Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2000
08/22/2000US6107687 Semiconductor device having interconnection and adhesion layers
08/22/2000US6107685 Semiconductor part and fabrication method thereof, and structure and method for mounting semiconductor part
08/22/2000US6107684 Semiconductor device having a signal pin with multiple connections
08/22/2000US6107683 Sequentially built integrated circuit package
08/22/2000US6107682 Compliant wirebond packages having wire loop
08/22/2000US6107681 Pin-assignment method for integrated circuit packages to increase the electro-static discharge protective capability thereof
08/22/2000US6107679 Semiconductor device
08/22/2000US6107678 Lead frame and semiconductor package having a lead frame
08/22/2000US6107677 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
08/22/2000US6107676 Leadframe and a method of manufacturing a semiconductor device by use of it
08/22/2000US6107675 Lead frame
08/22/2000US6107670 Contact structure of semiconductor device
08/22/2000US6107669 Load actuating semiconductor circuit having a thermally resistive member
08/22/2000US6107668 Thin film transistor substrate having low resistive and chemical resistant electrode interconnections and method of forming the same
08/22/2000US6107638 Silicon nitride circuit substrate and semiconductor device containing same
08/22/2000US6107208 Nitride etch using N2 /Ar/CHF3 chemistry
08/22/2000US6107200 Forming a second tungsten film on a first tungsten film which is formed by using a reduction gas not containing diborane, by using a gas containing the diborane, or forming the second tungsten film on the first tungsten film
08/22/2000US6107196 Integrated circuit, and method for forming an integrated circuit
08/22/2000US6107190 Forming an interlayer insulating film on a semiconductor substrate, forming a first titanium nitride film on the interlayer insulating film by sputtering, forming a hole throughout the interlayer insulating film
08/22/2000US6107188 Providing semiconductor substrate having layer of first dielectric formed thereon, forming layer of second dielectric on first dielectric, forming copper conductors imbedded in second dielectric, forming passivation layer, etch stop
08/22/2000US6107184 Nano-porous copolymer films having low dielectric constants
08/22/2000US6107179 Integrated flexible interconnection
08/22/2000US6107170 Platinum is deposited over a contact area on silicon lying underneath of silicon oxide and silicon nitride, then the platinum is sintered to form platinum silicide, subseqeuntly titanium-tungusten alloy is deposited, then gold is deposited
08/22/2000US6107168 Process for passivating a silicon carbide surface against oxygen
08/22/2000US6107165 Metal-to-metal antifuse having improved barrier layer
08/22/2000US6107164 Using grooves as alignment marks when dicing an encapsulated semiconductor wafer
08/22/2000US6107160 MOSFET having buried shield plate for reduced gate/drain capacitance
08/22/2000US6107138 Method for fabricating a semiconductor device having a tapered contact hole
08/22/2000US6107123 Methods for providing void-free layers for semiconductor assemblies
08/22/2000US6107122 Direct die contact (DDC) semiconductor package
08/22/2000US6107121 Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package
08/22/2000US6107120 Method of making semiconductor devices having protruding contacts
08/22/2000US6107109 Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate
08/22/2000US6106923 Venting hole designs for multilayer conductor-dielectric structures
08/22/2000US6106259 Transfer molding apparatus with a cull-block having protrusion
08/22/2000US6105868 Chip card contacting device
08/22/2000US6105662 Cooling system for electronic packages
08/22/2000US6105661 Cooling Apparatus
08/22/2000US6105245 Method of manufacturing a resin-encapsulated semiconductor package
08/22/2000US6105243 Method of fabricating multilayer printed circuit board
08/22/2000US6105226 Leadless ceramic chip carrier crosstalk suppression method
08/22/2000US6105215 Clip heat assembly for heat sink
08/17/2000WO2000048253A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
08/17/2000WO2000048252A2 Electrostatic discharge protection of integrated circuits
08/17/2000WO2000048251A1 Methods for packaging integrated circuit devices including cavities adjacent active regions and related structures
08/17/2000WO2000048250A1 Method for the production of a chip-card type portable storage medium
08/17/2000WO2000048249A1 Semiconductor component with a chip carrier with openings for contacting
08/17/2000WO2000048248A1 Semiconductor device with deep substrate contacts
08/17/2000WO2000048247A1 Semiconductor device, method of manufacture thereof, electronic device
08/17/2000WO2000048246A1 Method of manufacturing a vertical metal connection in an integrated circuit
08/17/2000WO2000048243A1 Flexible printed-circuit substrate, film carrier, semiconductor device on tape, semiconductor device, method of semiconductor manufacture, circuit susbstrate, and electronic device
08/17/2000WO2000048241A1 Integrated circuit device and its manufacturing method
08/17/2000WO2000047399A1 Multilayer ceramic circuit boards with embedded resistors
08/17/2000WO2000017924A3 Method and device for buried chips
08/17/2000WO2000015547A9 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
08/17/2000DE19908189A1 Production of integrated electronic component with electrostatic discharge protection
08/17/2000DE19906205A1 Einrichtung Equipment
08/17/2000DE19905055A1 Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung A semiconductor device comprising a chip carrier having openings for contacting
08/17/2000DE19904379A1 Mikroelektronische Struktur Microelectronic structure
08/17/2000DE19904279A1 Semiconductor component, especially for an electric motor frequency converter, has an electrically non-conductive housing directly surrounding cooling bodies of a non-insulated power semiconductor housing
08/17/2000CA2362920A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
08/17/2000CA2362428A1 Electrostatic discharge protection of integrated circuits
08/17/2000CA2356868A1 Semiconductor device with deep substrate contacts
08/16/2000EP1028464A1 Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture
08/16/2000EP1028463A1 Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the same
08/16/2000EP1028462A1 Electronic module of extra thin construction
08/16/2000EP1028461A1 Heat sink fin assembly for cooling an LSI package
08/16/2000EP1028460A2 Dual damascene misalignment tolerant techniques for vias and sacrificial etch segments
08/16/2000EP1028459A2 Method of fabricating semiconductor device
08/16/2000EP1028431A2 Shielded bitlines for static rams
08/16/2000EP1028428A1 Conductor structure
08/16/2000EP1028173A2 Titanium nitride barrier layers
08/16/2000EP1027739A1 Housing for piezoelectric transformer device
08/16/2000EP1027732A1 Monolithic inductor
08/16/2000EP1027731A2 Method for connecting and supporting a csp housing connection with an integrated circuit
08/16/2000EP1027728A1 Component and method for production thereof
08/16/2000EP1027583A1 Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure
08/16/2000CN2392209Y Improved radiating rib contact surface structure
08/16/2000CN1263638A Method and apparatus for cooling semiconductor die
08/16/2000CN1263592A Plate type radiating pipe and its cooling structure
08/15/2000US6104619 Tape carrier package and its fabrication method therefor
08/15/2000US6104614 Fastening device for tight attachment between two plates
08/15/2000US6104612 Clip-on heat sink
08/15/2000US6104610 EMI shielding fluid control apparatus
08/15/2000US6104609 Structure computer central processing unit heat dissipater
08/15/2000US6104464 Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board
08/15/2000US6104095 Printed circuit board and chip-on-board packages using same
08/15/2000US6104094 Semiconductor device
08/15/2000US6104093 Thermally enhanced and mechanically balanced flip chip package and method of forming
08/15/2000US6104092 Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material
08/15/2000US6104091 Semiconductor package and the manufacturing method
08/15/2000US6104090 Integrated circuit subassembly with thermally anisotropic heat transfer element
08/15/2000US6104089 Stacked leads-over chip multi-chip module
08/15/2000US6104088 Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board
08/15/2000US6104087 Microelectronic assemblies with multiple leads
08/15/2000US6104086 Semiconductor device having lead terminals bent in J-shape
08/15/2000US6104085 Semiconductor device and method of producing the same
08/15/2000US6104084 Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads
08/15/2000US6104083 Lead frame used for semiconductor chips of different bit configurations
08/15/2000US6104082 Metallization structure for altering connections
1 ... 1897 1898 1899 1900 1901 1902 1903 1904 1905 1906 1907 1908 1909 1910 1911 1912 1913 1914 1915 1916 1917 ... 2262