Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2000
10/03/2000US6127634 Wiring board with an insulating layer to prevent gap formation during etching
10/03/2000US6127629 Hermetically sealed microelectronic device and method of forming same
10/03/2000US6127460 Liquid epoxy resin potting material
10/03/2000US6127285 Interlevel dielectrics with reduced dielectric constant
10/03/2000US6127274 Process for producing electronic devices
10/03/2000US6127270 Methods of forming refractory metal silicide components and methods of restricting silicon surface migration of a silicon structure
10/03/2000US6127268 Process for fabricating a semiconductor device with a patterned metal layer
10/03/2000US6127265 Method of manufacturing a semiconductor device with a stacked via
10/03/2000US6127264 Integrated circuit having conductors of enhanced cross-sectional area
10/03/2000US6127263 Misalignment tolerant techniques for dual damascene fabrication
10/03/2000US6127261 Method of fabricating an integrated circuit including a tri-layer pre-metal interlayer dielectric compatible with advanced CMOS technologies
10/03/2000US6127257 Method of making a contact structure
10/03/2000US6127256 Semiconductor device and method of manufacturing the same
10/03/2000US6127255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same
10/03/2000US6127253 Lead-free interconnection for electronic devices
10/03/2000US6127252 Metal-line structure in integrated circuit and method of fabricating the same
10/03/2000US6127250 Method of increasing package reliability by designing in plane CTE gradients
10/03/2000US6127207 Semiconductor integrated circuit and fabrication method therefor
10/03/2000US6127206 Semiconductor device substrate, lead frame, semiconductor device and method of making the same, circuit board, and electronic apparatus
10/03/2000US6127099 Method of producing a semiconductor device
10/03/2000US6127070 Thin resist with nitride hard mask for via etch application
10/03/2000US6127040 Electroceramic component and method of manufacture thereof
10/03/2000US6127038 Printed circuit board coating and method
10/03/2000US6126989 Copper electroless deposition on a titanium-containing surface
10/03/2000US6126885 Adhering sealing sheet to lead frame by vacuum suction; encapsulation with molding compound; filling concave portions
10/03/2000US6126761 Process of controlling grain growth in metal films
10/03/2000US6126428 Vacuum dispense apparatus for dispensing an encapsulant
10/03/2000US6125924 Heat-dissipating device
10/03/2000US6125921 Radiator
10/03/2000US6125920 Fan with heat sink using stamped heat sink fins
10/03/2000US6125650 Sorber having a cooling mechanism
09/2000
09/30/2000CA2303019A1 Semiconductor device manufacturing method of accurately performing alignment of patterning, and mask for exposure
09/28/2000WO2000057474A1 Multi-chip module
09/28/2000WO2000057473A1 Component and method for producing said component
09/28/2000WO2000057472A1 Method of connecting a connecting wire to a contact of an integrated circuit
09/28/2000WO2000057471A1 Heat pipe cooling device and power converting device
09/28/2000WO2000057468A2 Electric circuit and its method of production
09/28/2000WO2000057467A1 Method for making integrated circuit chips
09/28/2000WO2000057466A1 Lead frame moisture barrier for molded plastic electronic packages
09/28/2000WO2000057465A1 Method for mounting and electrically contacting a power semiconductor component and electrical unit produced accordingly
09/28/2000WO2000057463A1 Heat treating method for thin film and forming method for thin film
09/28/2000WO2000057462A1 Semiconductor device and its production method
09/28/2000WO2000057458A1 Method of manufacturing semiconductor device and semiconductor device manufactured by it
09/28/2000WO2000057454A2 Improved integrated oscillators and tuning circuits
09/28/2000WO2000056799A1 Reworkable thermosetting resin compositions
09/28/2000WO2000042636A3 Micromachined device and method of forming the micromachined device
09/28/2000DE19932442A1 Semiconductor component comprises a chip, a substrate and heat conducting media, embedded in a molded material
09/28/2000DE19912240A1 Bauelement und Verfahren zur Herstellung des Bauelementes Device and process for the preparation of the component
09/28/2000DE19910418A1 Bondverbindung zwischen zwei Substraten Bond between two substrates
09/28/2000CA2331790A1 Reworkable thermosetting resin compositions
09/27/2000EP1039557A1 Silicon based conductive material and process for production thereof
09/27/2000EP1039556A1 Thermoelectric transducing material and method of producing the same
09/27/2000EP1039545A2 Semiconductor device
09/27/2000EP1039544A1 Monolithic integrated circuit comprising an inductor and a method of fabricating the same
09/27/2000EP1039543A2 Circuit chip connector and method of connecting a circuit chip
09/27/2000EP1039541A1 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
09/27/2000EP1039540A1 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
09/27/2000EP1039539A2 Ceramic circuit board
09/27/2000EP1039538A1 Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
09/27/2000EP1039537A2 Heat conductive resin substrate and semiconductor package
09/27/2000EP1039531A2 Interconnection in semiconductor device and method of manufacturing the same
09/27/2000EP1039527A2 Semiconductor device mounting structure
09/27/2000EP1039526A2 Method and article for attaching high-operating-temperature electronic component
09/27/2000EP1039524A2 Silicon nitride composite HDP/CVD process
09/27/2000EP1039523A2 Method and apparatus for forming an interlayer insulating film, and semiconductor device
09/27/2000EP1039520A2 Low dielectric constant carbon-containing silicon oxide dielectric material for use in integrated circuit structures
09/27/2000EP1039519A2 Method and apparatus for forming a porous SiO2 interlayer insulating film
09/27/2000EP1038853A2 Ceramic sinter and wear resistant member and electronic member using thereof
09/27/2000EP1038422A2 Process and apparatus for manufacturing semiconductor devices
09/27/2000EP1038420A1 Method for making circuit elements for a z-axis interconnect
09/27/2000EP1038318A1 Integrated circuit having a level of metallization of variable thickness
09/27/2000EP1038317A1 Integrated circuit header assembly and method for making same
09/27/2000EP1038313A1 Method and apparatuses for making z-axis electrical connections
09/27/2000EP1038312A1 Assembly for and method of packaging integrated display devices
09/27/2000EP0807189B1 Hard disk drive components and methods of making same
09/27/2000CN1268282A Flexible circuits and carriers and process for manufacture
09/27/2000CN1268246A Resin molded type semiconductor device and a method of manufacturing the same
09/27/2000CN1268245A A system and method for packaging integrated circuits
09/27/2000CN1267912A Semi-conductor and its producing method
09/27/2000CN1267911A Double-field effect transistor chip and method for fixing the same chip
09/27/2000CN1267910A Ball grid array package capable of relieving stress
09/27/2000CN1267908A Upside down mounting chip package with optimization adhesiveness of sealant and producing method thereof
09/27/2000CN1267891A Conducting and resistance material with electrical stability using for electronic equipment
09/26/2000US6125043 Circuit board arrangement with accurately positioned components mounted thereon
09/26/2000US6125042 Ball grid array semiconductor package having improved EMI characteristics
09/26/2000US6125039 Hybrid module
09/26/2000US6125038 Heat sink for auxiliary circuit board
09/26/2000US6125037 Self-locking heat sink assembly and method
09/26/2000US6125036 Moisture barrier seals for cooled IC chip module assemblies
09/26/2000US6125026 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components
09/26/2000US6124643 Device assembly facilitating gap filling between spaced layers of semiconductor substrates
09/26/2000US6124642 Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same
09/26/2000US6124641 Semiconductor device organic insulator film
09/26/2000US6124639 Flat interface for a metal-silicon contact barrier film
09/26/2000US6124637 Carrier strip and molded flex circuit ball grid array and method of making
09/26/2000US6124636 MMIC package
09/26/2000US6124635 Functionally gradient integrated metal-ceramic member and semiconductor circuit substrate application thereof
09/26/2000US6124634 Micromachined chip scale package
09/26/2000US6124633 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
09/26/2000US6124630 Multi-layer lead frame for a semiconductor device
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