Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2000
10/24/2000US6137170 Mount for semiconductor device
10/24/2000US6137168 Semiconductor package with traces routed underneath a die
10/24/2000US6137166 Semiconductor device
10/24/2000US6137165 Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET
10/24/2000US6137164 Thin stacked integrated circuit device
10/24/2000US6137163 Semiconductor substrate and stackable semiconductor package and fabrication method thereof
10/24/2000US6137162 Chip stack package
10/24/2000US6137161 Interposer array module for capacitive decoupling and filtering
10/24/2000US6137160 Lead frame for semiconductor devices
10/24/2000US6137159 Lead on chip semiconductor device and method of fabricating the same
10/24/2000US6137155 Planar guard ring
10/24/2000US6137138 MOSFET power transistor having offset gate and drain pads to reduce capacitance
10/24/2000US6137125 Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
10/24/2000US6137124 Integrated vertical semiconductor component
10/24/2000US6137062 Ball grid array with recessed solder balls
10/24/2000US6136708 Preventing the diffusion of contaminants by forming a barrier film on a back surface of a semiconductor substrate; significant reduction in production steps
10/24/2000US6136701 Contact structure for semiconductor device and the manufacturing method thereof
10/24/2000US6136700 Selectively etching portions of an insulating layer formed overlying the stopping layer to form a contact region
10/24/2000US6136698 Method of increasing contact area of a contact window
10/24/2000US6136696 Method of forming a semiconductor device with a conductor plug including five dielectric layers, the fourth dielectric layer forming sidewall spacers
10/24/2000US6136692 Reducing contact resistance between the titanium nitride plug and the polysilicon electrode
10/24/2000US6136689 Method of forming a micro solder ball for use in C4 bonding process
10/24/2000US6136683 Semiconductor device and method for production thereof
10/24/2000US6136682 Method for forming a conductive structure having a composite or amorphous barrier layer
10/24/2000US6136681 Tool used in forming a chip scale package
10/24/2000US6136668 Method of dicing semiconductor wafer
10/24/2000US6136662 Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same
10/24/2000US6136658 Method of fabricating a semiconductor device including a contact hole between gate electrode structures
10/24/2000US6136655 Method of making low voltage active body semiconductor device
10/24/2000US6136633 Trench-free buried contact for locos isolation
10/24/2000US6136620 Method of manufacture for an integrated circuit having a BIST circuit and bond pads incorporated therein
10/24/2000US6136613 Method for recycling monitoring control wafers
10/24/2000US6136458 Ferrite magnetic film structure having magnetic anisotropy
10/24/2000US6136419 Ceramic substrate having a sealed layer
10/24/2000US6136128 Method of making an adhesive preform lid for electronic devices
10/24/2000US6136095 Apparatus for filling apertures in a film layer on a semiconductor substrate
10/24/2000US6135200 Heat generating element cooling unit with louvers
10/24/2000US6134783 Heat sink and process of manufacture
10/24/2000US6134776 Heatsink and package structure for wirebond chip rework and replacement
10/23/2000CA2305954A1 Package for high-frequency device
10/19/2000WO2000062419A2 Mos variable gain amplifier
10/19/2000WO2000062365A1 Functionally improved battery and method of making same
10/19/2000WO2000062342A1 Thin film capacitor element
10/19/2000WO2000062341A1 Lead frame for semiconductor device
10/19/2000WO2000062340A1 Cantilevered clamp for securing electronic components to a base plate
10/19/2000WO2000062338A1 Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like
10/19/2000WO2000062337A1 Metal core substrate printed wiring board enabling thermally enhanced ball grid array (bga) packages and method
10/19/2000WO2000062126A1 Method and apparatus for monitoring electrostatic discharge effects
10/19/2000WO2000061834A1 Low dielectric mano-porous material obtainable from polymer decomposition
10/19/2000WO2000061520A1 Silicon moulded parts with electronic surface passivation that is stable over time
10/19/2000WO2000036893A3 Method of applying a phase change thermal interface material
10/19/2000WO2000026942A9 Method for producing filled vias in electronic components
10/19/2000DE19922186C1 IC chip with alternate wiring modes
10/19/2000DE19917438A1 Circuit arrangement for e.g. image sensor comprises carrier plate with contacts connected to image sensor via flip-chip mounting
10/19/2000DE19914497A1 Heat-removal metal base arrangement for circuit board especially ceramic substrate
10/19/2000CA2366540A1 Functionally improved battery and method of making same
10/18/2000EP1045443A2 Semiconductor device and manufacturing method thereof
10/18/2000EP1045442A2 Semiconductor integrated circuit
10/18/2000EP1045441A2 Slotted contacts for minimizing the voltage required to electrically blow fuses
10/18/2000EP1045437A2 Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
10/18/2000EP1045303A1 Improved structure computer central processing unit heat dissipater
10/18/2000EP1044473A1 Low-inductance, gate-controlled thyristor
10/18/2000EP1044472A1 Multi-chip module having interconnect dies
10/18/2000CN1270702A Semiconductor module and power converter comprising IT
10/18/2000CN1270418A Semiconductor device and manufacture thereof
10/18/2000CN1270417A Semiconductor device and manufacture thereof
10/18/2000CN1270416A Manufacture of semiconductor device
10/18/2000CN1270413A Method for forming copper wires in semiconductor device
10/18/2000CN1057659C Multilayered metallic printed board and molded module
10/18/2000CN1057485C Method of spliting ceramic substrate and spliting device
10/17/2000US6134700 Leadframe tip arrangement designing method
10/17/2000US6134118 Conductive epoxy flip-chip package and method
10/17/2000US6134112 Heat sink attachment
10/17/2000US6134111 Vertical surface mount apparatus with thermal carrier
10/17/2000US6134110 Cooling system for power amplifier and communication system employing the same
10/17/2000US6134108 Apparatus and method for air-cooling an electronic assembly
10/17/2000US6134106 Winding chain dissipating unit suitable for electronic device
10/17/2000US6133978 Tape carrier package and liquid crystal display device
10/17/2000US6133746 Method for determining a reliable oxide thickness
10/17/2000US6133641 Semiconductor substrate and method of manufacturing semiconductor device
10/17/2000US6133639 Compliant interface for semiconductor chip and method therefor
10/17/2000US6133638 Die-to-insert permanent connection and method of forming
10/17/2000US6133637 Semiconductor device having a plurality of semiconductor chips
10/17/2000US6133636 Tantalum-aluminum-nitrogen material for semiconductor devices
10/17/2000US6133635 Process for making self-aligned conductive via structures
10/17/2000US6133634 High performance flip chip package
10/17/2000US6133633 Method for building interconnect structures by injection molded solder and structures built
10/17/2000US6133632 Commonly housed diverse semiconductor die
10/17/2000US6133631 Semiconductor package lid with internal heat pipe
10/17/2000US6133630 Condensed memory matrix
10/17/2000US6133629 Multi-chip module package
10/17/2000US6133628 Metal layer interconnects with improved performance characteristics
10/17/2000US6133627 Semiconductor chip package with center contacts
10/17/2000US6133625 Semiconductor device and method for manufacturing the same
10/17/2000US6133624 Semiconductor device utilizing a lead on chip structure
10/17/2000US6133623 Resin sealing type semiconductor device that includes a plurality of leads and method of making the same
10/17/2000US6133622 High speed IC package configuration
10/17/2000US6133621 Integrated shielded electric connection
10/17/2000US6133535 Electronic component having calcined electrode
10/17/2000US6133525 Miniature low cost modular assembly package and method of assembly
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