Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2000
08/15/2000US6104081 Semiconductor device with semiconductor elements formed in a layer of semiconductor material glued on a support wafer
08/15/2000US6104080 Integrated circuit having capacitors for smoothing a supply voltage
08/15/2000US6104079 Closely pitched polysilicon fuses and method of forming the same
08/15/2000US6104070 Semiconductor device with reduced number of through holes and method of manufacturing the same
08/15/2000US6104062 Semiconductor device having reduced effective substrate resistivity and associated methods
08/15/2000US6103992 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
08/15/2000US6103639 Pretreatment of wafer surface bearing dielectric layer patterned with metal interconnects to strip any organic residue using ammonia and nitrous oxide plasma, then depositing silicon oxide buffer layer and silicon nitride
08/15/2000US6103636 Method and apparatus for selective removal of material from wafer alignment marks
08/15/2000US6103626 Method for forming dummy pattern areas in a semiconductor device
08/15/2000US6103624 Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish
08/15/2000US6103618 Method for forming an interconnection in a semiconductor element
08/15/2000US6103617 Fabricating method of multi-level wiring structure for semiconductor device
08/15/2000US6103615 Monitoring corrosion of vias and contact plugs in an active die region of patterned semiconductor wafer using corrosion sensitive plugs in dielectric layer in scribeline region
08/15/2000US6103613 Method for fabricating semiconductor components with high aspect ratio features
08/15/2000US6103612 Isolated interconnect studs and method for forming the same
08/15/2000US6103609 Method for fabricating semiconductor device
08/15/2000US6103601 Method and apparatus for improving film stability of halogen-doped silicon oxide films
08/15/2000US6103591 Semiconductor device with air gaps between interconnections and method of forming the same
08/15/2000US6103555 Method of improving the reliability of low-voltage programmable antifuse
08/15/2000US6103554 Method for packaging integrated circuits with elastomer chip carriers
08/15/2000US6103553 Method of manufacturing a known good die utilizing a substrate
08/15/2000US6103552 Wafer scale packaging scheme
08/15/2000US6103548 Semiconductor device and method of manufacture
08/15/2000US6103547 High speed IC package configuration
08/15/2000US6103457 Method for reducing faceting on a photoresist layer during an etch process
08/15/2000US6103405 Planar inductance element
08/15/2000US6103393 High purity; controlled crystallinity; small average particle size; narrow particle size distribution; spherical particle morphology; controlled surface chemistry, and surface are; useful in electrocatalyst applications
08/15/2000US6103392 Tungsten-copper composite powder comprising individual particles having a tungsten phase and a copper phase wherein the tungsten phase encapsulates the copper phase; useful for forming a copper-tungsten pseudoalloy
08/15/2000US6103359 Process and apparatus for manufacturing an anisotropic conductor sheet and a magnetic mold piece for the same
08/15/2000US6103354 Ceramic circuit substrate and method of fabricating the same
08/15/2000US6103146 Screen printable thick film with boride substrates
08/15/2000US6103134 Circuit board features with reduced parasitic capacitance and method therefor
08/15/2000US6103025 Fine wire of gold alloy, method for manufacture thereof and use thereof
08/15/2000US6102711 Socket for mounting package and mount structure of package using the same
08/15/2000US6102710 Controlled impedance interposer substrate and method of making
08/15/2000US6102110 Two-phase or mono-phase heat exchanger for electronic power component
08/15/2000US6102109 Cooling device boiling and condensing refrigerant
08/15/2000US6101868 Tool for inspecting broken wafer edges
08/15/2000US6101715 Microcooling device and method of making it
08/15/2000US6101710 Method for facilitating engineering changes in a multiple level circuit package
08/15/2000CA2236993C Hybrid circuit construction of push-pull power amplifier
08/10/2000WO2000047024A2 Multi-layer circuit board assembly for the packaging of semiconductor devices
08/10/2000WO2000046848A1 A method of forming a high voltage semiconductor device and a high voltage semiconductor device
08/10/2000WO2000046843A1 Microelectronic structure
08/10/2000WO2000046580A1 Packaged device
08/10/2000WO2000046317A1 Resin compositions
08/10/2000DE19963864A1 Copper interconnection structure for semiconductor memory, logic circuits, involves exposing interactive connection structure with copper layer to reduction plasma and forming silicon nitride film
08/10/2000DE19945820A1 Semiconductor device has an interlayer of titanium, molybdenum, tungsten or silicides or nitrides between and in contact with a connection layer and a connection pad electrode layer
08/10/2000DE19936610A1 Packaged semiconductor acceleration sensor, useful for an automobile airbag, anti-locking brake or navigation system, has a stress damping element around a sensor chip
08/10/2000DE19907168C1 Schichtanordnung sowie Verfahren zu deren Herstellung Layer arrangement, as well as processes for their preparation
08/10/2000DE19907127C1 Integrierte Halbleiterschaltungsanordnung mit stabilisierten Leiterbahnen Semiconductor integrated circuit device with stabilized conductor tracks
08/10/2000DE19903875A1 Umrichter in Druckkontaktierung Inverter in pressure contact
08/10/2000DE19903349A1 Low-resistance connection production arrangement in semiconductor component
08/10/2000DE19903196A1 Alignment mark recognition, in photolithographic production of multilayer metallizations on wafers, is improved by back etching metal present in the marks to expose mark edges after metal deposition and CMP steps
08/10/2000DE10003671A1 Semiconductor component, especially a surface mountable semiconductor package, has front and back face electrodes connected to metal parts by precious metal-containing bodies or layers
08/10/2000CA2326981A1 Packaged device
08/09/2000WO2000052755A1 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
08/09/2000EP1026931A2 Heat sink having standoff buttons and a method of manufacture therefor
08/09/2000EP1026929A2 Elemental piece of flexible printed wiring board and flexible printed wiring board
08/09/2000EP1026743A2 Pressure contact converter
08/09/2000EP1026742A2 Solder ball grid array for connecting multiple millimeter wave assemblies
08/09/2000EP1026741A1 Semiconductor device
08/09/2000EP1026732A1 A method of forming a high voltage semiconductor device
08/09/2000EP1026726A2 Semiconductor device having an insulating film with voides and method for manufacturing the same
08/09/2000EP1026280A2 An aluminum-containing member and a method for producing such an aluminum-containing member
08/09/2000EP1026217A1 Method of producing adhesive tape for electronic parts
08/09/2000EP1025748A1 A chip supporting element and use thereof
08/09/2000EP1025681A1 Magnetically coupled signal isolator using a faraday shielded mr or gmr receiving element
08/09/2000EP1025640A2 Integrated electronic circuit comprising an oscillator and passive circuit elements
08/09/2000EP1025588A1 Electromagnetic interference shield device and method
08/09/2000EP1025587A1 Semiconductor flip-chip package and method for the fabrication thereof
08/09/2000EP1025586A1 Flexible heat transfer device and method
08/09/2000EP1025585A1 Method and construction for thermally enhancing a microelectronic package
08/09/2000EP1025584A1 Integrated electronic circuit comprising at least an electronic power component
08/09/2000EP1024953A1 Use of glass laminate as a substrate in semiconductor devices
08/09/2000EP1024952A1 A laminate comprising a thin borosilicate glass substrate as a constituting layer
08/09/2000CN2391306Y Induction hood for radiator
08/09/2000CN2391305Y Microlite sheet radiator fastening
08/09/2000CN1262785A Semiconductor device, method for manufacturing same, circuit board and electronic apparatus
08/09/2000CN1262784A Semiconductor device and method for manufacturing same, circuit substrate, and electronic device
08/09/2000CN1262783A Soldering material for die bonding
08/09/2000CN1262524A Improved cavity type ball-shaped grid array circuit encapsulating method
08/08/2000USRE36813 Semiconductor memory device having an improved wiring and decoder arrangement to decrease wiring delay
08/08/2000US6101308 Composition for encapsulating signal transmission devices
08/08/2000US6101202 Semiconductor laser module
08/08/2000US6101101 Universal leadframe for semiconductor devices
08/08/2000US6101100 Multi-electronic device package
08/08/2000US6101098 Structure and method for mounting an electric part
08/08/2000US6101096 Heat sink clip for an electronic assembly
08/08/2000US6101093 Wrap around clip for an electronic cartridge
08/08/2000US6101091 Clip for clamping heat sink and semiconductor
08/08/2000US6101078 Semiconductor device with protection circuit
08/08/2000US6100954 Liquid crystal display with planarizing organic gate insulator and organic planarization layer and method for manufacturing
08/08/2000US6100787 Multilayer ceramic package with low-variance embedded resistors
08/08/2000US6100775 Vertical interconnect circuit for coplanar waveguides
08/08/2000US6100746 Electrically programmable fuse
08/08/2000US6100745 Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices
08/08/2000US6100710 Semiconductor device having two ground pads connected to a ground connection lead and method for testing the same
08/08/2000US6100598 Sealed semiconductor device with positional deviation between upper and lower molds
08/08/2000US6100597 Semiconductor device and method for manufacturing the same
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