Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2000
09/19/2000US6121685 Metal-alloy interconnections for integrated circuits
09/19/2000US6121684 Integrated butt contact having a protective spacer
09/19/2000US6121682 Multi-chip package
09/19/2000US6121681 Semiconductor device
09/19/2000US6121680 Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
09/19/2000US6121679 Structure for printed circuit design
09/19/2000US6121678 Wrap-around interconnect for fine pitch ball grid array
09/19/2000US6121677 Reduced size integrated circuits and methods using test pads located in scribe regions of integrated circuits wafers
09/19/2000US6121676 Stacked microelectronic assembly and method therefor
09/19/2000US6121675 Semiconductor optical sensing device package
09/19/2000US6121674 Die paddle clamping method for wire bond enhancement
09/19/2000US6121673 Leadframe finger support
09/19/2000US6121672 Raised pedestal radiation shield for sensitive electronics
09/19/2000US6121661 Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipation
09/19/2000US6121659 Buried patterned conductor planes for semiconductor-on-insulator integrated circuit
09/19/2000US6121644 Semiconductor integrated circuit device and method of arranging and wiring cells
09/19/2000US6121631 Test structure to determine the effect of LDD length upon transistor performance
09/19/2000US6121553 Circuit boards using heat resistant resin for adhesive layers
09/19/2000US6121539 Thermoelectric devices and methods for making the same
09/19/2000US6121160 Multilayer semiconductor of polyimides layers and insulator films
09/19/2000US6121131 Substrate with surface metal hydrogen layer, metal layer and heat treatment
09/19/2000US6121126 Layers of silicon and germanium, oxidation and forming integrated circuits
09/19/2000US6121086 Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit device
09/19/2000US6121083 Fabrication of semiconductors from multilayer insulating films
09/19/2000US6121074 Fuse layout for improved fuse blow process window
09/19/2000US6121073 Method for making a fuse structure for improved repaired yields on semiconductor memory devices
09/19/2000US6121070 Flip chip down-bond: method and apparatus
09/19/2000US6121069 Connectors for integrated circuit chips with lead balls surrounded with barrier photoresists and tin coverings
09/19/2000US6121067 Method for additive de-marking of packaged integrated circuits and resulting packages
09/19/2000US6121062 Process of fabricating semiconductor unit employing bumps to bond two components
09/19/2000US6120915 Integrated circuit with two silicon-containing structures over a metal layer having sidewalls which define a lateral space therebetween; silicon diffusion restriction structures between the silicon-containing structures and the sidewalls
09/19/2000US6120907 Heat-mode laser recording medium on a support, said laser recording medium is covered by a thin flexible glass layer of less than 850 micrometers; improved strength, shelf-life, and better security against counterfeiting
09/19/2000US6120906 Sintered body of a complex oxide of silicon, aluminum, zinc, magnesium, and boron; contains a spinel crystal phase of zinc oxide and aluminum oxide and a quartz crystal phase; low dielectric loss; for transmitting high frequency signals
09/19/2000US6120885 Electrically conducting spheres disposed in array on electronic chip carrier module, spheres being joined to terminal pads on module by means of electrically conducting adhesive comprising thermosetting, thermoplastic resin, solder
09/19/2000US6120884 Comprising conductive silver or silver alloy and a metal oxide dispersed in a vehicle; improved electrical properties
09/19/2000US6120716 Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same
09/19/2000US6120708 Conductive paste and method for producing ceramic substrate using the same
09/19/2000US6120348 Polishing system
09/19/2000US6120301 Semiconductor device and method of manufacturing the same
09/19/2000US6119923 Packaging electrical circuits
09/19/2000US6119920 Method of forming an electronic package with a solder seal
09/19/2000US6119765 Structure of heat dissipating pieces of memories
09/19/2000US6119675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
09/19/2000CA2291568A1 Flip-chip package with optimized encapsulant adhesion and method
09/14/2000WO2000054337A1 Apparatus and method for an integrated circuit having high q reactive components
09/14/2000WO2000054333A1 Display device
09/14/2000WO2000054332A1 Cooling system for pulsed power electronics
09/14/2000WO2000054331A1 Methods of forming local interconnects and conductive lines, and resulting structure
09/14/2000WO2000054330A1 High-reliability damascene interconnect formation for semiconductor fabrication
09/14/2000WO2000054325A1 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
09/14/2000WO2000054324A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device
09/14/2000WO2000054323A1 Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device
09/14/2000WO2000054321A1 Microelectronic joining processes
09/14/2000WO2000033622A3 Improved heat sink and process of manufacture
09/14/2000WO2000019524A3 Ic interconnect structures and methods for making same
09/14/2000DE19911204A1 Electronic components cooling device for use in motor vehicle, uses aluminum or aluminum-alloy support fastened to radiator, for carrying electronic components
09/14/2000CA2362159A1 Apparatus and method for an integrated circuit having high q reactive components
09/13/2000EP1035759A2 Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board
09/13/2000EP1035588A2 Iridium conductive electrode/barrier structure and method for same
09/13/2000EP1035586A1 Semiconductor module and power converter comprising it
09/13/2000EP1035585A2 Interconnection between two substrates
09/13/2000EP1035584A1 Method and device to remove a surface marking from an integrated circuit wafer
09/13/2000EP1035583A2 Semiconductor element and fabricating method thereof
09/13/2000EP1035582A2 Semiconductor device and method of manufacturing the same
09/13/2000EP1035581A2 Multilayer wiring board
09/13/2000EP1035580A2 Method and structure for integrated circuit package
09/13/2000EP1035579A2 Fabrication method and strcuture of an integrated circuit package
09/13/2000EP1035578A1 Process for the production of a finned diamond heatsink
09/13/2000EP1035577A1 Wiring substrate, method of manufacture thereof, and semiconductor device
09/13/2000EP1035573A1 Electrical power component soldered on a support and corresponding mounting method
09/13/2000EP1035566A2 Method for forming a buried doped layer with connecting portions within a semiconductive device
09/13/2000EP1034942A1 Semiconductor device and method of manufacturing the same
09/13/2000EP1034883A1 Wafer, apparatus and method of chamfering wafer
09/13/2000EP1034564A1 Process for fabricating semiconductor device including antireflective etch stop layer
09/13/2000EP1034555A1 Semiconductor element with defined performance characteristics in the case of failure and method for the production thereof
09/13/2000EP1034510A1 Method for producing a supporting element for an integrated circuit module for placement in chip cards
09/13/2000EP0929592A4 Thermosetting resin compositions useful as underfill sealants
09/13/2000CN2396510Y 引线板 Lead plate
09/13/2000CN2396509Y Electronic diode modulization epoxy encapsulation mould
09/13/2000CN1266607A Method of manufacturing surface-mountable SIL hybrid circuit
09/13/2000CN1266492A Test socket lattice
09/13/2000CN1266491A Aging test socket
09/13/2000CN1266284A Influence of aluminium interlinking reliability and function influenced by the cleanliness of upper and lower titanium layer
09/13/2000CN1266283A Semiconductor device, instllation structure for smeiconductor device, liquid crystal device and electronic device
09/13/2000CN1266276A Semiconductor device
09/13/2000CN1266275A Method for connecting parts in semiconductor device
09/13/2000CN1056491C Transport-ty-suction type mold
09/13/2000CN1056473C Interconnection device for semiconductor component and making method
09/13/2000CN1056468C Method for forming insulation film between every metal wiring for semiconductor device
09/12/2000US6118671 Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer
09/12/2000US6118669 Routing topology for identical connector point layouts on primary and secondary sides of a substrate
09/12/2000US6118661 Clip for retaining a heat sink on a chip
09/12/2000US6118660 Circuit module with improved heat transfer
09/12/2000US6118659 Heat sink clamping spring additionally holding a ZIF socket locked
09/12/2000US6118658 Heat sink fan for cooling an electronic apparatus
09/12/2000US6118657 Fan attachment clip for heat sink
09/12/2000US6118656 Heat sink having a pressure gradient
09/12/2000US6118357 Wireless MMIC chip packaging for microwave and millimeterwave frequencies
09/12/2000US6118351 Micromagnetic device for power processing applications and method of manufacture therefor
09/12/2000US6118184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow
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