafer, and semiconductor chip
08/01/2000US6097101 Package for semiconductor device having frame-like molded portion and producing method of the same
08/01/2000US6097100 Reliability at high temperature; enhanced moisture resistance
08/01/2000US6097099 Electro-thermal nested die-attach design
08/01/2000US6097098 Die interconnections using intermediate connection elements secured to the die face
08/01/2000US6097097 Semiconductor device face-down bonded with pillars
08/01/2000US6097096 Metal attachment method and structure for attaching substrates at low temperatures
08/01/2000US6097095 Advanced fabrication method of integrated circuits with borderless vias and low dielectric-constant inter-metal dielectrics
08/01/2000US6097094 Semiconductor device having wiring layers and method of fabricating the same
08/01/2000US6097093 Structure of a dual damascene
08/01/2000US6097092 Freestanding multilayer IC wiring structure
08/01/2000US6097091 Semiconductor apparatus having an insulating layer of varying height therein
08/01/2000US6097090 High integrity vias
08/01/2000US6097089 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
08/01/2000US6097087 Semiconductor package including flex circuit, interconnects and dense array external contacts
08/01/2000US6097086 Semiconductor chip carrier including an interconnect component interface
08/01/2000US6097085 Electronic device and semiconductor package
08/01/2000US6097083 Semiconductor device which is crack resistant
08/01/2000US6097082 Semiconductor device
08/01/2000US6097081 Semiconductor device having adhesive between lead and chip
08/01/2000US6097080 Semiconductor device having magnetic shield layer circumscribing the device
08/01/2000US6097077 Programmable interconnect structures and programmable integrated circuits
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