Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2013
11/05/2013US8575734 Lead frame
11/05/2013US8575733 Semiconductor device
11/05/2013US8575732 Leadframe based multi terminal IC package
11/05/2013US8575731 Semiconductor device with a balun
11/05/2013US8575730 Semiconductor device
11/05/2013US8575726 Semiconductor device and method of manufacturing the same
11/05/2013US8575724 Semiconductor device having under-filled die in a die stack
11/05/2013US8575723 Detection circuit and method for detecting damage to a semiconductor chip
11/05/2013US8575721 Semiconductor device
11/05/2013US8575719 Silicon nitride antifuse for use in diode-antifuse memory arrays
11/05/2013US8575718 Programmable electrical fuse
11/05/2013US8575700 Charge-balance power device comprising columnar structures and having reduced resistance
11/05/2013US8575694 Insulated gate bipolar transistor structure having low substrate leakage
11/05/2013US8575673 Electrically erasable programmable memory and its manufacturing method
11/05/2013US8575657 Direct growth of diamond in backside vias for GaN HEMT devices
11/05/2013US8575649 Donor substrate and method of fabricating organic light emitting diode using the same
11/05/2013US8575585 Memristive device
11/05/2013US8575499 Seal structure
11/05/2013US8575051 Heat sink having a high thermal conductivity
11/05/2013US8575019 Metal interconnection structure and method for forming metal interlayer via and metal interconnection line
11/05/2013US8574961 Method of marking a low profile packaged semiconductor device
11/05/2013US8574959 Semiconductor device and method of forming bump-on-lead interconnection
11/05/2013CA2796155C High density gallium nitride devices using island topology
11/05/2013CA2652218C Led work light
10/2013
10/31/2013WO2013163416A1 Coefficient of thermal expansion compensating compliant component
10/31/2013WO2013163177A1 Thermal management floorplan for a multi-tier stacked ic package
10/31/2013WO2013163166A1 Thermal management of integrated circuits using phase change material and heat spreaders
10/31/2013WO2013163125A1 Method for creating asperities in metal for metal-to-metal bonding
10/31/2013WO2013163065A1 Metal-insulator-metal capacitors on glass substrates
10/31/2013WO2013162519A1 Suspended inductor microelectronic structures
10/31/2013WO2013162173A1 Integrated circuit device packages and methods for manufacturing integrated circuit device packages
10/31/2013WO2013161695A1 Package for housing electronic component and electronic device
10/31/2013WO2013161660A1 Package for housing semiconductor element, and semiconductor device
10/31/2013WO2013161554A1 Crystal oscillation device and method for manufacturing same
10/31/2013WO2013161527A1 Multilayer wiring substrate and manufacturing method thereof
10/31/2013WO2013161322A1 Cooler, electrical component unit, and refrigeration device
10/31/2013WO2013161217A1 Optical module
10/31/2013WO2013160976A1 Semiconductor device and method for manufacturing same
10/31/2013WO2013160788A1 Integrated electronics module with cooling structure
10/31/2013WO2013160032A1 Method for establishing the originality of a component
10/31/2013WO2013159867A1 Production of a portable data storage medium
10/31/2013WO2013159612A1 Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
10/31/2013WO2013159307A1 Semiconductor device including electromagnetic absorption and shielding
10/31/2013WO2013052372A3 Stub minimization for multi-die wirebond assemblies with parallel windows
10/31/2013WO2013052324A3 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
10/31/2013US20130289477 Analyte Monitoring Device and Methods of Use
10/31/2013US20130289225 Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same
10/31/2013US20130289211 Cross-linked polymer particle for epoxy resin, epoxy resin composition, and epoxy cured material
10/31/2013US20130289166 Resin composition and semiconductor device
10/31/2013US20130288476 Electrochemical etching of semiconductors
10/31/2013US20130288475 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
10/31/2013US20130288473 Electrical Connection Structure
10/31/2013US20130287989 Glass member provided with sealing material layer electronic device using it and process for producing the electronic device
10/31/2013US20130286735 Vertical structure semiconductor memory devices and methods of manufacturing the same
10/31/2013US20130286621 Pb-FREE SOLDER-CONNECTED STRUCTURE
10/31/2013US20130286620 Package with Integrated Pre-Match Circuit and Harmonic Suppression
10/31/2013US20130286617 Circuit device
10/31/2013US20130286615 Printed circuit board and method of manufacturing printed circuit board
10/31/2013US20130286519 Electro-static discharge power supply clamp with disablement latch
10/31/2013US20130285709 Semiconductor integrated circuit having array e-fuse and driving method thereof
10/31/2013US20130285694 Through-silicon-via with sacrificial dielectric line
10/31/2013US20130285264 Wafer assembly with carrier wafer
10/31/2013US20130285263 Sensor array package
10/31/2013US20130285262 Dicing tape-integrated wafer back surface protective film
10/31/2013US20130285259 Method and system for wafer and strip level batch die attach assembly
10/31/2013US20130285258 Semiconductor device having mesh-pattern wirings
10/31/2013US20130285257 3d interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
10/31/2013US20130285256 Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
10/31/2013US20130285254 Wiring substrate and method for manufacturing wiring subtrate
10/31/2013US20130285253 Semiconductor device and method of manufacturing the same
10/31/2013US20130285252 Package carrier
10/31/2013US20130285251 Elongated via structures
10/31/2013US20130285250 Semiconductor device
10/31/2013US20130285249 Semiconductor device and method of packaging a semiconductor device with a clip
10/31/2013US20130285248 Package Structure and Substrate Bonding Method
10/31/2013US20130285247 Semiconductor device and production method of the same
10/31/2013US20130285246 Semiconductor Device With Self-Aligned Interconnects and Blocking Portions
10/31/2013US20130285245 Microstructure modification in copper interconnect structures
10/31/2013US20130285244 Through Silicon Via with Embedded Barrier Pad
10/31/2013US20130285243 Easily assembled chip assembly and chip assembling method
10/31/2013US20130285242 Pin grid interposer
10/31/2013US20130285241 Apparatus For Dicing Interposer Assembly
10/31/2013US20130285240 Sensor array package
10/31/2013US20130285239 Chip assembly and chip assembling method
10/31/2013US20130285238 Stud bump structure for semiconductor package assemblies
10/31/2013US20130285237 Low Profile Interposer with Stud Structure
10/31/2013US20130285236 Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier
10/31/2013US20130285235 Semiconductor device
10/31/2013US20130285234 Power Module with Directly Attached Thermally Conductive Structures
10/31/2013US20130285233 Thermal management of integrated circuits using phase change material and heat spreaders
10/31/2013US20130285232 Semiconductor package module
10/31/2013US20130285231 Semiconductor device and method for manufacturing semiconductor device
10/31/2013US20130285230 Electronic device
10/31/2013US20130285229 Through-hole electronic device with double heat-sink
10/31/2013US20130285228 Glass Frit Wafer Bond Protective Structure
10/31/2013US20130285227 Leadframe, semiconductor device, and method of manufacturing the same
10/31/2013US20130285226 Systems and methods for lead frame locking design features
10/31/2013US20130285225 Semiconductor device and measurement device
10/31/2013US20130285224 Semiconductor device and measurement device
10/31/2013US20130285223 Method for manufacturing electronic devices
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