Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2000
09/05/2000US6114222 Method to cure mobile ion contamination in semiconductor processing
09/05/2000US6114221 Method and apparatus for interconnecting multiple circuit chips
09/05/2000US6114215 Generating non-planar topology on the surface of planar and near-planar substrates
09/05/2000US6114192 Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
09/05/2000US6114191 Semiconductor packaging method
09/05/2000US6114190 Method of forming heat sink and semiconductor chip assemblies
09/05/2000US6114189 Molded array integrated circuit package
09/05/2000US6114187 Method for preparing a chip scale package and product produced by the method
09/05/2000US6114186 Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits
09/05/2000US6114182 Measuring electron shading damage in semiconductor fabrication
09/05/2000US6114048 Functionally graded metal substrates and process for making same
09/05/2000US6114032 Films for use in microelectronic devices and methods of producing same
09/05/2000US6114013 Sealing label for sealing semiconductor element
09/05/2000US6114005 An insulating layer containing a resin segment sea-island structure and a woven reinforcement, which exhibit glass transtiion temperature 150-300 degree c.; capable of coping with high speed transmission with good electric characteristic
09/05/2000US6113992 Laser making techniques
09/05/2000US6113730 Metal-foil-clad composite ceramic board and process for the production thereof
09/05/2000US6113728 Forming filmy adhesive layer comprising liquid epoxy resin, solid resin and micro-capsule curing agent on surfaces of projecting electrodes of semiconductor wafer; cutting wafer along with adhesive layer to form chips; curing adhesive
09/05/2000US6113709 Method of preparing a conductive bonding pad
09/05/2000US6113702 Wafer support system
09/05/2000US6113699 Purging gas control structure for CVD chamber
09/05/2000US6113399 Low-profile socketed packaging system with land-grid array and thermally conductive slug
09/05/2000US6113043 Mount for integrated circuit device
09/05/2000US6112378 Fastening device for a heat sink
08/2000
08/31/2000WO2000051327A1 Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system
08/31/2000WO2000051190A1 Packaged strain actuator
08/31/2000WO2000051182A1 High-frequency module and method of manufacture thereof
08/31/2000WO2000051181A1 Ic device and its production method, and information carrier mounted with ic device and its production method
08/31/2000WO2000051179A1 Method of manufacturing a leadframe assembly
08/31/2000WO2000051178A1 Electronic device
08/31/2000WO2000051177A1 Integrated circuit device with air dielectric
08/31/2000WO2000051012A2 Integrated circuit interconnect system
08/31/2000WO2000050994A2 Calibrating functions of an integrated circuit and storing calibration parameters thereof in a programmable fuse array
08/31/2000WO2000050512A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device
08/31/2000WO2000050198A1 Method for machining work by laser beam
08/31/2000WO2000026942A3 Method for producing filled vias in electronic components
08/31/2000WO2000021132A9 Semiconductor integrated circuit with temporarily interconnected bond pads
08/31/2000DE19962422A1 Multilayer printed circuit board manufacturing method involves electro plating metal layer and etching it after which ink layer and sheet portion between slots are removed
08/31/2000DE19908749A1 Attaining uniform temperature distribution for semiconductor component soldered on carrier in systems with efficient cooler
08/31/2000DE19907155A1 Integrierte Halbleiterspeicheranordnung mit Selbstpufferung von Versorgungsspannungen Integrated semiconductor memory arrangement having Selbstpufferung of supply voltages
08/31/2000DE19906209A1 Cutting out individual circuit units from panel, using high speed milling of e.g. 1000 m per min
08/31/2000DE10007167A1 Semiconductor housing substrate, especially a power semiconductor chip carrier substrate, comprises an aluminum silicon carbide body bearing an aluminum nitride layer and an aluminum outer layer
08/31/2000CA2364802A1 Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system
08/31/2000CA2363949A1 Packaged strain actuator
08/30/2000EP1032079A1 Conductive elastomer interconnect
08/30/2000EP1032043A2 Semiconductor memory device with twisted bit lines
08/30/2000EP1032041A2 Semiconductor device comprising an internal wiring pattern
08/30/2000EP1032040A2 Metal wire fuse structure with cavity
08/30/2000EP1032039A2 Vertical fuse and method of fabrication
08/30/2000EP1032038A2 Conductive and resitive material with electrical stability for use in electronics devices
08/30/2000EP1032037A2 Resin-moulded semiconductor device, method for manufacturing the same, and leadframe
08/30/2000EP1032036A2 Semiconductor device and process for fabrication thereof
08/30/2000EP1032032A2 Tailoring of a wetting/barrier layer to reduce electromigration in an aluminium interconnect
08/30/2000EP1032030A2 Flip chip bump bonding
08/30/2000EP1032025A2 Process for patterning a semiconductor wafer and lithography exposure masks
08/30/2000EP1032001A1 Inductive component, integrated transformer, in particular for a radio frequency circuit, and associated integrated circuit with such inductive component or integrated transformer
08/30/2000EP0970520A4 Mounting structure and mounting process from semiconductor devices
08/30/2000EP0687382B1 Device and method for reducing effects of thermal cycling in a semiconductor package
08/30/2000EP0602252B1 Ceramic green sheet
08/30/2000CN2394406Y Heat radiator
08/30/2000CN2394327Y Plastic sealing structure
08/30/2000CN1265262A System and method for packaging integrated circuits
08/30/2000CN1264924A Memory assembly and its making method
08/30/2000CN1264923A Semiconductor device and its mfg. method
08/30/2000CN1264922A Method for mfg. semiconductor device
08/30/2000CN1056015C Metal film forming method
08/29/2000USRE36837 Structure of contact between wiring layers in semiconductor integrated circuit device
08/29/2000US6112275 Method of communicating over a single wire bus between a host device and a module device which measures thermal accumulation over time
08/29/2000US6111761 Electronic assembly
08/29/2000US6111756 Universal multichip interconnect systems
08/29/2000US6111752 Device for fastening a heat sink to a heat-generating electrical component
08/29/2000US6111750 Electronic apparatus
08/29/2000US6111749 Flexible cold plate having a one-piece coolant conduit and method employing same
08/29/2000US6111748 Flat fan heat exchanger and use thereof in a computing device
08/29/2000US6111742 Implementation of an intermetallic capacitor
08/29/2000US6111619 Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array
08/29/2000US6111324 Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
08/29/2000US6111323 Reworkable thermoplastic encapsulant
08/29/2000US6111322 Semiconductor device and manufacturing method thereof
08/29/2000US6111320 Semiconductor device having a barrier film for preventing penetration of moisture
08/29/2000US6111319 Method of forming submicron contacts and vias in an integrated circuit
08/29/2000US6111318 Comprising copper tantalum for which tantalum is added in copper as a base and wherein copper tantalum has tantalum precipitated at grain boundaries of copper
08/29/2000US6111317 Flip-chip connection type semiconductor integrated circuit device
08/29/2000US6111316 Electronic component encapsulated in a glass tube
08/29/2000US6111315 Semiconductor package with offset die pad
08/29/2000US6111314 Thermal cap with embedded particles
08/29/2000US6111313 Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit
08/29/2000US6111312 Semiconductor device with leads engaged with notches
08/29/2000US6111311 Semiconductor device and method of forming the same
08/29/2000US6111310 Radially-increasing core power bus grid architecture
08/29/2000US6111309 Semiconductor device
08/29/2000US6111308 Ground plane for plastic encapsulated integrated circuit die packages
08/29/2000US6111307 Method of making lead frame including angle iron tie bar
08/29/2000US6111306 Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
08/29/2000US6111303 Non-contact electronic card and its manufacturing process
08/29/2000US6111302 Antifuse structure suitable for VLSI application
08/29/2000US6111301 Interconnection with integrated corrosion stop
08/29/2000US6111297 MOS-technology power device integrated structure and manufacturing process thereof
08/29/2000US6111269 Circuit, structure and method of testing a semiconductor, such as an integrated circuit
08/29/2000US6111246 Semiconductor device testing apparatus having presence or absence detectors issuing an alarm when an error occurs
08/29/2000US6111220 Circuit and method for heating an adhesive to package or rework a semiconductor die
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