Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2000
10/10/2000US6130459 Over-voltage protection device for integrated circuits
10/10/2000US6130450 Stacked capacitor-type semiconductor storage device and manufacturing method thereof
10/10/2000US6130447 Integrated circuit memories and power distribution methods including at least two control lines between adjacent power lines
10/10/2000US6130442 Memory chip containing a non-volatile memory register for permanently storing information about the quality of the device and test method therefor
10/10/2000US6130428 Laser fault correction of semiconductor devices
10/10/2000US6130383 Solder ball array package and a method of encapsulation
10/10/2000US6130379 Photoelectric conversion element having light receiving face provided with transparent conductive layer, light receiving face being covered by transparent layer formed of resin obtained by crosslinking acrylic resin and inorganic polymer
10/10/2000US6130173 Reticle based skew lots
10/10/2000US6130171 Residue removal process for forming inter-level insulating layer of paraylene polymer without peeling
10/10/2000US6130162 Method of preparing passivated copper line and device manufactured thereby
10/10/2000US6130158 Filling connection hole with wiring material by using centrifugal force
10/10/2000US6130156 Patterned metal interconnect on a first level which is to be connected to a second level of metal interconnect.
10/10/2000US6130154 Satisfactory bonding avility of a plasma siof oxide layer on a wiring
10/10/2000US6130153 Interconnection fabrication method for semiconductor device
10/10/2000US6130151 Method of manufacturing air gap in multilevel interconnection
10/10/2000US6130148 Interconnect for semiconductor components and method of fabrication
10/10/2000US6130144 Method for making very shallow junctions in silicon devices
10/10/2000US6130141 Flip chip metallization
10/10/2000US6130139 Method of manufacturing trench-isolated semiconductor device
10/10/2000US6130138 Methods of forming integrated circuit capacitors having doped dielectric regions therein
10/10/2000US6130116 Method of encapsulating a microelectronic assembly utilizing a barrier
10/10/2000US6130115 Plastic encapsulated semiconductor device and method of manufacturing the same
10/10/2000US6130114 Semiconductor device
10/10/2000US6130113 Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process
10/10/2000US6130112 Semiconductor device
10/10/2000US6130111 Packaged semiconductor device and method of manufacturing the same
10/10/2000US6130110 Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, and method of making the same, mounted board, and electronic device
10/10/2000US6130027 Process for producing lead frames
10/10/2000US6130015 Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit
10/10/2000US6129993 A multilayer sheet comprises high-thermal-conductivity layers made of a copper-base metal, low-thermal-expansion layers made of an iron-nickel-base alloy, each layer with a plurality of holes filled with copper alloy
10/10/2000US6129955 Applying a coating of epxoy resin, photoinitiator, and dispersed silica over the solder joint, photocuring the epoxy resin to reinforce the solder joint
10/10/2000US6129559 Microconnector and method of manufacturing the same
10/10/2000US6129145 Heat dissipator including coolant passage and method of fabricating the same
10/10/2000US6129039 Apparatus for applying atomized adhesive to a leadframe for chip bonding
10/10/2000CA2138218C Process for delaminating organic resin from board and process for manufacturing organic resin multi-layer wiring board
10/09/2000CA2300704A1 Layered capacitor device
10/05/2000WO2000059050A1 Method of manufacturing semiconductor device, semicondutor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
10/05/2000WO2000059036A1 Semiconductor module and method of mounting
10/05/2000WO2000059034A1 A cooling unit for an integrated circuit package
10/05/2000WO2000059033A1 Wiring board, connection board, semiconductor device, method of manufacture thereof, circuit board, and electronic device
10/05/2000WO2000059029A2 Method and apparatus for enabling conventional wire bonding to copper-based bond pad features
10/05/2000WO2000058683A1 Thermally conductive material and method of using the same
10/05/2000DE19959938A1 Semiconductor device manufacturing method for e.g. GaAs FET involves sticking chips to substrate, sticking lid to substrate and separating chips along adjoining areas
10/05/2000DE19915245A1 Electronic component with strip conductor, e.g. coil or coupler for high frequency application and high speed digital circuits, is produced by conductive layer deposition on metal base layer regions exposed by structured photolacquer layer
10/05/2000DE19914815A1 Halbleitermodul Semiconductor module
10/05/2000DE19910500A1 Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board
10/05/2000DE10014625A1 Method for cooling transistor switch elements uses an insulated liquid medium with a boiling point lower than the maximum permitted temperature of the element.
10/05/2000DE10013255A1 Electronic component, e.g. an automobile electronic ignition module, comprises a filled resin housing encapsulating a hybrid integrated circuit substrate and a tin-antimony soldered power semiconductor on a heat sink
10/05/2000DE10013189A1 Substrate for a power semiconductor module in an electric vehicle has a buffer layer of intermediate thermal expansion coefficient interposed between an insulating substrate and a heat sink
10/04/2000EP1041644A2 Transparent and conductive zinc oxide film with low growth temperature
10/04/2000EP1041633A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
10/04/2000EP1041632A1 A compensation structure for a bond wire at high frequency operation
10/04/2000EP1041631A2 Capacitor-built-in-type printed wiring substrate, printed wiring substrate, and capacitor
10/04/2000EP1041630A2 Method of accurately performing alignment of patterning in the manufaturing of a semiconductor device, and mask for exposure
10/04/2000EP1041629A1 Manufacturing of cavity fuses on gate conductor level
10/04/2000EP1041628A2 An image sensor ball grid array package and the fabrication thereof
10/04/2000EP1041627A2 Heat conductive molded body and manufacturing method thereof and semiconductor device
10/04/2000EP1041626A2 Semiconductor Module
10/04/2000EP1041625A1 Electrical or electronic device in a sealed package and its method of manufacture
10/04/2000EP1041624A1 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multilayer thin film device
10/04/2000EP1041618A1 Semiconductor device and manufacturing method thereof, circuit board and electronic equipment
10/04/2000EP1041617A1 Semiconductor device and method of production thereof and semiconductor mounting structure and method
10/04/2000EP1041616A1 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/04/2000EP1041614A1 Plasma cleaning process for openings formed in one or more low dielectric constant insulation layers over copper metallization integrated circuit structures
10/04/2000EP1040736A1 Synthetic jet actuators for cooling heated bodies and environments
10/04/2000EP1040554A1 Miniature power supply
10/04/2000EP1040521A2 Silicon oxide insulator (soi) semiconductor having selectively linked body
10/04/2000EP1040520A1 Demountable, compliant area array interconnect
10/04/2000EP1040519A1 Plastic composite body
10/04/2000EP1040513A1 High integrity borderless vias with hsq gap filled patterned conductive layers
10/04/2000EP1025587A4 Semiconductor flip-chip package and method for the fabrication thereof
10/04/2000CN1269120A Method for heating printed circuit board, and printed circuit board comprising a heating element
10/04/2000CN1269006A Torsion bar clamp apparatus and method for improving thermal and mechanical contact between stacked electronic components
10/04/2000CN1268769A Substrate element and soft substrate
10/04/2000CN1057188C Radiating structure and method for mfg. same
10/03/2000USRE36894 Semiconductor package with high density I/O lead connection
10/03/2000USRE36893 Anti-fuse structure for reducing contamination of the anti-fuse material
10/03/2000US6128210 Semiconductor memory device
10/03/2000US6128201 Three dimensional mounting assembly for integrated circuits
10/03/2000US6128191 Heat sink with integral self-locking clamp
10/03/2000US6128190 Electronic assembly
10/03/2000US6128189 Device for withdrawal of thermal power loss of electronic or electrical components
10/03/2000US6128188 Self-balancing thermal control device for integrated circuits
10/03/2000US6128171 Gate-coupled structure for enhanced ESD input/output pad protection in CMOS ICs
10/03/2000US6128063 Liquid crystal display apparatus having multi-layer substrate
10/03/2000US6127894 High frequency shunt feedback amplifier topology
10/03/2000US6127883 Semiconductor device capable of mirror-symmetrically inverting input/output pin-signal allocation
10/03/2000US6127851 Circuit and method for differentiating multiple modules
10/03/2000US6127736 Microbump interconnect for semiconductor dice
10/03/2000US6127734 Semiconductor device comprising a contact hole of varying width thru multiple insulating layers
10/03/2000US6127733 Check pattern for via-hole opening examination
10/03/2000US6127732 Semiconductor device having high aspect ratio contacts
10/03/2000US6127731 Capped solder bumps which form an interconnection with a tailored reflow melting point
10/03/2000US6127730 Composite metal films for severe topology interconnects
10/03/2000US6127729 Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection
10/03/2000US6127728 Single reference plane plastic ball grid array package
10/03/2000US6127727 Semiconductor substrate subassembly with alignment and stress relief features
10/03/2000US6127725 Thin film electronics on insulator on metal
10/03/2000US6127724 Packaged microelectronic elements with enhanced thermal conduction
10/03/2000US6127721 Soft passivation layer in semiconductor fabrication
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