Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2000
10/17/2000US6133175 A ceramic material consisting of glass and a modifier seelcted from titanium oxide, strontium titinate or calcium titinate, atlest a high q (small loss tangent) values alkaline-earth metal oxide-aluminosilicate and high q alumina
10/17/2000US6133163 Improving surface adhesion between coating layers by treating with plasma a heat-cured spun-on-glass (sog) coating prior to applying second coating
10/17/2000US6133141 Methods of forming electrical connections between conductive layers
10/17/2000US6133139 Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof
10/17/2000US6133138 Method of manufacturing semiconductor device having multilayer interconnection structure
10/17/2000US6133137 Semiconductor device and method of manufacturing the same
10/17/2000US6133136 Robust interconnect structure
10/17/2000US6133134 Ball grid array integrated circuit package
10/17/2000US6133111 Method of making photo alignment structure
10/17/2000US6133079 Method for reducing substrate capacitive coupling of a thin film inductor by reverse P/N junctions
10/17/2000US6133072 Microelectronic connector with planar elastomer sockets
10/17/2000US6133071 Semiconductor device with plate heat sink free from cracks due to thermal stress and process for assembling it with package
10/17/2000US6133070 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
10/17/2000US6133069 Method of manufacturing the electronic using the anode junction method
10/17/2000US6133068 Increasing the gap between a lead frame and a semiconductor die
10/17/2000US6133067 Architecture for dual-chip integrated circuit package and method of manufacturing the same
10/17/2000US6133066 Semiconductor element mounting method
10/17/2000US6133065 Multi-chip module employing carrier substrate with micromachined alignment structures and method of forming
10/17/2000US6133064 Flip chip ball grid array package with laminated substrate
10/17/2000US6133055 Method of forming a test key architecture
10/17/2000US6132910 Method of implementing electron beam lithography using uniquely positioned alignment marks and a wafer with such alignment marks
10/17/2000US6132865 Adhesive tape for electronic parts
10/17/2000US6132853 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
10/17/2000US6132823 Can be applied to conduit and then heat polarized to form superconducting heat transfer device that transfers heat without any net heat loss or to pair of plates having small cavity relative to large surface area to form heat sink
10/17/2000US6132798 Positioning semiconductor device component within target area; directing spray of adhesive perpendicular to first direction; providing negative pressure below target area; conveying spray of adhesive toward target area
10/17/2000US6132676 Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
10/17/2000US6132646 Electroconductive ink and curing adhesive with flux and metals
10/17/2000US6132644 Electroconductive material with acid groups
10/17/2000US6132543 Method of manufacturing a packaging substrate
10/17/2000US6132529 Leadframe made of a high-strength, high-electroconductivity copper alloy
10/17/2000US6131651 Flexible heat transfer device and method
10/17/2000US6131650 Fluid cooled single phase heat sink
10/17/2000US6131646 Heat conductive interface material
10/17/2000US6131278 Metal substrate having an IC chip and carrier mounting
10/17/2000US6131255 Repairable wafer scale integration system
10/17/2000CA2200154C Lsi package and manufacturing method thereof
10/17/2000CA2009518C Spin-on glass processing technique for the fabrication of semiconductor device
10/12/2000WO2000060914A1 Sealed liquid-filled module and method of forming same
10/12/2000WO2000060664A1 Advanced hybrid power amplifier design
10/12/2000WO2000060663A1 Integrated circuit with a protective layer of diamond-like amorphous carbon
10/12/2000WO2000060662A1 Method of producing a device for electrically connecting a semiconductor component to a mounting surface, and corresponding device
10/12/2000WO2000060656A1 Method for producing portable electronic devices having an integrated circuit which is protected by a pulverized film
10/12/2000WO2000060613A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate
10/12/2000DE19922558A1 Semiconductor element contact terminal formation method
10/12/2000DE19916061A1 Siliciumformteile mit zeitlich stabiler elektronischer Oberflächenpassivierung Silicon moldings are stable over time electronic surface passivation
10/12/2000DE19914741A1 Power semiconductor module has several external elements control connections connected with the internal wall of housing and also electrically connected with frame
10/12/2000DE19912443A1 Verfahren zur Montage und elektrischen Kontaktierung eines Leistungshalbleiterbauelements und danach hergestellte elektrische Baueinheit Method for mounting and electrical contact with a power semiconductor device and electrical assembly produced thereby
10/12/2000DE19911475A1 Gehäuse für elektronische Schaltungen Housing for electronic circuits
10/12/2000DE10016064A1 Combined substrate for production of single substrate has oblong single substrate formed with bore with first and second single substrates being adjacent and having common front part area of wide part
10/12/2000DE10009733A1 Semiconductor device including several semiconductor chips has second semiconductor chip and multilayered printed circuit board connected electrically and sealed by resin to fill out gap between them
10/11/2000EP1043921A1 Multilayer printed wiring board and method for manufacturing the same
10/11/2000EP1043774A1 Semiconductor integrated circuit
10/11/2000EP1043773A1 Semiconductor device
10/11/2000EP1043772A2 Method for packaging and mounting semiconductor device and device obtained thereby
10/11/2000EP1043771A2 Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same
10/11/2000EP1043767A1 Semiconductor device, method of manufacture thereof, circuit board and electronic device
10/11/2000EP1043740A1 Layered capacitor device
10/11/2000EP1043591A2 Power semiconductor module
10/11/2000EP1042946A2 Hybrid circuit with a heat dissipation system
10/11/2000EP1042945A1 Molded electronic package, method of preparation and method of shielding
10/11/2000EP1042812A2 Semiconductor substrate with embedded isolating layer for integrated circuits
10/11/2000EP1042807A2 Semiconductor device
10/11/2000EP1042806A1 A tailored barrier layer which provides improved copper interconnect electromigration resistance
10/11/2000EP1042802A1 Semiconductor processing method comprising the fabrication of a barrier layer
10/11/2000EP1042801A1 Method of selectively forming silicide
10/11/2000EP1042793A1 Barrier layer for copper metallizing
10/11/2000EP1042534A1 Metal surface coating, especially for micro electronics
10/11/2000EP1042389A1 Process for producing an absorber material
10/11/2000EP0808459B1 Top load socket for ball grid array devices
10/11/2000EP0598914B1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
10/11/2000CN2400902Y Fastener for combined chip and radiating fin
10/11/2000CN2400901Y Radiating fin for electronic element
10/11/2000CN2400900Y Mould of semiconductor
10/11/2000CN1269636A Master slice and substrate element and producing method therefor
10/11/2000CN1269607A Semiconductor device and producing method thereof
10/11/2000CN1269606A Method for improving copper adhesion
10/11/2000CN1269605A Electronic element and producing method thereof
10/11/2000CN1269604A Electronic element and producing method thereof
10/11/2000CN1269536A Manufacture of radiator
10/11/2000CN1057424C Microchannel cooling heat sink
10/11/2000CN1057423C General lead working machine
10/11/2000CN1057403C Integrated circuit assembling and disassembling device and assembling and disassembling head
10/11/2000CN1057402C Method for packing semiconductor
10/10/2000USRE36907 Leadframe with power and ground planes
10/10/2000US6130821 Multi-chip assembly having a heat sink and method thereof
10/10/2000US6130820 Memory card cooling device
10/10/2000US6130571 Semiconductor device with fine-adjustable resistance
10/10/2000US6130484 Semiconductor device
10/10/2000US6130483 MMIC module using flip-chip mounting
10/10/2000US6130482 Semiconductor device and method for fabricating the same
10/10/2000US6130481 Semiconductor integrated circuit interconnection structures and method of making the interconnection structures
10/10/2000US6130478 Polymer stud grid array for microwave circuit arrangements
10/10/2000US6130477 Thin enhanced TAB BGA package having improved heat dissipation
10/10/2000US6130476 Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion
10/10/2000US6130474 Leads under chip IC package
10/10/2000US6130473 Lead frame chip scale package
10/10/2000US6130472 Moisture and ion barrier for protection of devices and interconnect structures
10/10/2000US6130469 Electrically alterable antifuse using FET
10/10/2000US6130468 Fuse, memory incorporating same and method
10/10/2000US6130460 Interconnect track connecting, on several metallization levels, an insulated gate of a transistor to a discharge diode within an integrated circuit, and process for producing such a track
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