| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/26/2000 | US6124629 Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip |
| 09/26/2000 | US6124626 Capacitor structures formed using excess oxygen containing material provided relative to electrodes thereof |
| 09/26/2000 | US6124624 Q inductor with multiple metallization levels |
| 09/26/2000 | US6124622 MIS transistor with a three-layer device isolation film surrounding the MIS transistor |
| 09/26/2000 | US6124553 Multilayer wiring board having vent holes and method of making |
| 09/26/2000 | US6124547 Tape carrier package |
| 09/26/2000 | US6124546 Integrated circuit chip package and method of making the same |
| 09/26/2000 | US6124421 Poly(arylene ether) compositions and methods of manufacture thereof |
| 09/26/2000 | US6124407 Silicone composition, method for the preparation thereof, and silicone elastomer |
| 09/26/2000 | US6124217 Forming a silicon oxynitride layer upon a semiconductor topography, perfomring a bake of silicon oxynitride layer, and forming an oxide layer directly over said silicon oxynitride layer thereby forming the interlevel dielectric |
| 09/26/2000 | US6124199 Method for simultaneously forming a storage-capacitor electrode and interconnect |
| 09/26/2000 | US6124198 Ultra high-speed chip interconnect using free-space dielectrics |
| 09/26/2000 | US6124197 Adjusting the size of conductive lines based upon contact size |
| 09/26/2000 | US6124196 Variable circuit connector and method of fabricating the same |
| 09/26/2000 | US6124195 Utilization of die repattern layers for die internal connections |
| 09/26/2000 | US6124194 Method of fabrication of anti-fuse integrated with dual damascene process |
| 09/26/2000 | US6124193 Raised tungsten plug antifuse and fabrication processes |
| 09/26/2000 | US6124192 Method for fabricating ultra-small interconnections using simplified patterns and sidewall contact plugs |
| 09/26/2000 | US6124165 Method for making openings in a passivation layer over polycide fuses using a single mask while forming reliable tungsten via plugs on DRAMs |
| 09/26/2000 | US6124152 Method for fabricating cob type semiconductor package |
| 09/26/2000 | US6124151 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/26/2000 | US6124150 Transverse hybrid LOC package |
| 09/26/2000 | US6124143 Process monitor circuitry for integrated circuits |
| 09/26/2000 | US6124041 Multilayer ceramic package comprising ceramic substrate and a copper based sintering paste for forming conductive vias or surface patterns, comprising copper powder, and powdered copper aluminate as copper sources, and organic materials |
| 09/26/2000 | US6123992 Method of forming aluminum interconnection layer |
| 09/26/2000 | US6123895 Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same |
| 09/26/2000 | US6123825 Electromigration-resistant copper microstructure and process of making |
| 09/26/2000 | US6123145 Synthetic jet actuators for cooling heated bodies and environments |
| 09/26/2000 | US6122926 Low thermal conductance insulated cooling assembly for IC chip modules |
| 09/26/2000 | US6122822 Method for balancing mold flow in encapsulating devices |
| 09/23/2000 | CA2301988A1 Monolithic integrated circuit with a built-in inductive component and procedure for fabricating such an integrated circuit |
| 09/21/2000 | WO2000056130A1 A method and an arrangement for the electrical contact of components |
| 09/21/2000 | WO2000055916A1 Methods and apparatus for fabricating a multiple modular assembly |
| 09/21/2000 | WO2000055915A1 Web process interconnect in electronic assemblies |
| 09/21/2000 | WO2000055914A1 Semiconductor radiation emitter package |
| 09/21/2000 | WO2000055913A1 Multi-layer substrates and fabrication processes |
| 09/21/2000 | WO2000055912A1 Magnetic alignment system for bumps on an integrated circuit device |
| 09/21/2000 | WO2000055910A1 Semiconductor device and semiconductor module |
| 09/21/2000 | WO2000055909A1 Extreme density packaging for electronic assemblies |
| 09/21/2000 | WO2000055902A1 Electron beam process during damascene processing |
| 09/21/2000 | WO2000055901A1 Method for filling gaps on a semiconductor wafer |
| 09/21/2000 | WO2000055900A1 Ion current density measuring method and instrument, and semiconductor device manufacturing method |
| 09/21/2000 | WO2000055898A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 09/21/2000 | WO2000055889A1 Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 09/21/2000 | WO2000055887A2 Housing for an electronic circuit |
| 09/21/2000 | WO2000055685A1 Indicators and illuminators using a semiconductor radiation emitter package |
| 09/21/2000 | WO2000025350A9 Apparatus for and method of manufacturing a semiconductor die carrier |
| 09/21/2000 | DE19962663A1 Organisches, nicht reflektierendes Beschichtungsmaterial und dessen Herstellung Organic, non-reflective coating material and its preparation |
| 09/21/2000 | DE19912441A1 Multi-Chip-Modul Multi-chip module |
| 09/21/2000 | CA2368265A1 Electron beam process during damascene processing |
| 09/21/2000 | CA2368057A1 A method and an arrangement for the electrical contact of components |
| 09/20/2000 | EP1037328A1 Apparatus for providing controlled impedance in an electrical contact |
| 09/20/2000 | EP1037283A1 Semiconductor memory device |
| 09/20/2000 | EP1037282A1 Semiconductor memory device |
| 09/20/2000 | EP1037278A2 Semiconductor device structure with specifically dimensioned redundancy fuses for laser repair |
| 09/20/2000 | EP1037277A2 Lead frame |
| 09/20/2000 | EP1037276A1 Method for forming a porous silicon dioxide film |
| 09/20/2000 | EP1037275A1 Method for forming a porous silicon oxide film |
| 09/20/2000 | EP1037271A2 Method for forming an interlayer insulating film, and semiconductor device |
| 09/20/2000 | EP1037270A1 Wiring structure of semiconductor device, electrode, and method for forming them |
| 09/20/2000 | EP1037001A2 Apparatus for cooling the power electronis of a refrigeration compressor drive |
| 09/20/2000 | EP1036849A2 Metal matrix composite material, process for its production and use |
| 09/20/2000 | EP1036491A1 Cooling system for semiconductor die carrier |
| 09/20/2000 | EP1036489A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
| 09/20/2000 | EP1036414A1 Chip scale package using large ductile solder balls |
| 09/20/2000 | EP1036413A1 Mounting arrangement for securing an integrated circuit package to a heat sink |
| 09/20/2000 | EP1036412A1 CO-PLANAR Si AND Ge COMPOSITE SUBSTRATE AND METHOD OF PRODUCING SAME |
| 09/20/2000 | EP0822894A4 Anodized aluminum substrate having increased breakdown voltage |
| 09/20/2000 | CN2397702Y Line device for printed circuit |
| 09/20/2000 | CN1267396A Multichip module structure and method for mfg. same |
| 09/20/2000 | CN1267395A Semiconductor device and method of fabricating same |
| 09/20/2000 | CN1267394A Component with protective layer and method for producing protective layer for component |
| 09/20/2000 | CN1267180A Terminal structure to connect electronic component thereon |
| 09/20/2000 | CN1267091A Semiconductor IC device |
| 09/20/2000 | CN1267088A Semiconductor lead frame assembly and method for mfg. semiconductor element |
| 09/20/2000 | CN1267087A Semiconductor device and its making method |
| 09/20/2000 | CN1267085A Chip, and device and method for chamfering chip |
| 09/20/2000 | CN1267009A Portable computer cooling method and computer retainer |
| 09/20/2000 | CN1266978A Apparatus for cooling power electronic device of driving device of refragerating compressor |
| 09/20/2000 | CN1266843A Organic antireflecting coating and its preparation |
| 09/20/2000 | CN1056653C High-strength copper based alloy free from smutting during pretreatment for plating |
| 09/19/2000 | US6122704 Integrated circuit for identifying an item via a serial port |
| 09/19/2000 | US6122187 Stacked integrated circuits |
| 09/19/2000 | US6122177 Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability |
| 09/19/2000 | US6122174 Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate |
| 09/19/2000 | US6122172 Polymer stud grid array |
| 09/19/2000 | US6122171 Heat sink chip package and method of making |
| 09/19/2000 | US6122170 Power module board and power module using the board |
| 09/19/2000 | US6122169 Heat sink assembly |
| 09/19/2000 | US6122167 Integrated hybrid cooling with EMI shielding for a portable computer |
| 09/19/2000 | US6121988 Printed wiring board and its manufacturing method, and electronic apparatus |
| 09/19/2000 | US6121833 High-gain amplifier |
| 09/19/2000 | US6121827 Digital noise reduction in integrated circuits and circuit assemblies |
| 09/19/2000 | US6121820 Semiconductor device having fuse and method for checking whether the fuse is fused |
| 09/19/2000 | US6121699 AC generator for motor vehicles |
| 09/19/2000 | US6121690 Semiconductor device having two pluralities of electrode pads, pads of different pluralities having different widths and respective pads of different pluralities having an aligned transverse edge |
| 09/19/2000 | US6121689 Semiconductor flip-chip package and method for the fabrication thereof |
| 09/19/2000 | US6121688 Anisotropic conductive sheet and printed circuit board |
| 09/19/2000 | US6121687 Input-output circuit cell and semiconductor integrated circuit apparatus |
| 09/19/2000 | US6121686 Ball grid array package having through-holes disposed in the substrate under the chip |