Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2000
08/29/2000US6111199 Integrated circuit package using a gas to insulate electrical conductors
08/29/2000US6111198 Duplex feedthrough and method therefor
08/29/2000US6110831 Method of mechanical polishing
08/29/2000US6110829 Ultra-low temperature Al fill for sub-0.25 μm generation of ICs using an Al-Ge-Cu alloy
08/29/2000US6110828 In-situ capped aluminum plug (CAP) process using selective CVD AL for integrated plug/interconnect metallization
08/29/2000US6110825 Process for forming front-back through contacts in micro-integrated electronic devices
08/29/2000US6110824 Wire shape conferring reduced crosstalk and formation methods
08/29/2000US6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method
08/29/2000US6110819 Forming patterned interconnect layer including a first metal consisting of copper, copper alloys, aluminum, and aluminum alloys over first and second insulation layers and over first electrical contact regions, forming openings, contacts
08/29/2000US6110817 Method for improvement of electromigration of copper by carbon doping
08/29/2000US6110816 Method for improving bondability for deep-submicron integrated circuit package
08/29/2000US6110808 Hydrogen getter for integrated microelectronic assembly
08/29/2000US6110806 Process for precision alignment of chips for mounting on a substrate
08/29/2000US6110773 Static random access memory device manufacturing method
08/29/2000US6110762 Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package
08/29/2000US6110761 Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements
08/29/2000US6110755 Method for manufacturing semiconductor device
08/29/2000US6110650 Method of making a circuitized substrate
08/29/2000US6110608 The first and second plated layers are made of a sn substance and a sn alloy; lead-free
08/29/2000US6110598 Low resistive tantalum thin film structure and method for forming the same
08/29/2000US6110596 Silicon nitride ceramic circuit substrate and semiconductor device using the same
08/29/2000US6110577 Composite material for heat sinks for semiconductor devices and method for producing the same
08/29/2000US6110568 Thin film circuit substrate and process for the manufacture thereof
08/29/2000US6110396 Applying slurry of rare earth hydroxide and abrasive; polishing aluminum, copper, tungsten and/or alloy; microelectronics
08/29/2000US6110008 Polishing system
08/29/2000US6109944 IC socket having forwardly displaceable contacts with upper and lower contact pieces
08/29/2000US6109775 Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon
08/29/2000US6109530 Integrated circuit carrier package with battery coin cell
08/29/2000US6109508 Fine pitch bonding method using rectangular wire and capillary bore
08/29/2000US6109507 Method of forming solder bumps and method of forming preformed solder bumps
08/29/2000US6109369 Chip scale package
08/29/2000US6109343 Low EMI emissions heat sink device
08/29/2000US6109341 Electronic component cooling apparatus including elongated heat sink
08/29/2000US6109340 Heat sink fan
08/29/2000CA2157259C Electronic device assembly and a manufacturing method of the same
08/29/2000CA2138095C Thermal management of electronic components using synthetic diamond
08/27/2000WO2000024058A1 Integrated circuit chip made secure against the action of electromagnetic radiation
08/26/2000CA2298318A1 Inductive component, integrated transformer, intended to be incorporated into a radio frequency circuit, and integrated circuit associated with the said inductive component or integrated transformer
08/24/2000WO2000049658A1 Functionally symmetric integrated circuit die
08/24/2000WO2000049657A1 Leadless chip carrier design and structure
08/24/2000WO2000049656A1 Semiconductor device and method of manufacture thereof
08/24/2000WO2000049655A1 Semiconductor device, circuit board, method of manufacturing circuit board, and electronic device
08/24/2000WO2000049652A1 Bonding material, semiconductor device, method of manufacturing semiconductor device, circuit board and electronic device
08/24/2000WO2000049646A1 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
08/24/2000WO2000049538A1 A system for providing an integrated circuit with a unique identification
08/24/2000WO2000049421A1 Testing integrated circuit dice
08/24/2000WO2000049087A1 Epoxy resin composition
08/24/2000WO2000048444A2 Packaging for a semiconductor chip
08/24/2000DE19904363A1 Interference suppression circuit for integrated circuit
08/24/2000DE19904303A1 Gehäuse für ein elektronisches Gerät in der Mikrowellentechnik Housing for an electronic device in microwave technology
08/23/2000EP1030370A2 Integrated semiconductor memory device with self-buffering of supply voltages
08/23/2000EP1030369A1 Multichip module structure and method for manufacturing the same
08/23/2000EP1030368A1 Wireless MMIC chip packaging for microwave and millimeterwave frequencies
08/23/2000EP1030367A2 Integrated semiconductor device with stabilized conductive lines
08/23/2000EP1030366A2 Printed wiring board for semiconductor plastic package
08/23/2000EP1030365A1 Package substrate
08/23/2000EP1030364A2 Laminated ceramic with multilayer electrodes and method of fabrication
08/23/2000EP1030360A2 Electrical test structure on a semiconductor substrate and testing method
08/23/2000EP1030359A2 Layered structure and method of making it
08/23/2000EP1030357A1 Semiconductor device and method for manufacturing the same
08/23/2000EP1030356A2 Process of fabricating semiconductor device
08/23/2000EP1030355A1 Press contact semiconductor device
08/23/2000EP1030354A1 Compression bonded semiconductor device and power converter using the same
08/23/2000EP1030349A2 Method and apparatus for treating components mounted on a substrate, in particular semiconductor chips
08/23/2000EP1029948A2 Using electroplated cu as cold layer for cold/hot deposition
08/23/2000EP1029386A1 Converter socket terminal
08/23/2000EP1029360A2 Vertical interconnect process for silicon segments with dielectric isolation
08/23/2000EP1029354A1 Porous silicon oxycarbide integrated circuit insulator
08/23/2000EP1029352A1 Heat pipe thermal management apparatus
08/23/2000EP1029351A1 Non-electrically conductive thermal dissipator for electronic components
08/23/2000EP1029350A1 Spring clamp assembly for thermal stacked components
08/23/2000EP1029349A1 Titanium nitride contact plug formation
08/23/2000EP1029348A1 A system for identifying defective electronic devices
08/23/2000EP1029347A1 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
08/23/2000EP1029346A1 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
08/23/2000EP1018290A4 A system and method for packaging integrated circuits
08/23/2000EP0770266B1 Method of manufacturing a semiconductor device suitable for surface mounting
08/23/2000EP0748518B1 Method of etching conductive lines without undercutting
08/23/2000CN1264496A Folded fin heat sink and fan attachment
08/23/2000CN1264495A Method and device for producing chip-substrate-lin
08/23/2000CN1264494A Semiconductor device, mounting structure thereof and method of fabrication thereof
08/23/2000CN1264270A Flexible wiring base and making method thereof
08/23/2000CN1264178A 半导体装置 Semiconductor device
08/23/2000CN1264176A LOC semiconductor packaging and manufacture method thereof
08/23/2000CN1264175A 功率半导体模块 Power Semiconductor Modules
08/23/2000CN1264174A Semiconductor device sealed with resin
08/23/2000CN1264173A Semiconductor device and manufacture method
08/23/2000CN1264167A Package method of semiconduct crystal chip and its finished products
08/23/2000CN1264160A Method for integrated substrate contact on insulator silicon chip with shallow ridges insulation technology
08/22/2000US6108212 Surface-mount device package having an integral passive component
08/22/2000US6108208 Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
08/22/2000US6108207 Clip for heat sink
08/22/2000US6108206 Semiconductor thermal protection arrangement
08/22/2000US6108205 Means and method for mounting electronics
08/22/2000US6108204 CPU heat sink
08/22/2000US6108026 Laser marking techniques
08/22/2000US6107869 Semiconductor integrated circuit
08/22/2000US6107711 Brushless exciter for a rotating electromagnetic machine
08/22/2000US6107690 Coated semiconductor die/leadframe assembly and method for coating the assembly
08/22/2000US6107689 Semiconductor device
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