| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/12/2000 | US6118183 Semiconductor device, manufacturing method thereof, and insulating substrate for same |
| 09/12/2000 | US6118182 Integrated circuit package with rectangular contact pads |
| 09/12/2000 | US6118180 Semiconductor die metal layout for flip chip packaging |
| 09/12/2000 | US6118179 Semiconductor component with external contact polymer support member and method of fabrication |
| 09/12/2000 | US6118178 Circuit film utilizing a power supply and ground connections |
| 09/12/2000 | US6118177 Heatspreader for a flip chip device, and method for connecting the heatspreader |
| 09/12/2000 | US6118176 Stacked chip assembly utilizing a lead frame |
| 09/12/2000 | US6118174 Bottom lead frame and bottom lead semiconductor package using the same |
| 09/12/2000 | US6118173 Lead frame and a semiconductor device |
| 09/12/2000 | US6118172 High-frequency circuit device and manufacturing method thereof |
| 09/12/2000 | US6118170 Resistance element having flexing portion and its manufacturing method |
| 09/12/2000 | US6118140 Semiconductor apparatus having conductive thin films |
| 09/12/2000 | US6118138 Reduced terminal testing system |
| 09/12/2000 | US6118137 Test structure responsive to electrical signals for determining lithographic misalignment of conductors relative to vias |
| 09/12/2000 | US6117953 Blends |
| 09/12/2000 | US6117797 Improved method for fabricating a chip on board semiconductor device requiring enhanced heat dissipation such as circuit boards |
| 09/12/2000 | US6117792 Method for manufacturing semiconductor device |
| 09/12/2000 | US6117781 Optimized trench/via profile for damascene processing |
| 09/12/2000 | US6117770 Method for implanting semiconductor conductive layers |
| 09/12/2000 | US6117769 Pad structure for copper interconnection and its formation |
| 09/12/2000 | US6117768 Void-free tungsten-plug contact for ULSI interconnection |
| 09/12/2000 | US6117765 Method of preventing cracks in insulating spaces between metal wiring patterns |
| 09/12/2000 | US6117763 Method of manufacturing a semiconductor device with a low permittivity dielectric layer and contamination due to exposure to water |
| 09/12/2000 | US6117762 Method and apparatus using silicide layer for protecting integrated circuits from reverse engineering |
| 09/12/2000 | US6117760 Method of making a high density interconnect formation |
| 09/12/2000 | US6117759 Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package |
| 09/12/2000 | US6117758 Etch removal of aluminum islands during manufacture of semiconductor device wiring layer |
| 09/12/2000 | US6117745 Bistable fuse by amorphization of polysilicon |
| 09/12/2000 | US6117720 Method of making an integrated circuit electrode having a reduced contact area |
| 09/12/2000 | US6117714 Method for protecting a transistor gate from charge damage |
| 09/12/2000 | US6117710 Plastic package with exposed die and method of making same |
| 09/12/2000 | US6117709 Resin sealing type semiconductor device and method of manufacturing the same |
| 09/12/2000 | US6117706 Print circuit board |
| 09/12/2000 | US6117705 Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
| 09/12/2000 | US6117566 Lead frame material |
| 09/12/2000 | US6117539 Conductive elastomer comprising non-conductive elastic material having quantity of conductive flakes interspersed therein grafted to elastic substrate to form electrically conductive circuit traces |
| 09/12/2000 | US6117513 Semiconductor device and a lamination and fixing material used in the method of manufacture of the semiconductor device |
| 09/12/2000 | US6117367 Comprised of a metal or alloy, glass frit, an organic binder, a solvent, and a modifier phase; use in fabrication of multilayer ceramic substrates for semiconductors; paste reduces substrate defects such as via bulge and camber |
| 09/12/2000 | US6117299 Methods of electroplating solder bumps of uniform height on integrated circuit substrates |
| 09/12/2000 | US6116487 Method and apparatus for sweeping overflowed resin on semiconductor device manufacturing process |
| 09/12/2000 | US6116331 Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile |
| 09/12/2000 | US6116040 Apparatus for cooling the power electronics of a refrigeration compressor drive |
| 09/12/2000 | US6116039 Cooling apparatus having integrated sorber-evaporator structure |
| 09/12/2000 | US6115912 Apparatus and method for printed circuit board repair |
| 09/08/2000 | WO2000052757A1 Semiconductor device |
| 09/08/2000 | WO2000052739A2 A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
| 09/08/2000 | WO2000052401A1 Cooling device of electronic device |
| 09/08/2000 | WO2000052109A1 Electronic tag assembly and method therefor |
| 09/08/2000 | WO2000020900A3 Silicon carbide for use as a low dielectric constant anti-reflective coating and its deposition method |
| 09/08/2000 | WO1999065062A9 Ic stack utilizing secondary leadframes |
| 09/07/2000 | DE19908428A1 Halbleiterspeicheranordnung mit Bitleitungs-Twist A semiconductor memory device with bit line twist |
| 09/07/2000 | DE19908188A1 Integrated electronic circuit manufacturing method |
| 09/06/2000 | EP1033810A2 A method of manufacturing a surface acoustic wave apparatus |
| 09/06/2000 | EP1033749A2 Method and producing ceramic multilayer substrate |
| 09/06/2000 | EP1033747A2 An improved method for depositing and planarizing fluorinated BPSG films |
| 09/06/2000 | EP1033069A1 Cooling element for an unevenly distributed heat load |
| 09/06/2000 | EP1032969A1 Electronic package assembly |
| 09/06/2000 | EP0941643B1 Base for an integrated circuit |
| 09/06/2000 | CN2395385Y Hinged heat conductive structure |
| 09/06/2000 | CN2395322Y 固定夹具 Fixture |
| 09/06/2000 | CN1265819A Heat sink |
| 09/06/2000 | CN1265777A Low-profile axial-flow single-blade piezoelectric fan |
| 09/06/2000 | CN1265759A Method for producing chip module |
| 09/06/2000 | CN1265538A Method for manufacture of surface acoustic wave device |
| 09/05/2000 | US6115255 Hybrid high-power integrated circuit |
| 09/05/2000 | US6115254 Vertical surface mount apparatus with thermal carrier |
| 09/05/2000 | US6115253 Strap spring for heat sink clip assembly |
| 09/05/2000 | US6115097 Liquid crystal device with light blocking sealing member and light blocking electrode over two interlayer insulating films |
| 09/05/2000 | US6114937 Integrated circuit spiral inductor |
| 09/05/2000 | US6114770 Low profile semiconductor package |
| 09/05/2000 | US6114769 Solder paste brick |
| 09/05/2000 | US6114766 Integrated circuit with metal features presenting a larger landing area for vias |
| 09/05/2000 | US6114765 Titanium silicide film which has a high heat resistance and a low sheet resistance comprising a titanium silicide film containing a refractory metal having a higher melting point than titanium in the form of a substitutional solid solution |
| 09/05/2000 | US6114764 Insulating layer on semiconductor body; titanium nitride barrier metal layer on insulating layer; aluminum based alloy having crystallographic axis inclined by an angle of 0 to 5 degrees with respect to a normal of the barrier metal layer |
| 09/05/2000 | US6114763 Semiconductor package with translator for connection to an external substrate |
| 09/05/2000 | US6114761 Thermally-enhanced flip chip IC package with extruded heatspreader |
| 09/05/2000 | US6114760 Ball grid array (BGA) semiconductor package member |
| 09/05/2000 | US6114759 Semiconductor package |
| 09/05/2000 | US6114757 Leadless IC socket |
| 09/05/2000 | US6114756 Interdigitated capacitor design for integrated circuit leadframes |
| 09/05/2000 | US6114755 Semiconductor package including chip housing, encapsulation and the manufacturing method |
| 09/05/2000 | US6114754 Tape automated bonding film |
| 09/05/2000 | US6114753 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
| 09/05/2000 | US6114752 Semiconductor package having lead frame with an exposed base pad |
| 09/05/2000 | US6114751 Semiconductor device and electronic device |
| 09/05/2000 | US6114750 Surface mount TO-220 package and process for the manufacture thereof |
| 09/05/2000 | US6114749 Integrated circuit with lead frame package having internal power and ground busses |
| 09/05/2000 | US6114748 AC plasma display panel provided with glaze layer having conductive member |
| 09/05/2000 | US6114747 Process design for wafer edge in VLSI |
| 09/05/2000 | US6114734 Transistor structure incorporating a solid deuterium source for gate interface passivation |
| 09/05/2000 | US6114716 Heterolithic microwave integrated circuits |
| 09/05/2000 | US6114714 Antifuse development using α-c:h,n,f thin films |
| 09/05/2000 | US6114627 Underfill coating for LOC package |
| 09/05/2000 | US6114256 Using a ternary, amorphous ti--si--n diffusion barrier |
| 09/05/2000 | US6114244 Forming a barrier metal in the hole and on said semiconductor substrate having an oxide film on a surface |
| 09/05/2000 | US6114243 Preventing copper contamination of an intermetal dielectric layer during via or dual damascene etching in the fabrication of an integrated circuit device |
| 09/05/2000 | US6114240 Method for fabricating semiconductor components using focused laser beam |
| 09/05/2000 | US6114239 Relates to semiconductor flip chip technology and more particularly to conductive epoxy attachment of a die pad to a supporting substrate |
| 09/05/2000 | US6114236 Process for production of semiconductor device having an insulating film of low dielectric constant |
| 09/05/2000 | US6114231 Wafer structure for securing bonding pads on integrated circuit chips and a method for fabricating the same |